| Patents for B81B 7 - Micro-structural systems (8,983) |
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| 05/12/2011 | DE102009046461A1 Capped micro-electromechanical component e.g. inertia sensor, manufacturing method, involves coating functional layer with non-adhesive coating, removing non-adhesive coating from germanium or silicon germanium coating, and applying cap |
| 05/12/2011 | DE102009022182B4 Regelbare Drosselstrecke Adjustable throttle section |
| 05/11/2011 | EP2319798A2 Mems package having electrical connections for edge mount |
| 05/11/2011 | CN102056063A Mems microphone and method for manufacturing same |
| 05/11/2011 | CN102053167A Hot air bubble type angular accelerometer applying radio frequency identification tag technology |
| 05/11/2011 | CN102052985A MEMS cylinder-type high-temperature and superhigh-pressure resistant sensor |
| 05/11/2011 | CN102050419A Magnetic double nano-structure array material and preparation method thereof |
| 05/11/2011 | CN102050418A Three-dimensional integrated structure and production methods thereof |
| 05/11/2011 | CN101586985B Monolithic integrated non-refrigerated infrared/ultraviolet double-color detector |
| 05/11/2011 | CN101531334B Magnetic drive micro-inertial sensor for increasing detection capacitance and preparation method |
| 05/11/2011 | CN101414058B Device on a transparent substrate and micro mechanical-electric system device |
| 05/10/2011 | US7939918 Chip packages with covers |
| 05/05/2011 | WO2011051620A2 Electromagnetically actuated micro-shutter |
| 05/05/2011 | WO2011050758A1 Bionic telescopic matrix unit |
| 05/05/2011 | WO2010141942A4 Mems switch with latch mechanism |
| 05/05/2011 | US20110103174 Microfluidic device comprising gas providing unit, and methods of mixing liquids and forming emulsion using the same |
| 05/05/2011 | US20110101474 Method for protecting encapsulated sensor structures using stack packaging |
| 05/05/2011 | DE102010060194A1 Kopplungsstruktur mit hoher Spannungsfestigkeit Coupling structure with high electric strength |
| 05/05/2011 | DE102010043189A1 Integrierter akustischer Schalltrichter und Leitungsrahmen Built-in Alarm bell and lead frame |
| 05/05/2011 | DE102009046388A1 Micromechanical structural element i.e. micro-mirror, for use in e.g. device for deflection of rays in monochromatic light in optical network, has linear drive elastically designed regarding to form change due to compression of structure |
| 05/05/2011 | DE102009046110A1 Koppelfeder für Drehratensensor Coupling spring for angular rate sensor |
| 05/04/2011 | EP2317365A1 Drive device |
| 05/04/2011 | EP2316785A1 Interconnection structure in a cavity having one or more contact rises on the walls of the cavity, and manufacturing method |
| 05/04/2011 | EP2316784A1 Interconnection structure in a cavity having one or more contact rises on the walls of the cavity, and manufacturing method |
| 05/04/2011 | EP1391419B1 Gripper and method of manufacturing the gripper |
| 05/04/2011 | CN102046514A Capacitive sensor with stress relief that compensates for package stress |
| 05/04/2011 | CN102046513A Semiconductor device with reduced sensitivity to package stress |
| 05/04/2011 | CN102044530A System packaging structure and manufacture method thereof |
| 05/04/2011 | CN102042832A Micro electro mechanical system (MEMS) gyroscope, chip level temperature control method thereof and processing method thereof |
| 05/04/2011 | CN102040184A Micron/nanometer translation drive type structure |
| 05/04/2011 | CN101654216B Arc MEMS compliant bistable mechanism |
| 05/04/2011 | CN101614544B Micro electro mechanical system solid-state gyroscope with composite density and rigidity |
| 05/04/2011 | CN101561319B Capacitive MEMS non-refrigerated infrared detector and preparation method thereof |
| 05/03/2011 | CA2489437C Actuator in a microfluidic system for inducing electroosmotic liquid movement in a micro channel |
| 04/28/2011 | WO2010148398A3 A thin-film device and method of fabricating the same |
| 04/28/2011 | US20110095384 Single Crystal Silicon Sensor with Additional Layer and Method of Producing the Same |
| 04/27/2011 | EP1687237B1 Method to test the hermeticity of a sealed cavity micromechanical device and the device to be so tested |
