B81B - Micro-structural devices or systems, e.g. micro-mechanical devices

More topics under "B81B - Micro-structural devices or systems, e.g. micro-mechanical devices" (27,867)
B81B 1 - Devices without movable or flexible elements, e.g. micro-capillary devices (5,283)
B81B 3 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes (12,727)
B81B 5 - Devices comprising elements which are movable in relation to each other, e.g. comprising slidable or rotatable elements (874)
B81B 7 - Micro-structural systems (8,983)

Patents for B81B - Micro-structural devices or systems, e.g. micro-mechanical devices (113)
07/2013
07/30/2013	CA2499208C Controlling electromechanical behavior of structures within a microelectromechanical systems device
05/2013
05/28/2013	US8450816 Method for manufacturing a microelectromechanical component; and a microelectromechanical component
05/28/2013	CA2521171C Microfluidic devices and methods of using same
04/2013
04/24/2013	CN101351400B Method for manufacturing micromechanical components
02/2013
02/05/2013	US8368124 Electromechanical devices having etch barrier layers
09/2012
09/05/2012	CN101312904B Method for manufacturing a microelectromechanical component, and a microelectromechanical component
08/2012
08/07/2012	US8236694 Method for manufacturing micromechanical components
06/2012
06/20/2012	CN1723571B Microelectromechanical systems device and its manufacture method
05/2012
05/17/2012	US20120119312 Method for manufacturing a microelectromechanical component; and a microelectromechanical component
02/2012
02/28/2012	US8124435 Method for manufacturing a microelectromechanical component, and a microelectromechanical component
07/2011
07/19/2011	US7982291 Method for manufacturing a microelectromechanical component, and a microelectromechanical component
07/06/2011	EP2340890A1 Microfluidic devices and methods of using same
03/2011
03/24/2011	US20110070675 Method for manufacturing micromechanical components
02/2011
02/08/2011	US7882741 Method for manufacturing micromechanical components
02/2010
02/23/2010	US7666361 analysis apparatus comprising multicompartments formed within elastomer blocks, in fluid communication through interface channels having valve for controlling fluid communication, used for genetic replication, polymerase chain reactions, genotyping and gene expression analysis
12/2009
12/31/2009	US20090323168 Electromechanical devices and methods of fabricating same
11/2009
11/10/2009	US7616791 Confidence determination
09/2009
09/09/2009	CN100538981C Microdevice assembly having a fine grain getter layer for maintaining vacuum
08/2009
08/20/2009	US20090206423 Method for manufacturing micromechanical components
07/2009
07/28/2009	US7567497 Recording system comprising a storage layer and an array of microtips
06/2009
06/23/2009	US7550794 Micromechanical systems device comprising a displaceable electrode and a charge-trapping layer
05/2009
05/28/2009	US20090137079 Method for manufacturing a microelectromechanical component, and a microelectromechanical component
02/2009
02/10/2009	US7489024 TMOS-infrared uncooled sensor and focal plane array
01/2009
01/21/2009	CN101351400A Method for manufacturing micromechanical components
11/2008
11/26/2008	CN101312904A Method for manufacturing a microelectromechanical component, and a microelectromechanical component
11/26/2008	CN101312903A Method for manufacturing a microelectromechanical component, and a microelectromechanical component
09/2008
09/25/2008	US20080230387 Microfluidic Devices and Methods of Using Same
09/09/2008	US7423794 Device and method for stacked multi-level uncoupled electrostatic actuators
08/2008
08/06/2008	EP1951609A1 Method for manufacturing a microelectromechanical component, and a microelectromechanical component
06/2008
06/12/2008	US20080138247 Liquid Detection and Confidence Determination
02/2008
02/14/2008	US20080037400 Recording System Comprising A Storage Layer And An Array Of Microtips
10/2007
10/23/2007	US7285834 Process for producing microelectromechanical components and a housed microelectromechanical component
08/2007
08/22/2007	EP1820028A1 Liquid detection and confidence determination
07/2007
07/24/2007	US7248128 Reference oscillator frequency stabilization
05/2007
05/24/2007	US20070118490 Confidence determination
05/24/2007	US20070114623 Method for manufacturing a microelectromechanical component, and a microelectromechanical component
04/2007
04/05/2007	WO2006128958A3 Method for manufacturing micromechanical components
12/2006
12/27/2006	EP1735788A2 Recording system comprising a storage layer and an array of microtips
12/14/2006	US20060279862 Device and method for stacked multi-level uncoupled electrostatic actuators
12/07/2006	WO2006128958A2 Method for manufacturing micromechanical components
11/2006
11/15/2006	EP1546026A4 Fabrication of 3d photopolymeric devices
11/02/2006	US20060244067 Tmos-infrared uncooled sensor and focal plane array
10/2006
10/18/2006	EP1712002A1 Reference oscillator frequency stabilization
08/2006
08/02/2006	EP1615721A4 Microfluidic devices and methods of using same
07/2006
