Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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02/28/1991 | DE3928434A1 Direct metallisation of non-conductive polymer substrate - by electroplating onto reduced or thermally decomposed metal cpd. layer |
02/27/1991 | EP0414140A2 Light transmission paste and metallic copper deposition method using same |
02/19/1991 | US4994154 Filling voids by plating metals from solutions; controlling voltage to prevent overheating |
02/12/1991 | US4992144 Hydrophilizing surface, electroless deposition of nickel or cobalt, forming microcracks, heating to volatalize components, electrolytic coating of copper |
01/30/1991 | EP0410003A1 Insulated electric wire |
01/29/1991 | US4988419 Method and apparatus for producing conductivity in materials |
01/22/1991 | US4986848 Aqueous alkaline solution of alkylamine, palladium compound and aminopyridine |
01/17/1991 | DE3922233A1 Precipitating. metal layers from metal organic cpds. - by irradiating with light energy photon beam |
01/16/1991 | EP0408205A1 Polyimide substrate having a textured surface metallizing such a substrate |
01/16/1991 | EP0407476A1 A steel wire for the reinforcement of elastomers |
01/15/1991 | US4985087 Treating zinciferous metal surfaces to blacken them |
01/15/1991 | US4985076 Autocatalytic electroless gold plating composition |
01/15/1991 | US4985071 Process for producing a base metal thin film and an electronic device using the same |
01/15/1991 | US4984855 Ultra-black film and method of manufacturing the same |
01/11/1991 | CA2019155A1 Polyimide substrate having a textured surface and metallizing such a substrate |
01/09/1991 | EP0407349A2 Electrode for use in electrolytic processes and process for manufacturing it |
01/09/1991 | EP0407312A1 Apparatus for obtaining materials made of a substrate and a planar shaped coating of purified titanium |
01/09/1991 | EP0406678A1 Swelling agent for the pre-treatment of polymers to be plated by electrolysis |
01/08/1991 | US4983577 Metalorganic deposition of superconducting Yb-Ba-Cu-O thin films by rapid thermal annealing |
01/08/1991 | US4983428 Ethylenethiourea wear resistant electroless nickel-boron coating compositions |
01/08/1991 | CA1278877C Resist inactivation method for manufacture of printed circuit boards |
01/07/1991 | CA2020624A1 Swelling agent for pretreatment of a synthetic resin prior to electroless metallization and improved method of making a circuit board using same |
01/03/1991 | DE3921467A1 Metallising plastic conductor plates coated with conductive layer - by applying electric charge between soln. and plates to enable shorter process time |
01/02/1991 | EP0404891A1 Process for the manufacture of electrically conductive structures. |
01/01/1991 | US4981725 Process and composition for sensitizing articles for metallization |
01/01/1991 | US4981720 Method of manufacturing copper mirrors |
01/01/1991 | US4981715 Complexing polymer and noble metal compound |
12/31/1990 | CA2018670A1 Metal substrate of improved surface morphology |
12/25/1990 | US4979988 Autocatalytic electroless gold plating composition |
12/25/1990 | US4979862 Automatic loading mechanism |
12/19/1990 | EP0402750A1 Process for surface treatment of polyamide articles and the articles obtained |
12/18/1990 | US4978569 Process for preparing selectively metallized articles |
12/18/1990 | US4978559 Autocatalytic electroless gold plating composition |
12/12/1990 | EP0402046A2 Heat-shrinkable article |
12/12/1990 | CN1047760A Method for manufacturing superconducting article |
12/11/1990 | US4976990 Process for metallizing non-conductive substrates |
12/11/1990 | CA1277534C Process for the production of printed circuit boards |
12/06/1990 | DE3917867A1 Electroless gold plating - of tungsten or molybdenum metallisations esp. on electronic ceramic components |
12/05/1990 | EP0400524A2 Method for manufacturing superconducting article |
12/05/1990 | EP0400349A1 Deposition of silver layer on nonconducting substrate |
12/04/1990 | US4975327 Polyimide substrate having a textured surface and metallizing such a substrate |
12/04/1990 | US4975305 Silver film from reduction of silver nitrate in ammoniacal complex form |
12/04/1990 | US4975160 Process for wet chemical metallization of a substrate |
11/29/1990 | CA2016807A1 Method for manufacturing superconducting article |
11/28/1990 | CN1047419A Technology for producing electrode of piezoelectric ceramic device |
11/27/1990 | US4973526 Method of forming ceramic coatings and resulting articles |
11/22/1990 | EP0397988A2 Plasma processing with metal mask integration |
11/22/1990 | DE3916172A1 Etchant contg. sodium used to prepare plastics - for nucleation and plating by electroless technique, esp. preparing polyimide for copper plating |
