Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
08/2009
08/05/2009EP2085425A1 Resin composition for metal plating, molded article thereof, and metal-plated molded article
08/05/2009EP1920472B1 Method for applying a metallic covering layer to a high-temperature superconductor
08/05/2009EP1590099A4 Process equipment wear surfaces of extended resistance and methods for their manufacture
08/05/2009CN101501249A Partial plating method, laser plating equipment and plating member
08/05/2009CN101501245A Plated resin molded body
08/05/2009CN100524639C Substrate processing method, substrate processing apparatus and control program
08/05/2009CN100523310C Metal plating structure and method for production thereof
08/05/2009CN100523298C Method for preparing silver nano antibacterial material
08/05/2009CN100523297C Method for hydrothermally synthesizing series flower shape zinc oxide micron/nano structure
08/04/2009US7569250 Method, system, and apparatus for protective coating a flexible circuit
07/2009
07/30/2009WO2008106585A3 Adherends with enhanced surfaces
07/30/2009US20090192029 Catalyst composition and deposition method
07/30/2009US20090191353 Turbine component other than airfoil having ceramic corrosion resistant coating and methods for making same
07/29/2009EP2082631A1 A coating method and the coating formed thereby
07/29/2009EP1987707B1 Method for producing a layer on a moulding
07/29/2009CN101492814A Process for producing double-layer flexible cover copper plate
07/29/2009CN101492813A Process for producing magnesium alloy surface Ni-Ce-P/nano-TiO2 chemical composite plate
07/29/2009CN100519838C Method for plating resin material
07/28/2009US7566389 Depositing valve oxide on substrate
07/23/2009US20090186194 Batch Process for Coating Nanoscale Features and Devices Manufactured From Same
07/23/2009US20090184290 Precursor composition, method for manufacturing precursor composition, method for manufacturing ferroelectric film, piezoelectric element, semiconductor device, piezoelectric actuator, ink jet recording head, and ink jet printer
07/23/2009CA2745575A1 Method for deposition of ceramic films
07/22/2009EP2080822A1 Direct plating method and solution for palladium conductor layer formation
07/22/2009EP2080818A2 Methods for removing a stabilizer from a metal nanoparticle using a destabilizer
07/22/2009EP2079541A2 Sinter bonded porous metallic coatings
07/22/2009EP1866103B1 A method for producing an aldehyde containing coating
07/22/2009CN101490310A Process for metallization of plastic surfaces
07/22/2009CN101490309A Coating liquid, metal compound thin film formed by using coating liquid, and method for forming the same
07/22/2009CN101490308A Plating solution for electroless deposition of copper
07/22/2009CN100516293C Direct composite method for coating magnesium-alloy surface with nano-titanium dioxide
07/21/2009US7563513 waterborne reactive graded mixed metal Zr:Si sol-gel; stable oxide surface covalently bonded on titanium and aluminum alloy; corrosion resistance, impact resistance over wide temperature range; adhesion; Conversion coating; nontoxic; spraying rather than immersion for easy maintenance
07/16/2009WO2009086954A1 Acidic aqueous solution containing a chelating agent and the use thereof
07/16/2009DE102005045350B4 Druckschablone eines SMT-Prozesses Stencil of an SMT process
07/16/2009CA2711634A1 Acidic aqueous solution containing a chelating agent and the use thereof
07/15/2009EP2078607A1 Metal-film-coated material and process for producing the same, metallic-pattern-bearing material and process for producing the same, composition for polymer layer formation, nitrile polymer and method of synthesizing the same, composition containing nitrile polymer, and layered product
07/15/2009EP1888813B1 Method for the rapid densification of a porous fibrous substrate, comprising the formation of a solid deposit within the porosity of the substrate
07/15/2009EP1048757B1 Plating method and apparatus
07/15/2009CN101484610A Electroless plating in microchannels
07/09/2009WO2009086230A2 Activation solution for electroless plating on dielectric layers
07/09/2009WO2009084470A1 Plating method, method for forming metal thin film, and plating catalyst liquid
07/09/2009WO2009084371A1 Process for adsorbing plating catalysts, process for production of substrates provided with metal layers and plating catalyst containing fluid for use in both processes
07/09/2009WO2009084337A1 Process for producing metal film, primer composition, metal film and use of the metal film
07/09/2009WO2009084336A1 Process for producing metal film, metal film and use of the metal film
07/09/2009WO2008125172A3 Method for the creation of planar variations in size or distance in nanostructure patterns on surfaces
07/08/2009EP2076619A2 Methods of patterning a deposit metal on a polymeric substrate
07/08/2009EP1794763B1 Silver microribbon composition and method of production
07/08/2009CN101479405A Electroless Ni-P plating method and substrate for electronic component
07/08/2009CN101479404A Method for producing metal film, foundation composition, metal film and use thereof
07/08/2009CN101476117A Method for manufacturing gear type diamond dressing gear by chemical nickel plating