07/20/2006	US20060160258 Process for producing microelectromechanical components and a housed microelectromechanical component
07/04/2006	US7071521 Process for producing microelectromechanical components and a housed microelectromechanical component
05/2006
05/31/2006	CN1781176A Microdevice assembly having a fine grain getter layer for maintaining vacuum
05/25/2006	US20060110211 Infinitely adjustable engagement system and method
05/18/2006	WO2006052200A1 Liquid detection and confidence determination
05/02/2006	US7036769 Microstructures using carbon fiber composite honeycomb beams
03/2006
03/30/2006	US20060066006 Fabrication of 3d photopolymeric devices
03/29/2006	EP1639544A1 Confidence determination
03/02/2006	WO2006021613A1 Liquid filled micro-mechanical actuator
03/02/2006	WO2006021612A1 Micro mechanical clutch and a component integrated thereto
02/2006
02/22/2006	CN1739065A Method of patterning photoresist on a wafer using a transmission mask with a carbon layer
02/16/2006	WO2005102908A3 Recording system comprising a storage layer and an array of microtips
01/2006
01/18/2006	EP1615721A2 Microfluidic devices and methods of using same
01/18/2006	CN1723571A Controlling electromechanical behavior of structures within a microelectromechanical systems device
01/12/2006	US20060006280 Microstructures using carbon fiber composite honeycomb beams
12/2005
12/28/2005	EP1608585A2 Microdevice assembly having a fine grain getter layer for maintaining vacuum
11/2005
11/23/2005	EP1597761A2 Packaged microchip with thermal stress relief
11/23/2005	CN1701438A Packaged microchip
11/22/2005	US6967758 System and method for sub-pixel electronic alignment
11/03/2005	WO2005102908A2 Recording system comprising a storage layer and an array of microtips
10/2005
10/26/2005	EP1588221A2 A method of patterning photoresist on a wafer using a transmission mask with a carbon layer
09/2005
09/09/2005	WO2004071939A3 System and method for sub-pixel electronic alignment
09/06/2005	US6939650 making integrated circuits using absorbent transmission masks that can be repaired
08/2005
08/25/2005	US20050184822 Reference oscillator frequency stabilization
08/18/2005	WO2005076480A1 Reference oscillator frequency stabilization
07/2005
07/07/2005	WO2004089810A3 Microfluidic devices and methods of using same
07/05/2005	US6913942 Sacrificial layers for use in fabrications of microelectromechanical devices
06/2005
06/29/2005	EP1546026A2 Fabrication of 3d photopolymeric devices
06/16/2005	US20050129581 Microfluidic devices and methods of using same
06/15/2005	EP1540738A2 Controlling electromechanical behavior of structures within a microelectromechanical systems device
05/2005
05/26/2005	WO2004103889A3 Microstructures using carbon fiber composite honeycomb beams
05/17/2005	US6894358 Process for producing microelectromechanical components and a housed microelectromechanical component
04/2005
04/14/2005	WO2004074168A3 Packaged microchip with thermal stress relief
03/2005
03/24/2005	WO2004083107A3 Infinitely adjustable engagement system and method
03/24/2005	US20050064644 Process for producing microelectromechanical components and a housed microelectromechanical component
03/15/2005	US6867543 Microdevice assembly having a fine grain getter layer for maintaining vacuum
03/10/2005	WO2004074167A3 A device and method for stacked multi-level uncoupled electrostatic actuators
01/2005
01/20/2005	WO2004094298A3 Microdevice assembly having a fine grain getter layer for maintaining vacuum
01/20/2005	WO2004065287A3 A method of patterning photoresist on a wafer using a transmission mask with a carbon layer
01/06/2005	WO2005001766A1 Confidence determination
12/2004
12/29/2004	WO2004087561A3 Novel sacrificial layers for use in fabrications of microelectromechanical devices
12/02/2004	WO2004103889A2 Microstructures using carbon fiber composite honeycomb beams
11/2004
11/10/2004	CN1545484A Process for producing microelectromechanical components
11/04/2004	WO2004094298A2 Microdevice assembly having a fine grain getter layer for maintaining vacuum
11/04/2004	WO2004063089A3 Recessed microstructure device and fabrication method thereof
10/2004
10/28/2004	US20040214380 Process for producing microelectromechanical components
10/21/2004	WO2004089810A2 Microfluidic devices and methods of using same
10/14/2004	WO2004087561A2 Novel sacrificial layers for use in fabrications of microelectromechanical devices
09/2004
09/30/2004	WO2004083107A2 Infinitely adjustable engagement system and method
09/30/2004	US20040191946 Novel sacrificial layers for use in fabrications of microelectromechanical devices
09/30/2004	US20040189198 Microdevice assembly having a fine grain getter layer for maintaining vacuum
09/23/2004	US20040183882 System and method for sub-pixel electronic alignment
09/02/2004	WO2004074168A2 Packaged microchip with thermal stress relief
09/02/2004	WO2004074167A2 A device and method for stacked multi-level uncoupled electrostatic actuators
08/2004
08/26/2004	WO2004071939A2 System and method for sub-pixel electronic alignment
08/05/2004	WO2004065287A2 A method of patterning photoresist on a wafer using a transmission mask with a carbon layer

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