Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
08/2010
08/26/2010WO2010057653A3 Conductive coatings on an ito basis
08/25/2010EP2221396A1 Lead-Free Tin Alloy Electroplating Compositions and Methods
08/25/2010EP2219793A1 Functionalized substrates with thin metal oxide adhesion layer
08/25/2010CN1711620B Enhanced field emission from carbon nanotubes mixed with particles
08/25/2010CN101815808A coatings
08/25/2010CN101815766A Method of forming a ceramic silicon oxide type coating, method of producing an inorganic base material, agent for forming a ceramic silicon oxide type coating, and semiconductor device
08/25/2010CN101812711A Plating apparatus
08/25/2010CN101812678A Method for preparing composite material coated with silver on surface through dopamine
08/25/2010CN101435077B Magnesium alloy chemical nickel plating solution and electroplating pretreatment method
08/25/2010CN101294283B Method for processing magnesium alloy surface
08/24/2010US7781028 adsorbing substrates onto surface of plate, absorbing compound with metal alkoxide group on surface, removing via rinsing, hydrolyzing, absorbing
08/24/2010US7781018 contacting the oxidizable component (Fe, Al or alloy) in particle form with a gas containing a vapour of the activating component (AlCl3, FeCl3 etc.) and depositing activating component from the gas onto the oxidizable component in either a liquid or solid form; utility in packaging
08/24/2010US7780772 Electroless deposition chemical system limiting strongly adsorbed species
08/24/2010US7780771 electroless plating with composition of cerium nitrate and silver nitrate; electronics
08/19/2010WO2010092537A1 Process for coating diamond with refractory metal carbide and methal
08/19/2010US20100207492 Ceramic and method of manufacturing the same, Dielectric capacitor, semiconductor device, and element
08/18/2010EP2217757A1 Method for metallising a polymer
08/18/2010CN101809207A Corrosion resistant aluminum alloy substrates and methods of producing the same
08/18/2010CN101550546B A preparation method of surface metallized composite material through chemical plating under photocatalysis
08/18/2010CN101461041B Semiconductor device manufacturing method, semiconductor manufacturing apparatus and storage medium
08/18/2010CN101135052B Method for preparing metallic complex film
08/17/2010US7777078 Copper electrolytic solution and electrolytic copper foil produced therewith
08/17/2010US7777059 Complexes having ligands of phosphines, phosphites, isonitriles,alkenes,alkynes; chemical vapor deposition to depoit pure copperfor conductive wiring; microelectronics; cost efficiency; efficiency; stability; handling; storage stability; uniform films;spin coating
08/17/2010US7776196 Method for arranging particles and method for manufacturing light-emitting device
08/17/2010US7774920 Fabrication of metallic microstructures via exposure of photosensitive compostion
08/11/2010CN201543564U Brush coating device of surface coating of electrode
08/11/2010CN1998066B Structure formation
08/11/2010CN101802264A An electroless process for depositing a metal on a non-catalytic substrate
08/11/2010CN101802263A porous electrolessly deposited coatings
08/11/2010CN101802262A deposition from ionic liquids
08/11/2010CN101802261A Multilayer printed wiring boards with holes requiring copper wrap plate
08/11/2010CN101802260A Method for partially coating complex components with catalytically active components
08/11/2010CN101802245A Method and apparatus for applying a material on a substrate
08/11/2010CN101798685A Method for preparing work layer on surface of process roller of cold rolling unit
08/11/2010CN101798683A Nano metal solution, nano metal composite particles and metal film manufacturing method
08/10/2010US7771779 Heating a substrate coated with a curable polymer and a glass transition suppression modifier to greater than the glass transition temperature but less than the curing temperature; and heat curing the layer to form a substrate with percent planarization at 100 micrometers of greater than fifty percent.
