Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
02/2011
02/10/2011WO2011014929A1 Deposition of metals
02/09/2011EP2281923A1 Corrosion protection treatment for surfaces made of zinc and zinc coatings
02/09/2011EP2281916A1 Process for coating a substrate
02/09/2011EP2281696A1 Article-surface decorative structure and method of processing for the same
02/09/2011CN201738002U No-cyanide chemical nickel-palladium-aurum palladium cylinder structure
02/09/2011CN201738001U Production line device of non-cyanide nipdau
02/09/2011CN101970721A Process for preventing plating on a portion of a molded plastic part
02/09/2011CN101970720A Method and dispersion for applying a metal layer to a substrate and metallizable thermoplastic molding compound
02/09/2011CN101970719A Process for producing composite material comprising resin molded product
02/09/2011CN101970718A Method for producing a grain-oriented magnetic strip
02/09/2011CN101970352A Activation solution for electroless plating on dielectric layers
02/09/2011CN101967668A Method for preparing Ni-P-UFD composite coating by chemical plating or electroplating process
02/09/2011CN101967639A Mixing surface treatment method of microwave/millimeter wave aluminium alloy structure
02/09/2011CN101967630A Method for preparing catalyst layer on surface of magnesium and magnesium alloy by chemical plating of nickel and nickel-phosphorus alloy
02/09/2011CN101967629A Method for preparing surface-metalized coating of epoxy resin matrix composite material
02/09/2011CN101967628A Pore wall charge regulating agent for circuit board
02/09/2011CN101248220B 表面处理电极 Surface treatment electrode
02/08/2011US7883739 selectively depositing a dielectric layer upon another dielectric layer and selectively depositing a metal layer adjacent to dielectric layer; a microelectronic topography is formed which includes a metal feature and an adjacent dielectric portion comprising lower and upper layers
02/03/2011WO2011014245A2 Method for fabricating copper-containing ternary and quaternary chalcogenide thin films
02/03/2011CA2769529A1 Method for fabricating copper-containing ternary and quaternary chalcogenide thin films
02/02/2011EP2280096A1 Metal material with a bismuth film attached and method for producing same, surface treatment liquid used in said method, and cationic electrodeposition coated metal material and method for producing same
02/02/2011EP2279286A2 Aluminum-containing substrate comprising a microporous layer of an aluminum phosphate zeolite, method for the production thereof, and use thereof
02/02/2011CN101962765A 镀镍方法 Nickel plated method
02/02/2011CN101962764A Method for comprehensively regenerating chemical nickel plating aging liquid by using membrane method and electrochemical method
02/02/2011CN101962763A Chemical plating peptizing liquid and method for performing non-metal surface treatment
02/02/2011CN101962762A Hole wall processing agent for teflon substrate circuit board
02/02/2011CN101962761A Preparation method of bionic hydrophobic coating on surface of magnesium alloy
02/02/2011CN101962760A Method for performing electroless nickel plating on surface of aluminum nitride ceramic
02/02/2011CN101130838B Method for making copper-coating compound powder
02/01/2011US7879535 Pattern forming method, graft pattern material, conductive pattern forming method and conductive pattern material
01/2011
01/28/2011CA2711125A1 Sealing of pinholes in electroless metal coatings
01/27/2011WO2011009891A1 Method for implementing inorganic resins on the basis of hydrogen-free polymeric isocyanates for implementing nitridic, carbidic, and carbonitridic networks and the use thereof as protective coatings
01/27/2011WO2011009858A2 Coating station and method for coating a workpiece
01/27/2011WO2010136338A3 Method for fabricating a layer with absorbing particles for an energy radiation
01/27/2011WO2010136337A3 Utilization of a ceramic layer and method for fabricating such a layer
01/27/2011US20110020550 Process for producing composite material comprising resin molded product
01/26/2011CN101960046A Method of electrolytically dissolving nickel into electroless nickel plating solutions
01/26/2011CN101960045A Compound material, method of producing the same and apparatus for producing the same
01/26/2011CN101956187A Production method of a coating layer for a piece of turbomachinery component, the component itself and the corresponding piece of machinery
01/26/2011CN101956186A Process formula of intermediate-temperate acid nanometer chemical composite plating Ni-P-Al2O3
01/26/2011CN101956185A Scale-inhibiting copper-based heat exchange surface and manufacturing method thereof
01/26/2011CN101956184A Molybdenum or tungsten graph selective chemical nickel plating process on ceramic chip and reductive micro-etching liquid
01/26/2011CN101649451B MOD method for preparing LSCO conductive film on biaxial texture NiW alloy
01/26/2011CN101629284B Method for preparing aluminium-doped zinc oxide transparent conductive film by solvent thermal process
01/26/2011CN101509085B Process for producing foam nickel-molybdenum-cobalt ternary-alloy material
01/25/2011US7875554 Method for electroless depositing a material on a surface of a wafer
