| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 06/10/1987 | EP0225041A1 Electroless gold plating solution |
| 06/10/1987 | CN85108949A Chemical nickel-plating method of porcelain dielectric condenser |
| 06/09/1987 | US4671968 Method for electroless deposition of copper on conductive surfaces and on substrates containing conductive surfaces |
| 06/09/1987 | US4671861 Measurement and control of net caustic production during electrodialysis |
| 06/09/1987 | CA1222663A1 Oxidizing accelerator |
| 06/02/1987 | US4670306 Method for treatment of surfaces for electroless plating |
| 05/26/1987 | US4668533 Ink jet printing of printed circuit boards |
| 05/26/1987 | US4668532 System for selective metallization of electronic interconnection boards |
| 05/26/1987 | US4668531 Method for manufacture of electrode |
| 05/26/1987 | US4668299 Inorganic composite material and process for preparing the same |
| 05/19/1987 | US4666858 Adjusting ph; extracting; measuring spectrophotometrically |
| 05/19/1987 | US4666786 Alloying with phosphorus |
| 05/13/1987 | EP0221765A2 Ferrite-ceramic composite powder and method of manufacturing the same |
| 05/13/1987 | EP0221595A1 Method of providing a bonding, electrically insulating layer, metal ribbon coated with such a layer, and low-loss magnet core |
| 05/13/1987 | EP0221359A1 A process for accelerating Pd/Sn seeds for electroless copper plating |
| 05/13/1987 | EP0221283A1 Ductile electroless copper |
| 05/13/1987 | EP0221265A1 Process for determining the plating activity of an electroless plating bath |
| 05/13/1987 | EP0081183B1 Process for the electroless depositing of noble metal layers on the surfaces of non-noble metals |
| 05/13/1987 | CN86106675A Electroless gold plating solution |
| 05/12/1987 | US4664983 Metal-plated |
| 05/06/1987 | EP0220541A1 Process for metallizing transparent conducting strips |
| 05/06/1987 | EP0220198A1 Preparing metal compounds by pyrolysis. |
| 05/05/1987 | US4663199 Wet metallization of acrylic resin articles |
| 05/05/1987 | US4662944 Process and composition for sensitizing articles for metallization |
| 04/30/1987 | DE3614090C1 Bath for the currentless deposition of gold layers |
| 04/29/1987 | EP0219788A1 Electroless gold plating solution |
| 04/28/1987 | US4661384 Organometallic compound with a guest-host ineterrelationship |
| 04/28/1987 | US4661372 UV-induced copper-catalyzed electroless deposition onto styrene-derivative polymer surface |
| 04/21/1987 | US4659605 Electroless deposition magnetic recording media process and products produced thereby |
| 04/21/1987 | US4659592 Process for the production of laminated materials |
| 04/21/1987 | US4659587 Electroless plating process and process for producing multilayer wiring board |
| 04/21/1987 | CA1220759A1 Regeneration of plating bath by acidification and treatment of recovered chelating agent in membrane cell |
| 04/14/1987 | US4657786 Both containing a polymeric organic surface-active compound |
| 04/14/1987 | US4657632 Use of immersion tin coating as etch resist |
| 04/09/1987 | WO1987002029A1 Catalyst composition for electroless plating of ceramics |
| 04/07/1987 | US4655833 Electroless copper plating bath and improved stability |
| 04/07/1987 | US4655797 Fine screen and fine screen stack, their use and process for the manufacture of fine screens |
| 04/07/1987 | CA1220101A1 Electroless nickel plating of aluminum |
| 04/01/1987 | EP0216531A1 Use of immersion tin and tin alloys as a bonding medium for multilayer circuits |
| 04/01/1987 | EP0216513A2 Treatment of drilled copper-clad thermoplastic laminates |
| 04/01/1987 | CN86105385A Method and device for the cleaning, activation and/or metallization of holes drilled in horizontally guided circuit boards |
| 03/31/1987 | US4654269 Spun glass layer |
| 03/31/1987 | US4654126 Process for determining the plating activity of an electroless plating bath |
| 03/25/1987 | EP0215638A1 Metallizing composition for sintered ceramic article |
| 03/25/1987 | EP0215381A1 Process for manufacturing electrodes |
| 03/25/1987 | EP0057232B1 Method for continuous metal deposition from a non-autocatalytic electroless plating bath using electric potential |
| 03/24/1987 | US4652465 Process for the production of a silver coated copper powder and conductive coating composition |
| 03/24/1987 | US4652345 Method of depositing a metal from an electroless plating solution |
| 03/24/1987 | US4652311 Polymer complex |
| 03/17/1987 | US4650691 Electroless copper plating bath and method |
| 03/17/1987 | US4649857 Thin-film forming device |
| 03/17/1987 | CA1219179A1 Apparatus and method for electroless plating |