| 04/27/2011 | CN1898150B Method for containing a device and a corresponding device |
| 04/27/2011 | CN102036908A Fabrication of microscale tooling |
| 04/27/2011 | CN102030307A Manufacturing method for micromechanical component and micromechanical component |
| 04/27/2011 | CN102030305A Micro suspension structure compatible with semiconductor element and manufacturing method thereof |
| 04/27/2011 | CN102030304A Micro-electromechanical pretreatment method and structure |
| 04/27/2011 | CN102030302A Micromechanical structure and method for manufacturing micromechanical structure |
| 04/27/2011 | CN102030301A Micro suspension structure compatible with semiconductor element and manufacturing method thereof |
| 04/27/2011 | CN101368826B Vibration isolation frame work decoupled silicon micro-gyroscope |
| 04/21/2011 | WO2011016859A3 Micromachined inertial sensor devices |
| 04/21/2011 | WO2010107619A3 Substrate with multiple encapsulated pressures |
| 04/21/2011 | WO2008122865A3 Micro-electro-mechanical system micro mirror |
| 04/21/2011 | DE102010040514A1 Doppelaxialer, schockrobuster Drehratensensor mit linearen und rotatorischen seismischen Elementen Doppelaxialer, shock robust rotation rate sensor with linear and rotational seismic elements |
| 04/21/2011 | DE102009045720A1 Mikromechanisches Bauteil mit einer verstellbaren Komponente Micromechanical element with an adjustable component |
| 04/21/2011 | DE102009045696A1 Sensor zur kapazitiven Erfassung einer mechanischen Auslenkung Sensor for the capacitive sensing a mechanical deflection |
| 04/21/2011 | DE10128577B4 Halbleiterdrucksensor mit Dehnungsmesser und Schaltungsabschnitt auf einem Halbleitersubstrat A semiconductor pressure sensor with strain gauges and circuit portion on a semiconductor substrate |
| 04/20/2011 | CN201802574U Three-dimensional array for miniature silica-based electroosmotic pump |
| 04/20/2011 | CN102020236A Micro-electromechanical system chip and package method thereof |
| 04/20/2011 | CN102020235A Low-moisture content packaging method for thin outline (TO) packaging structure and packaging assembly thereof |
| 04/20/2011 | CN102020233A Micro-electro-mechanical systems (mems), systems, and operating methods thereof |
| 04/20/2011 | CN102020232A Encapsulation structure of microcomputer electroacoustic sensor |
| 04/20/2011 | CN101694829B Sensor of electromechanical performance and microscopic structure for transmission electronic microscope and manufacturing method thereof |
| 04/20/2011 | CN101567394B Vertical surrounding grid junction type field effect transistor, preparation method and applications thereof |
| 04/20/2011 | CN101538006B Method for preparing optical modulation thermal imaging focal plane array |
| 04/20/2011 | CN101510543B Integrated semiconductor device |
| 04/20/2011 | CN101452907B Vertical interconnecting through-hole for three-dimensional systematic encapsulation, and preparation thereof |
| 04/20/2011 | CN101441112B Non-refrigeration infrared detector array based on monocrystal silicon PN junction and preparing method thereof |
| 04/19/2011 | US7930766 Fluid delivery for scanning probe microscopy |
| 04/19/2011 | CA2717939A1 Centrifugal microfluidic system for nucleic acid sample preparation, amplification, and detection |
| 04/14/2011 | WO2011042597A1 A micromechanical resonator |
| 04/14/2011 | US20110085949 Microfluidic device, composition and method of forming |
| 04/14/2011 | DE10392851B4 Verfahren zum Herstellen eines Mikroelektromechanischen variablen Kondensators A method of manufacturing a microelectromechanical variable capacitor |
| 04/14/2011 | DE102009045645A1 Sensor device has base plate, inertial mass and spring, where distance of counter electrode from rotation axis is less than distance of another counter electrode from rotational axis |
| 04/14/2011 | DE102009045541A1 Method for manufacturing micromechanical device, involves arranging micro-electro-mechanical system structures and bond contact surfaces respectively in rows on micro-electro-mechanical system-wafer |
| 04/14/2011 | DE102009045432A1 Drehratensensor und Verfahren zum Betrieb eines Drehratensensors Rotation rate sensor and method of operation of a rotation rate sensor |