01/25/2011US7875158 Plating apparatus
01/25/2011US7875110 Forming a cobalt metal layer on a semiconductor device comprising exposing the substrate to an aqueous solution of succinic acid, potassium carbonate, a cobalt salt, a reducing agent, and a wetting agent comprising polyethylene glycol methyl ether; purity; simplification; cost efficiency
01/25/2011CA2382070C Method of containing a phase change material in a porous carbon material and articles produced thereby
01/20/2011US20110014489 Method for Strengthening Adhesion Between Dielectric Layers Formed Adjacent to Metal Layers
01/20/2011US20110014361 Electroless deposition solutions and process control
01/20/2011US20110011335 Electroless Plating Method and Apparatus
01/19/2011EP2275589A1 Pretreatment solution for electroless tin plating
01/19/2011EP2274459A2 Method of metallizing a non-conductive plastic substrate
01/19/2011CN101949338A Combustion engine piston with composite layer and manufacturing method thereof
01/18/2011US7871670 Microfabrication using replicated patterned topography and self-assembled monolayers
01/13/2011WO2011004802A1 Method for producing formed circuit component
01/13/2011WO2011004698A1 Gas barrier film, method for manufacturing gas barrier film, and photoelectric conversion element using gas barrier film
01/13/2011WO2010125191A3 Method for chemically modifying a polymer matrix through the thickness thereof
01/13/2011WO2010125189A3 Method for preparing a metallised substrate, the resulting substrate and the uses thereof
01/13/2011US20110008958 Methods of Selectively Growing Nickel-Containing Materials
01/13/2011US20110008916 Proximity Head Heating Method and Apparatus
01/12/2011EP2272997A1 Colloidal palladium activator composition and preparation method
01/12/2011EP2272085A2 Method for forming a priming layer for depositing a metal on a substrate
01/12/2011EP1807549B1 Method for coating substrates containing antimony compounds with tin and tin alloys
01/12/2011CN201704404U Chemical plating hanging basket
01/12/2011CN1957112B Anode for oxygen evolution
01/12/2011CN101946023A Process for manufacturing conductive tracks
01/12/2011CN101942652A Plated base substrate
01/12/2011CN101942651A Zero-discharge chemical nickel-plating technology
01/12/2011CN101942650A Vortex-forced flow chemical composite plating device and process method using same
01/12/2011CN101941076A Method for preparing multilayer hollow metal microspheres for electromagnetic wave absorbing material
01/12/2011CN101638777B Method for depositing copper sulphide nano film rapidly in low temperature
01/12/2011CN101619476B Treatment process before plating environment-friendly copper alloy
01/12/2011CN101104747B Mica-base ultra-black material and its preparation method and application
01/12/2011CN101027427B Method for coating substrates containing antimony compounds with tin and tin alloys
01/11/2011US7867686 Metal deposition
01/11/2011US7867564 Metal plating method and pretreatment agent
01/06/2011WO2011003116A2 Beta-amino acid comprising electrolyte and method for the deposition of a metal layer
01/06/2011WO2011002806A1 Advanced photomask repair
01/06/2011WO2011002311A1 Plating or coating method for producing metal-ceramic coating on a substrate
01/06/2011WO2011001713A1 Protection tape for plating
01/06/2011WO2011000969A1 Anti-corrosive treatment for surfaces made of zinc and zinc alloys
01/06/2011WO2010125283A3 Method for the partial metallization of a plastic part, in particular of a mask for an illuminating and/or signalling light of a vehicle
01/06/2011CA2766589A1 Advanced photomask repair
01/06/2011CA2765961A1 Corrosion protection treatment for surfaces made of zinc and zinc alloys
01/05/2011EP2270256A2 Method for producing polymer member having plated film
01/05/2011EP2270255A1 Beta-amino acid comprising electrolyte and method for the deposition of a metal layer
01/05/2011EP2270254A1 Au-containing layer obtainable by charged particle beam processing
01/05/2011CN101935830A Mine hydraulic prop with Ni-Co-P nano Si3N4 composite coating on surface and electroless plating method
01/05/2011CN101935829A Nanocomposite nickel-plated coating material and preparation method and application thereof
01/05/2011CN101935828A Conditioner for electroless plating
01/05/2011CN101567269B Coating and thermal decomposition process for preparing RuO* electrode material of super-capacitor
01/05/2011CN101548029B Method for production of metal-coated polyimide resin substrate having excellent thermal aging resistance property
01/05/2011CN101476127B Surface recombination processing method for rare earth-magnesium-nickel based AB3 type hydrogen storage alloy
01/04/2011US7862860 Materials and methods for immobilization of catalysts on surfaces and for selective electroless metallization
01/04/2011US7862652 Directional self-assembly of biological electrical interconnects
12/2010
12/29/2010WO2010149667A1 A method for plating a copper interconnection circuit on the surface of a plastic device
12/29/2010WO2010112358A3 Method for coating a surface of a component
12/29/2010WO2010054633A3 Wear-resistant layer for tial
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