Patents for C08L 79 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups (12,755) |
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12/10/2002 | US6492463 Liquid crystalline polymer composition |
12/10/2002 | US6492443 Norbornene polymer composition |
12/10/2002 | US6492200 Semiconductor chip package and fabrication method thereof |
12/05/2002 | WO2002097829A1 Charge-dissipating, white thermal control film, and structures utilizing the thermal control film |
12/05/2002 | WO2002096991A1 Resin composition for optical parts and optical parts |
12/05/2002 | US20020183425 Polymer composition |
12/03/2002 | US6489386 Method and composition for improving gas barrier properties of polymeric containers and films |
12/03/2002 | US6489020 Polyanaline and carbon black filled polyimide intermediate transfer components |
12/03/2002 | US6489013 Polyamideimide with siloxane bonds, high molecular weight acrylic polymer, thermoset resin and solvent; low thermal stress and modulus of elasticity; heat resistance |
11/28/2002 | US20020177639 Polysulfone or polyethersulfone resin having glass transition temperature of at least 180 degrees C, a fluorinated polyolefin, and a fatty acid amide |
11/28/2002 | DE10124903A1 Thixotrope Dispersionen von Polysuccinimid und deren Anwendung Thixotropic dispersions of polysuccinimide and their uses |
11/27/2002 | EP1260539A1 Thixotrope dispersions from polysuccinimide and their use |
11/27/2002 | CN1381530A Polyphenylamine composition with clay ore as carrier and its preparing process |
11/26/2002 | US6486266 Thermosetting resin composition |
11/26/2002 | US6485833 Resin-coated metal foil |
11/21/2002 | WO2002092692A1 Polyimide blends, method of making, and articles made therefrom |
11/21/2002 | WO2002092686A1 Pvc stabilisers |
11/21/2002 | US20020173580 Methods of making and using creping adhesives comprised of polyamine-epihalohydrin resin/poly(vinyl alcohol) mixtures |
11/21/2002 | US20020173568 Composition and article for reduced food adhesion |
11/20/2002 | EP1258509A1 Solventless polyimide silicone resin compositions |
11/20/2002 | EP0987946B1 Biocidal organic acid salts of a polymeric biguanide |
11/20/2002 | CN1380357A Shock-absorbing resin composition |
11/20/2002 | CN1094655C Forming polyimide coatings by screen printing method |
11/19/2002 | US6482880 Poly(biphenyl ether sulfone) resins having improved UV yellowing resistance |
11/19/2002 | US6482529 Polyamideimide prepolymer, 1 to 25 parts by wt of a trifunctional ester, 0.5 to 15 parts by wt organo-reactive silane; corrosion resistance, electroconductivity |
11/14/2002 | WO2002090450A1 Fluorine-containing resin coating compositions, primers for etfe coating, and coated articles |
11/14/2002 | WO2002090422A1 Polyimide composition having improved peel strength |
11/14/2002 | WO2002089821A1 Ophthalmic liquid preparation and liquid preparation for contact lens |
11/14/2002 | US20020167111 Biaxially oriented polyester film, and a production method thereof |
11/13/2002 | EP1005508B1 Aqueous compositions |
11/13/2002 | EP0946674B1 Composition containing liquid crystalline polymer |
11/13/2002 | CN1379800A Cyanate ester based thermoset compositions |
11/13/2002 | CN1379413A Material for forming conductive film, method of making conductive film and use thereof |
11/13/2002 | CN1094134C Electrically conductive aqueous latex of polyphnenylamine and its preparing process and application |
11/12/2002 | US6479581 Aqueous-based polyamide-amic acid compositions |
11/07/2002 | WO2002089152A1 Conductive materials with electrical stability for use in electronics devices |
11/07/2002 | WO2002088845A1 Resin composition, process for producing resin composition, and method of forming resin film |
11/05/2002 | US6475629 Adhesive film formed of a siloxane-modified polyamideimide resin composition, adhesive sheet and semiconductor device |
11/05/2002 | US6475624 Polyimide/fluororesin laminates, producing method thereof, and insulating tape for wire-winding using the same |
10/31/2002 | WO2002058758A3 Antithrombogenic polymer coating |
10/31/2002 | US20020161077 Heat-resistant composition |
10/31/2002 | US20020160271 Crosslinking polyethylenimine |
10/30/2002 | EP1252168A1 Salt of a melamine condensation product and a phosphorus-containing acid |
10/30/2002 | EP1196485A4 High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants |
10/30/2002 | CN1377286A Binding superabsorbent polymers to substrates |
10/30/2002 | CN1376768A Nano-class composite polyphenylamine/montmorillonite material as electric rheologic liquid and its preparing process |
10/24/2002 | US20020156232 Aqueous conductive dispersions of polyaniline having enhanced viscosity |
10/24/2002 | US20020156231 Used in electroluminescent devices, electro-optic devices, such as cladding film layers in an optical modulator, and photo-refractive devices |
