Patents for B81B 7 - Micro-structural systems (8,983)
12/2010
12/14/2010US7851968 Optimized energy conversion device
12/09/2010WO2010141942A2 Mems switch with latch mechanism
12/09/2010WO2010141351A2 Wafer bonding technique in nitride semiconductors
12/09/2010WO2010141338A2 Microdischarge-based pressure sensor and method
12/09/2010WO2010140792A2 Method for manufacturing 3-dimensional structures using thin film with columnar nano pores and manufacture thereof
12/09/2010WO2010140719A1 Micro calorimeter device with improved accuracy
12/09/2010WO2010139067A1 Semi-conductor sensor fabrication
12/09/2010WO2010139050A1 Mems micromirror and micromirror array
12/09/2010US20100307922 Electrowetting based digital microfluidics
12/09/2010DE102009026738A1 Mikromechanischer Beschleunigungssensor und Verfahren zur Herstellung eines Beschleunigungssensors A micromechanical acceleration sensor and method for manufacturing an acceleration sensor
12/09/2010DE102009026682A1 Bauelement mit einer mikromechanischen Mikrofonstruktur und Verfahren zu dessen Herstellung Component having a micromechanical microphone structure and process for its preparation
12/09/2010DE102009026677A1 Halbleiterbauelement mit einer mikromechanischen Mikrofonstruktur A semiconductor device comprising a micromechanical microphone structure
12/09/2010DE102009026676A1 Pressure sensor device for semiconductor chip arrangement, has sensor chip projecting pressure intake regions in housing chambers, where chambers include through-holes and pressure intake regions are supplied with absolute pressure
12/09/2010DE102009026639A1 Electromechanical microstructure for e.g. acceleration sensor, has movable elements connected with substrate and with area made of partially monocrystalline silicon, and spring with area made of partially polycrystalline silicon
12/09/2010DE102009026628A1 Mikromechanisches Bauelement und Verfahren zum Herstellen eines mikromechanischen Bauelements Micromechanical component and process for producing a micromechanical component
12/09/2010DE102007003810B4 Ultraschallwellen-Erzeugungsvorrichtung Ultrasonic wave generating device
12/09/2010CA2761028A1 Semi-conductor sensor fabrication
12/08/2010EP2259018A1 Gap control for die or layer bonding using intermediate layers
12/08/2010EP2258654A2 Arrangement of several MEMS sensors
12/08/2010CN1893137B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/08/2010CN101907690A Miniaturized amorphous magnetically soft alloy magnetic core solenoid flux gate sensor
12/08/2010CN101905854A Electronic component and its manufacturing method, and an electronic system
12/08/2010CN101905853A Integrated micro-electro-mechanical systems (MEMS) sensor device
12/08/2010CN101354404B Metal-silicon compound cantilever beam type microelectronic mechanical system probe card and manufacture method thereof
12/08/2010CN101308248B Oscillator device, optical deflector and image forming apparatus using the optical deflector
12/07/2010US7847885 locally adhered to substrate with polyimide surface and delaminated via thermal shock; eliminates under-etching
12/02/2010WO2010138968A2 Method and apparatus for providing high-fill-factor micromirror/micromirror arrays with surface mounting capability
12/02/2010WO2010136813A1 Support for self-deformable mirrors
12/02/2010DE102010001128A1 Akustischer Oberflächenwellendrucksensor Surface acoustic wave pressure sensor
12/02/2010DE102009026511A1 Mikro-Gyroskop zur Ermittlung von Rotationsbewegungen um mindestens eine von drei senkrecht aufeinanderstehenden Raumachsen Micro-gyroscope for detecting rotational movements around at least one of three mutually perpendicular spatial axes,
12/02/2010DE102009026507A1 Mikromechanisches Bauteil und Herstellungsverfahren für ein mikromechanisches Bauteil Micromechanical element and manufacturing method for a micromechanical component
12/02/2010DE102009026506A1 Mikromechanisches Bauteil und Herstellungsverfahren für ein mikromechanisches Bauteil Micromechanical element and manufacturing method for a micromechanical component
12/02/2010DE102009026502A1 Micromechanical component for micromirror arrangement, has torsion spring device, which extends in direction of torsion axis between anchoring area and mobile element
12/02/2010DE102009026501A1 Micro-mechanical device i.e. micromirror, has outer actuator and stator electrode components designed such that middle actuator electrode component is adjustable by applying voltage between outer actuator and stator electrode components
12/02/2010DE102009026496A1 Sensor, particularly micro-mechanical sensor for capacitive determination of measure, has conversion unit for imaging measure of capacitor, where compensation device is equipped with electrical connection device
12/02/2010DE102009002701A1 Mikromechanischer Sensor Micromechanical sensor
12/01/2010EP2254825A1 Integrated carrier for microfluidic device
12/01/2010CN201663687U Capacitance type micro-silicon microphone
12/01/2010CN1672929B Method for forming a chamber in an electronic device and device formed thereby
12/01/2010CN101903752A MEMS structure for flow sensor
12/01/2010CN101898745A Mems device and method of fabricating the same
12/01/2010CN101898744A Microelectromechanical gyroscope with enhanced rejection of acceleration noise
12/01/2010CN101898743A Micro-machined ultrasonic transducer
12/01/2010CN101561277B Micro gyro driven by reverse magnetic suspension and corona to rotate
12/01/2010CN101556290B Gas gyroscope for measuring the angular speed in any direction