| 04/14/2011 | DE102009045431A1 Mikromechanische Struktur und Verfahren zum Betrieb einer mikromechanischen Struktur Micromechanical structure and method for operating a micromechanical structure |
| 04/14/2011 | DE102009045428A1 Herstellungsverfahren für ein mikromechanisches Bauteil und mikromechanisches Bauteil Manufacturing method for a micromechanical component and micromechanical component |
| 04/14/2011 | DE102009045422A1 Sensor arrangement, particularly rotation rate sensor, has substrate and sensor element arranged on substrate, where sensor element has seismic mass for sensing acceleration and seismic mass is deflected opposite to substrate |
| 04/14/2011 | DE102009045421A1 Mikromechanische Struktur, Vewrfahren zur Herstellung einer mikromechanischen Struktur und Verwendung einer mikromechanischen Struktur Micromechanical structure, Vewrfahren for manufacturing a micromechanical structure and use of a micromechanical structure |
| 04/14/2011 | DE102009045405A1 Mikrofluidische Struktur und Verfahren zum Positionieren eines Flüssigkeitsvolumens in einem mikrofluidischen System Microfluidic structure and method for positioning a volume of fluid in a microfluidic system |
| 04/13/2011 | EP2309130A2 Microfabricated elastomeric valve and pump systems |
| 04/13/2011 | EP2308797A2 Structure with a cavity comprising a bonding interface made from a getter material |
| 04/13/2011 | CN201793368U Adhesion-preventive structure of micro-electro-mechanical system |
| 04/13/2011 | CN102015522A Integrated carrier for microfluidic device |
| 04/13/2011 | CN102009946A Method for manufacturing component including micro-structured or nano-structured element |
| 04/13/2011 | CN102009944A Destressing construction technique for non-substrate molding package |
| 04/13/2011 | CN102009943A Microelectronic device and manufacturing method of micro-electromechanical resonator thereof |
| 04/13/2011 | CN102009942A Microsystem |
| 04/12/2011 | US7921858 Self-cleaning adhesive structure and methods |
| 04/07/2011 | WO2011040678A1 Cantilever sensor |
| 04/07/2011 | DE102010039952A1 Schwingungs-Winkelgeschwindigkeitssensor Vibration type angular velocity sensor |
| 04/07/2011 | DE102009048139A1 Micro-mechanical sensor for use as frequency-selective solid borne sound sensor, has mass elements connected with each other by flexible connection, where elements are oscillatable in same- and opposite phase to each other in same direction |
| 04/07/2011 | DE102009045404A1 Mikrofluidische Struktur und Verfahren zum Abmessen und/oder Positionieren eines Volumens einer Flüssigkeit Microfluidic structure and method for measuring and / or positioning a volume of a liquid |
| 04/07/2011 | DE102009045393A1 Micromechanical component i.e. z-sensor, for use as acceleration sensor in motor vehicle, has movable mass deflectably mounted at substrate, and spring structure with spring elements formed and running perpendicular to each other |
| 04/07/2011 | DE102009045391A1 Mikromechanische Struktur und Verfahren zur Herstellung einer mikromechanischen Struktur Micromechanical structure and method for making a micromechanical structure |
| 04/07/2011 | DE102009045385A1 Method for closing trench of e.g. microelectronic-electromechanical system component, involves applying lattice on micromechanical component over trench to be formed, and closing openings of lattice by separating filling layer on lattice |
| 04/06/2011 | EP2306511A1 Packaging device and base member for package |
| 04/06/2011 | EP1497616B1 Increasing the dynamic range of a mems gyroscope |
| 04/06/2011 | CN201787991U Micro liquid volume metering device based on micro electro mechanism system (MEMS) technique |
| 04/06/2011 | CN201787980U Encapsulation piece for heat type mass and flow sensor |
| 04/06/2011 | CN102001614A Method and system for MEMS devices |
| 04/06/2011 | CN102001613A Microelectronic device and manufacturing method thereof, and micro electromechanical packaging structure and packaging method thereof |
| 04/06/2011 | CN101544347B Bidirectional bistable microdrive based on electrothermal and electromagnetic drive |
| 03/31/2011 | WO2011037534A1 A wafer level package and a method of forming a wafer level package |