10/24/2002 | US20020156140 Porous para-oriented aromatic polyamide film, prepreg thereof, and base substrate for printed circuit board |
10/24/2002 | US20020155304 Copper, aluminum alloy; heating, hardening thermosetting resin |
10/23/2002 | EP1250491A1 Creping adhesives |
10/23/2002 | CN1093366C Polyimidahenzoxazole dielectric film and printed wiring board(s) made from said film |
10/23/2002 | CN1093143C High-polymerized amino compound |
10/16/2002 | EP1248811A2 Carbodiimides with carboxyl or carboxylate groups |
10/16/2002 | EP0477291B1 Liquid crystal polymer film |
10/16/2002 | CN1374344A Polyester imide modified epoxy resin |
10/16/2002 | CN1092737C Multi-layer paper products |
10/16/2002 | CN1092690C Heat resistant resin composition and adhesive sheet using the same composition |
10/15/2002 | US6465827 Resin-encapsulated semiconductor apparatus and process for its fabrication |
10/15/2002 | US6465605 Antifoam agent |
10/15/2002 | US6465083 Dissolving polyphenylene ethers in solvents, heating then reacting an oxy nitrile and alcohol in the presence of polymerization catalyst to form polycyanurate interpenetrating polymer networks having heat resistance and workability |
10/10/2002 | WO2002080195A1 High conductivity polyaniline compositions and uses therefor |
10/10/2002 | US20020147277 Thermosetting resin composition and use thereof |
10/09/2002 | EP1246867A1 Liquid crystalline polymer compositions containing small particle size fillers |
10/09/2002 | EP1246862A1 Method for producing sulfonated aromatic polymers and use of the process products for producing membranes |
10/08/2002 | WO2001094492A1 Impact-resistant epoxy resin compositions |
10/08/2002 | US6461738 Heat and solvent resistance |
10/08/2002 | CA2405584A1 Impact-resistant epoxy resin compositions |
10/08/2002 | CA2252744C Plastic substrates for electronic display applications |
10/08/2002 | CA1341392C Use of inorganic-organic or organic adduct alloy polymers in the detackification of paint in a spray booth |
10/03/2002 | US20020142020 Biocidal organic acid salts of a polymeric biguanide |
10/03/2002 | US20020141784 Intermediate transfer member and method of fabricating the same |
10/02/2002 | EP1246280A2 Electrode-forming compositions and electrode members |
10/02/2002 | EP1245641A1 Sliding material |
10/02/2002 | EP1245621A1 Porous para-oriented aromatic polyamide film, prepreg thereof, and base substrate for printed circuit board |
10/02/2002 | EP1244755A2 Pressure sensitive adhesive and biomedical electrodes using same |
10/02/2002 | EP1151039B1 Novolak cyanate blends |
10/02/2002 | EP0668942B2 Fibers and films of improved flame resistance |
10/02/2002 | CN1371941A Polyester imide modified dimaleimide |
10/01/2002 | CA2223035C Vulcanizable rubber compositions |
09/30/2002 | CA2379454A1 Porous para-oriented aromatic polyamide film, prepreg thereof, and base substrate for printed circuit board |
09/26/2002 | US20020136769 Nanogel networks including polyion polymer fragments and biological agent compositions thereof |
09/25/2002 | EP1242533A1 Use of substituted polyethylenimines for the sustained improvement of the adhesive and/or coating compatibility of polyolefin-based shaped bodies, fibres and films |
09/25/2002 | EP1242531A1 Blends of high tenacity and flame resistance |
09/25/2002 | CN1091454C Thermoplastic resin molded product and method for its production |
09/19/2002 | WO2002072246A1 Functionalised polyimide moulded body and functionalised polyimide membrane |
09/19/2002 | US20020133003 Method of preparing and uses of cucurbituril devices |
09/19/2002 | US20020132932 Polyetherimide resin/polyester resin blends having improved visual clarity |
09/19/2002 | US20020132887 Composite adhesive |
09/19/2002 | US20020132133 Electroluminescent device having an organic layer including polyimide |
09/19/2002 | US20020132095 Resin composition for wiring circuit board, substrate for wiring circuit board, and wiring circuit board |
09/19/2002 | US20020130439 Finely divided material is mixed or impregnated with a heat-curable formulation and the resultant mixture is shaped by heating or sheetlike structure of fiber materials is first treated with a heat-curable formulation and then heated |
09/19/2002 | DE10111665A1 Funktionalisierte Polyimid-Formkörper und funktionalisierte Polyimid-Membran Polyimide mold functionalized and functionalized polyimide membrane |
09/18/2002 | EP1241527A1 Positive type photosensitive polyimide resin composition |
09/18/2002 | EP1241230A1 Molecular compound comprising polymer having hydrogen bond as component compound |
09/18/2002 | EP1239893A1 Binding superabsorbent polymers to substrates |
09/18/2002 | EP0794948B1 Process for the preparation of condensation products of melamine |
09/18/2002 | EP0771337B1 Liquid crystalline copoly(ester-imide)s and a process for the preparation thereof |
09/18/2002 | CN1369526A Heat resistant compsns. |
09/18/2002 | CN1369521A Heat setting resin compsns. and its use |