07/08/2009CN100510174C Electroless gold plating solution
07/08/2009CN100510173C Method for metallizing insulating substrates under the control of gloss measurement
07/08/2009CN100510172C Chemical nickel plating process on magnesium alloy
07/08/2009CN100510171C Preparation method of carbon coated TiO* core-shell composite nanometer powder
07/07/2009CA2355695C Method for producing a metal alloy powder such as mcraly and coatings obtained with same
07/02/2009WO2009081048A2 Desensitisation by coating crystals of explosive energy substances, coated crystals of such substances, and energy materials
07/02/2009WO2009080642A2 Process for manufacturing conductive tracks
07/02/2009WO2009059917A3 Silver-containing nickel layer
07/02/2009WO2009059915A3 Gold-containing nickel layer
07/02/2009US20090169923 Substrate processing using the vapor supplying apparatus
07/02/2009US20090169738 Method for rapid manufacture of carbon-based tooling for melt infiltration
07/02/2009US20090169727 Copper film forming method and manufacturing method of multi-layer wiring substrate
07/02/2009US20090166209 Porous Battery Components Comprising Electrochemically Created Nanocatalysts
07/02/2009DE10028111B4 Anorganische,filmbildende Überzugszusammensetzung, Herstellungsverfahren hierfür und Verfahren zur Ausbildung eines anorganischen Films Inorganic film-forming coating composition, preparation method therefor and method of forming an inorganic film
07/01/2009CN101473065A Process for producing a sol-gel-based absorber coating for solar heating
07/01/2009CN101469420A Electroless gold-plating method and electronic component
07/01/2009CN101469419A Replacement gold plating solution for copper material and gold plating method using the same
07/01/2009CN100507079C Method of anodizing of magnesium and magnesium alloys and producing conductive layers on an anodized surface
07/01/2009CN100507074C Compounded conducting mix and silver coating Fe*O* powder and preparation method thereof
06/2009
06/30/2009US7553364 Ferroelectric thin film formation composition, ferroelectric thin film and method of fabricating ferroelectric thin film
06/25/2009WO2009078448A1 Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution
06/25/2009WO2009078255A1 Substrate and method for manufacturing the same
06/25/2009WO2009078254A1 Substrate and method for manufacturing the same
06/25/2009DE102004019877B4 Haftschicht zum Kleben von Harz auf eine Kupferoberfläche Adhesive layer for bonding resin on a copper surface
06/24/2009CN201261805Y Copper precipitation unit of printed circuit board
06/24/2009CN101466869A Electroless plating NiP adhering and/or covering layer for copper wiring layer
06/24/2009CN100505170C Proximity head heating method and apparatus
06/18/2009WO2009075885A2 Method and apparatus for plating solution analysis and control
06/18/2009WO2009075162A1 Conductive paste, method for exposing metal filler, plating method, and electronic device
06/18/2009WO2009045845A3 Methods for coating a metal substrate
06/17/2009EP2069545A1 Liquid or pulp aeration device
06/17/2009EP2004908B1 Method for applying a metal on a substrate
06/17/2009EP2004907B1 Method for applying a metal on paper
06/17/2009EP1108802B1 Stainless steel material with excellent antibacterial property and process for producing the same
06/17/2009CN201258360Y Forced flow electroless plating apparatus
06/17/2009CN101457353A Chemical depositing Ni-P-nano titanic oxide photocatalysis composite coating plating solution and plating method thereof
06/17/2009CN100500937C Chemical plating liquid of high-phosphor chemical plating Ni-P alloy for use on 304 stainless steel surface
06/17/2009CN100500936C Method for chemically-plating nickel-phosphor alloy cladding on magnesium alloy surface
06/17/2009CN100500935C Environment-protection brightening type chemical nickel-plating additive
06/16/2009US7547479 Tin-coated printed circuit boards with low tendency to whisker formation
06/16/2009US7547478 Article including a substrate with a metallic coating and a protective coating thereon, and its preparation and use in component restoration
06/11/2009WO2009073435A1 Partially aromatic polyamide compositions for metal plated articles
06/11/2009US20090145652 Printed wiring board and its manufacturing method
06/10/2009EP2067880A1 Electroless plating method
06/10/2009EP2067879A1 Plated material having metal thin film formed by electroless plating, and method for production thereof
06/10/2009EP2067878A1 Plated material having metal thin film formed by electroless plating, and method for production thereof
06/10/2009EP2067145A2 Technique for plating substrate devices using voltage switchable dielectric material and light assistance
06/10/2009EP2066826A1 Method for metallizing a component
06/10/2009DE112007001818T5 Verfahren zum teilweisen Plattieren, Laserplattiervorrichtung und plattiertes Material Method for partially plating, Laserplattiervorrichtung and clad material
06/10/2009DE112007001651T5 Plattierter Harzformkörper A plated resin molded article
06/10/2009CN100497732C Chemical bronze plating liquid of mixing type non-formaldehyde reducer
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