12/01/2010CN101493327B Electromagnetic drive electrostatic pretension silicon micromechanical gyroscope
12/01/2010CN101458262B Six-beam structure acceleration sensor and method for making same
11/2010
11/30/2010US7843643 Laminated micromirror package
11/25/2010DE10324421B4 Halbleiterbauelement mit Metallisierungsfläche und Verfahren zur Herstellung desselben Of the same semiconductor device with metallization and methods for preparing
11/25/2010DE102005061343B4 Ultraschallwandler mit selbsttragender Anpassschicht sowie Verfahren zur Herstellung Ultrasonic converter with self-supporting matching layer and processes for preparing
11/24/2010EP1931461B1 Microfluidic device having at least one connecting channel linking two channels and method of directing and controlling fluids
11/24/2010CN201653605U Silicon-bonding based pressure sensor
11/24/2010CN201653422U Double-shaft MEMS gyroscope
11/24/2010CN101891141A Two-dimensional and double-cycle ordered structure array and preparation method thereof
11/18/2010US20100289855 Inkjet nozzle assembly with moving nozzle opening defined in roof of nozzle chamber
11/18/2010DE102009002986A1 Micro mechanical transducer element for ascertainment of physical size, particularly pressure variable or accelerating variable depending on deflection of beam, has beam that deflects itself while applying voltage to piezoresistors
11/17/2010EP2250249A1 Cell culture and cell assays using digital microfluidics
11/17/2010CN201639775U Micro electro mechanical system energy converter encapsulation structure
11/17/2010CN201639771U Capacitance microphone
11/17/2010CN201634415U Low-pulling stress film
11/17/2010CN201634414U Silicon material substrate
11/17/2010CN101889204A System and method of assessing a property of a flowing fluid
11/17/2010CN101888584A Silicon microphone
11/17/2010CN101885465A Mems sensor and electronic apparatus
11/16/2010US7833484 Method of checking the hermeticity of a closed cavity of a micrometric component and micrometric component for the implementation of the same
11/11/2010WO2010104478A8 Apparatus for processing a biological and/or chemical sample
11/11/2010US20100285981 Devices and methods for biochip multiplexing
11/11/2010DE202004021772U1 Waferverbindung unter Verwendung von Reaktivfolien zum massiv parallelen Häusen mikro-elektromechanischer Systeme Wafer bonding using reactive foils for massively parallel housings micro-electro-mechanical systems
11/11/2010DE102009020570A1 Monolithic switching circuit for use in device for measuring angular position and for testing material condition of e.g. toothed wheel, in safety-relevant automation system, has integrated device for evaluating and/or processing signals
11/10/2010EP2249583A2 Miniature silicon condenser microphone and method for producing same
11/10/2010EP2247526A1 Device for fluid spreading and transport
11/10/2010CN201628722U Micro-inertial sensor with large detection capacitance
11/10/2010CN101882015A Controller based on composite MEMS (Micro-electromechanical System) sensor and gesture control keying method thereof
11/10/2010CN101881676A Hexagonal silicon membrane piezoresistive pressure sensor for embedded monocrystal silicon cavity and method
11/10/2010CN101880023A Nanomaterial membrane structure
11/10/2010CN101388364B Electric isolation region forming method adopting low temperature process, single chip integration method
11/09/2010CA2668956C Charging guard with paschen stacking
11/04/2010WO2010088111A3 Bonded microelectromechanical assemblies
11/04/2010DE102010000631A1 Sensorvorrichtung und Sensorvorrichtungs-Anbringungsstruktur Sensor device and the sensor device mounting structure
11/04/2010DE102009019446A1 MEMS Mikrofon MEMS microphone
11/04/2010DE102009002723A1 Messelement Measuring element
11/04/2010DE102009002702A1 Mikromechanischer Sensor Micromechanical sensor
11/03/2010EP2246292A2 Package interface plate for mechanical isolation of MEMS structures
11/03/2010EP1529217B1 Micromechanical component
11/03/2010CN1494106B Method and device used for protecting wiring and integrated circuit device
11/03/2010CN101878412A Airflow sensor with pitot tube for pressure drop reduction
11/03/2010CN101877362A Silicon substrate with period structure
11/03/2010CN101876665A Full-decoupling dual-axis capacitive micromechanical accelerometer
11/03/2010CN101303365B Resonance type micro accelerometer
11/03/2010CN101123231B Encapsulation structure for wafer chip dimension of micro mechanical-electrical system and its making method
10/2010
10/28/2010WO2010124229A2 Method and system for providing resonant frequency change compensation in a drive signal for a mems scanner
10/28/2010DE102009002584A1 Sensor arrangement, has adhesive layer partially embedded into mold housing, where adhesive layer below contact section is thinner than adhesive layer below sensitive section at region of recess in support surface
10/28/2010DE102009002559A1 Sensoranordnung Sensor array
10/27/2010EP1805101B1 Method for assembling semiconductor chips, and corresponding semiconductor chip assembly
10/27/2010EP1356513B1 Molding of protective caps
10/27/2010CN1680186B Interlaced array of piano mems micromirrors
10/27/2010CN101871952A MEMS (Micro Electro Mechanical System) acceleration sensor
10/27/2010CN101871951A Micro-acceleration sensor
10/27/2010CN101871825A Membrane stress testing structure and method as well as manufacturing method
10/27/2010CN101871817A Hybrid-type pyroelectric uncooled focal plane detector and manufacturing process thereof
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