| 03/12/1987 | WO1987001397A1 Hot-dipped steel plate and process for its production |
| 03/11/1987 | EP0214097A1 Mixture of an olefin and dibenzal acetone palladium complex and its use |
| 03/11/1987 | EP0214024A2 Tin oxide layer, deposition process and substrate so coated |
| 03/11/1987 | EP0213542A1 Conditioning agent for the treatment of basic materials |
| 03/04/1987 | EP0212253A2 Process and device for cleaning, activating and/or metallizing bore holes in horizontally transported circuit boards |
| 03/03/1987 | US4647477 Surface preparation of ceramic substrates for metallization |
| 03/03/1987 | CA1218571A1 Pyrolytic deposition of metal oxide film from aqueous suspension |
| 02/25/1987 | EP0211083A1 Process for forming thin metal sulfide film |
| 02/25/1987 | EP0211021A1 Optical film. |
| 02/24/1987 | US4645734 Composite having conductive layer on resin layer and method of manufacturing |
| 02/24/1987 | US4645574 Continuous process for the sequential coating of polyamide filaments with copper and silver |
| 02/24/1987 | US4645573 Using a wetting solution of alcohol, detergent and an ethylene oxide-propylene oxide copolymer as part of the pretreatment |
| 02/17/1987 | US4643918 Continuous process for the metal coating of fiberglass |
| 02/17/1987 | US4643793 With mixture of copper compound, complexing agent, reducing agent, and ph adjuster in presence of nitrogen heterocycle compound |
| 02/17/1987 | CA1217927A1 Inorganic composite material and process for preparing the same |
| 02/10/1987 | US4642161 Method of bonding copper and resin |
| 02/10/1987 | CA1217686A Metallization of ceramics |
| 02/04/1987 | EP0210437A1 Process for the electroless plating of a poorly electrically conducting inorganic substrate |
| 02/04/1987 | EP0210436A1 Process for metallizing ceramic materials |
| 02/03/1987 | US4640718 Process for accelerating Pd/Sn seeds for electroless copper plating |
| 01/28/1987 | EP0209748A1 Process for chemically treating ceramic work pieces for subsequent metallization |
| 01/28/1987 | CN85105647A Catalytic metal of reduced particle size |
| 01/27/1987 | US4639382 Method of providing a metal mirror on a surface manufactured from an acrylate synthetic resin or a methacrylate synthetic resin |
| 01/27/1987 | US4639380 Process for preparing a substrate for subsequent electroless deposition of a metal |
| 01/27/1987 | US4639378 Auto-selective metal deposition on dielectric surfaces |
| 01/27/1987 | CA1217163A1 Method of depositing a metal |
| 01/27/1987 | CA1217097A1 Aqueous chemical suspension for pyrolytic deposition of metal-containing film |
| 01/21/1987 | EP0208956A1 Process for metallizing a poorly electrically conducting inorganic material |
| 01/21/1987 | EP0208893A1 Apparatus for the treatment of ceramic bodies in a molten alkalihydroxide bath |
| 01/20/1987 | US4637862 Wire-glass composite and method of making same |
| 01/17/1987 | CN85101242A Aqueous alkaline both for the chemical deposition of copper, nickel, cobalt and their alloys |
| 01/15/1987 | WO1987000391A1 Process for conditioning the surface of plastic substrates prior to metal plating |
| 01/13/1987 | US4636441 Crown or crypt compound, high adhesive strength |
| 01/13/1987 | US4636255 Hypophosphite, ph, sequestering, stress relieving, trialkali n n-(2-hydroxyethyl) ethylenediamine-n,n1,n1-triacetate |
| 01/07/1987 | EP0207587A1 High concentration sodium permanganate etch bath and its use in desmearing and/or etching printed circuit boards |
| 01/07/1987 | EP0207586A1 Sodium permanganate etch baths and their use in cleaning, desmearing and/or etching resinous substrates |
| 01/06/1987 | US4634619 Process for electroless metal deposition |
| 01/06/1987 | US4634468 Catalytic metal of reduced particle size |
| 12/30/1986 | US4632857 Electrolessly plated product having a polymetallic catalytic film underlayer |
| 12/30/1986 | US4632852 Process for electroless copper plating |
| 12/30/1986 | US4632734 Alumina blasting, treatment in alkaline cyanide bath, nickel deposition from chloride, second cyanide treatment, protective metal coating |
| 12/30/1986 | EP0206937A2 Stress relieved intermediate insulating layer for multilayer metalization |
| 12/23/1986 | US4631117 Electroless plating process |
| 12/23/1986 | CA1215789A1 Conductive patterns in polymeric films |
| 12/17/1986 | EP0204906A2 Process for metallizing an insulating surface |
| 12/16/1986 | US4629636 Adding secondary oxidant capable of oxidizing manganate ion to permanganate ion |
| 12/10/1986 | EP0204399A1 Method of regenerating permanganate etch bath |
| 12/10/1986 | EP0204166A2 Apparatus and method for monitoring electroless metall plating baths |