08/05/2010WO2010087392A1 Substrate comprising alloy film of metal element having barrier function and metal element having catalytic power
08/05/2010WO2010086202A2 Coating having thermal and non-thermal coating method
08/05/2010WO2010027950A4 Methods and solutions for preventing the formation of metal particulate defect matter upon a substrate after a plating process
08/04/2010EP2214178A1 Process for producing transparent electroconductive member
08/04/2010EP2213766A1 Electroless plating method for alloy coating film and plating liquid
08/04/2010EP2212447A2 Gold-containing nickel layer
08/04/2010CN201538067U Metal piece
08/04/2010CN101796217A Process for producing metal film, primer composition, metal film and use of the metal film
08/04/2010CN101087901B Aqueous/organic metal oxide dispersion and coated substrates and mouldings produced therewith
08/03/2010US7767009 A silver deposit solution comprisingan acid,a source of silver ions andan additive selected from the group consisting of pyrroles, triazoles, tetrazoles, and mixtures ; including 1,2,3-benzotriazin-4(3H)-one; cost efficiency; simplification
07/2010
07/29/2010WO2010056612A3 Plating solutions for electroless deposition of ruthenium
07/29/2010WO2010046395A3 Post-treatment composition for increasing corrosion resistance of metal and metal alloy surfaces
07/29/2010WO2010040016A3 Nickel-gold plateable thick film silver paste, and plating process for low temperature co fired ceramic devices and ltcc devices made therefrom
07/29/2010US20100186665 Method for low temperature growth of inorganic materials from solution using catalyzed growth and re-growth
07/28/2010EP2211061A1 Abrasion resistance reinforcing method and sliding structure
07/28/2010EP1629139B1 Process for painting metal parts
07/28/2010CN101788463A Method for separating and detecting atrazine and paraquat
07/22/2010WO2010081189A1 Method of reducing magnetite formation
07/21/2010EP2208808A1 Self-cleaning article and a process for preparing the same
07/21/2010CN101784697A Method for treating an at least partially metallised textile, treated textile and use thereof
07/21/2010CN101784696A Process for producing metal film, metal film and use of the metal film
07/21/2010CN101781784A Gold potassium citrate for gold plating and preparation method thereof
07/21/2010CN101781761A Antiseptic treatment method of magnesium alloy structural part
07/21/2010CN101781760A Chemical plating repairing method for palladium or palladium alloy composite film
07/21/2010CN101781759A Method for covering silver nano-film on copper material
07/21/2010CN101781758A Chemical nickel plating stabilizer, production technology thereof, chemical nickel plating solution and technology
07/21/2010CN101781757A Method for chemically plating nano nickel particles on surface of multi-wall carbon nano tube without using palladium
07/21/2010CN101781756A Stainless plating process
07/20/2010US7758927 Laser-induced fabrication of metallic interlayers and patterns in polyimide films
07/20/2010US7758732 Method and apparatus for applying a voltage to a substrate during plating
07/20/2010US7758681 a Co precursor, a W precursor, a phosphorus precursor, a reducing agent (dimethylamine borane (DMAB) or borohydride, edta complexing agent, KOH pH regulator and a stabilizer selected from 4,5-dithiaoctane-1,8-disulfonic acid and 3-(2-benzothiazolethio)-1-propane sulfonic acid; stability; reuse
07/15/2010WO2010079154A1 Method for producing a nanoparticle deposit with increased adhesion and device for implementing said method
07/15/2010WO2010078907A1 Functional material for printed electronic components
07/14/2010EP2206801A1 Composite cookware comprising a vitreous protective coating
07/14/2010EP2206141A2 Improved solution deposition assembly
07/14/2010EP1462230B1 Die for molding honeycomb structure and manufacturing method thereof
07/14/2010CN101775606A Nickel plating process method of magnesium alloy
07/14/2010CN101775595A Chemical composition plating method for preparing supported platinum bimetallic alloy composite material
07/14/2010CN101775594A Method for preparing silver nano material on surfaces of silicon wafers
07/14/2010CN101775593A Heat treatment method of ultrahard aluminum alloy after chemical nickel-plating
07/14/2010CN101403110B Preparation method for simply pretreated chemical-plating metal-coating carbide powder
07/13/2010US7754062 Pretreating using ozone solution; then contacting with anionic surfactant, nonionic surfactant and base; activating surface treatment; applying catalyst
07/13/2010CA2487199C Method for repairing components using environmental bond coatings and resultant repaired components
07/07/2010EP2204472A2 Methods for forming wiring and electrode
07/07/2010CN101768747A Method for carrying out surface activating treatment on surface of titanium alloy
07/07/2010CN101768736A Formula for chemical plating of nickel-copper on calcium magnesium silicate mineral whisker surface and process thereof
07/07/2010CN101768735A Metalized method for printing figures on non-conductive substrate
07/07/2010CN101289740B Nickel-tungsten-phosphorus bath for chemical plating of magnesium alloy
07/06/2010US7749684 photocatalysts; colloids; waste treatment
07/06/2010US7749620 Electromagnetic wave shield material and process for producing the same
07/01/2010WO2010075484A1 Chrome-free method of conditioning and etching of a thermoplastic substrate for metal plating
07/01/2010WO2010074067A1 Electroless tin or tin-alloy plating solution and electronic part with tin or tin-alloy coating film formed from the plating solution
07/01/2010WO2010073123A2 Composite cookware comprising a vitreous protective coating
07/01/2010WO2010072814A1 Alkali-resistance, wear-resistant and dishwasher-safe coating on a substrate
07/01/2010WO2010072192A2 Security and/or valuable document comprising a conductive structure and method for producing same
06/2010
06/30/2010EP2202755A1 Electrically conductive microparticle, anisotropic electrically conductive material, connection structure, and method for production of electrically conductive microparticle
06/30/2010EP2202280A1 Corrosion inhibting coatings controllable by electromagnetic irradiation and methods for corrosion inhibition using the same
06/30/2010CN201518154U Electric vibration monitoring and warning system for electroless copper plating
06/30/2010CN101760739A Direct vertical deposition method of zinc oxide nanometer rod array on titanium dioxide film
06/30/2010CN101760734A Tin-nickel chemical plating prescription and process on surface of glass fiber
06/30/2010CN101760733A Magnesium alloy chemical nickel-plating surface treatment method taking microarc oxidation process as pretreatment
06/30/2010CN101760732A Chemical nickel plating process for surface of magnesium alloy and chemical nickel plating solution
06/30/2010CN101760731A Electroless nickel plating solution composition, flexible printed circuit board and manufacturing method thereof
06/30/2010CN101760730A Low-temperature chemical tinning solution and tinning method
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