11/20/1990 | US4971944 Method of electroless depositing of gold onto superconducting particles |
11/20/1990 | CA1276528C Method and arrangement for cleaning, activating and metallizing of boreholes in conductor boards |
11/15/1990 | WO1990013909A1 Reactive ion etching apparatus |
11/15/1990 | WO1990013908A1 Electrochemical planarization |
11/15/1990 | WO1990013684A1 Electrolytic method for the dissolution of copper particles formed during electroless copper deposition |
11/15/1990 | DE4013094A1 Protecting catalytically treated plastic plate from solvents |
11/15/1990 | DE3915605A1 Electro-less copper plating - using isoserine-N,N-di:acetic acid (or salt) as complex-former to increase bath stability and reduce environmental hazards |
11/14/1990 | EP0397412A2 Electroless plating process |
11/13/1990 | CA1276128C Method for selectively plating plastics |
11/10/1990 | CA2009131A1 Method for the dissolution of copper particles formed during electroless copper deposition |
11/08/1990 | DE3744747C2 Ceramic substrates with chemically roughened surfaces |
11/07/1990 | EP0396252A1 Electrolytic regeneration of alkaline permanganate etching bath |
11/07/1990 | EP0396240A1 Ceramic meterial and method for producing the same |
11/06/1990 | US4968388 Continuous processing, chemically and electrochemically metallizing a nonconductor foil |
11/06/1990 | US4967690 Electroless plating with bi-level control of dissolved oxygen, with specific location of chemical maintenance means |
11/05/1990 | CA2013123A1 Electrolytic regeneration of alkaline permanganate etching bath |
10/31/1990 | EP0394666A1 Tetraaza ligand systems as complexing agents for electroless deposition of copper |
10/30/1990 | US4966786 Alkaline solution of halogen-free palladium salt, 2-amino pyridine, boric acid; oxidation resistance, protection during surge andx spray process |
10/28/1990 | WO1990012683A1 Transfer fixture and process for printed circuit boards |
10/28/1990 | CA2031519A1 Transfer fixture and process for printed circuit boards |
10/23/1990 | US4964923 Method of forming a copper film on a ceramic body |
10/23/1990 | US4964698 System for selective laser assisted plating |
10/17/1990 | EP0392822A2 Preceramic compositions and ceramic products |
10/17/1990 | EP0392235A1 Process for plating a metallic deposit between functional pattern lines on a substrate |
10/17/1990 | EP0131031B1 Method of treating thermoplastic surfaces |
10/16/1990 | US4963974 Electronic device plated with gold by means of an electroless gold plating solution |
10/16/1990 | US4963390 Metallo-organic solution deposition (MOSD) of transparent, crystalline ferroelectric films |
10/10/1990 | EP0391201A1 Method for treating polyetherimide substrates and articles obtained therefrom |
10/09/1990 | US4962088 Formation of film superconductors by metallo-organic deposition |
10/02/1990 | US4960646 Titanium composite materials coated with calcium phosphate compound |
10/02/1990 | US4960618 Coating with a metal complex in aprotic solvent, baking to form protective coatings |
10/02/1990 | US4960466 Coating solutions |
09/25/1990 | US4959278 Indium undercoat |
09/25/1990 | US4959255 Ceramic substrates and method of manufacturing the same |
09/25/1990 | US4959121 Nitric or hydrochloric acid |
09/25/1990 | CA1274456A1 Sodium permanganate etch baths containing a co-ion for permanganate and their use in desmearing and/or etching printed circuit boards |
09/20/1990 | WO1990010609A1 Process for chemical metallization of ceramic bodies |
09/13/1990 | DE3907902A1 Verfahren zum chemischen metallisieren von keramikkoerpern A method for chemical metalizing of keramikkoerpern |
09/11/1990 | US4956197 Plasma conditioning of a substrate for electroless plating |
09/11/1990 | US4956097 Decomposition of the metal without air, precipitation |
09/11/1990 | US4956014 Electroless copper plating solution |
09/05/1990 | EP0385165A1 Method for metal-plating resin molded articles and metal-plated resin molded articles |
09/04/1990 | US4954370 Immersion in nickel sulfate, sodium citrate, lactic acid, dimethylborane bath |
09/04/1990 | US4954369 Acetal resin complexing agent |
09/04/1990 | US4954185 Printed circuits, coupler, polyvinyl acetal-phenolic resin copolymer |
08/30/1990 | DE4005088A1 Plattierungszusammensetzung und verfahren Plating and procedural |
08/29/1990 | EP0384180A1 Formaldehyde-free electroless copper plating solutions |
08/28/1990 | US4952556 Patterning thin film superconductors using focused beam techniques |
08/28/1990 | US4952463 Precipitation of a crystalline ferritic film to coat the surface of a ceramic |
08/23/1990 | WO1990009468A1 Plating composition and process |
08/23/1990 | WO1990009467A1 Plating composition and process |
08/23/1990 | DE3905100A1 Method and appliance for electrolyte exchange especially in narrow recesses of large-area workpieces |