| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 03/14/2000 | US6037289 A protective coatings preventing the migration of alkali metals originating from the substrate |
| 03/14/2000 | US6037060 Sol for bonding expoxies to aluminum or titanium alloys |
| 03/14/2000 | US6036834 Selective electroplating of supported electrodes, then charging yields miniaturized biosensors |
| 03/09/2000 | WO2000013223A1 Nanoporous dielectric thin films |
| 03/09/2000 | WO2000012227A1 Silver film incorporating protective insoluble metallic salt precipitate |
| 03/07/2000 | US6033738 Dissolving a chlorosilyl group-containing compound and a fluoroalkyl group-containing silane compound in a solvent containing an alcohol and/or water content to obtain a silane substituted by an alkoxyl group or hydroxyl group |
| 03/07/2000 | US6033735 Dissolving and complex binding at least one salt of at least one iron group metal containing organic groups in at least one polar solvent with at least one complex former comprising functional groups of oh or nr3, where r is h or alkyl |
| 03/07/2000 | US6032356 Wafer-level test and burn-in, and semiconductor process |
| 03/02/2000 | WO2000011233A2 Fluxing process for galvanization of steel |
| 03/02/2000 | WO2000010736A1 Printing of electronic circuits and components |
| 03/02/2000 | WO1999061182A3 Layer system for protecting light metals and light metal alloys against corrosion |
| 02/29/2000 | US6030708 Transparent shielding material for electromagnetic interference |
| 02/29/2000 | US6029344 Composite interconnection element for microelectronic components, and method of making same |
| 02/24/2000 | WO2000010200A1 Wafer plating method and apparatus |
| 02/23/2000 | CN1245223A Process for electroplating on single surface of plastics without electrolysis and its resultant structure |
| 02/22/2000 | US6027817 Plated molded article and process for producing a plated molded article |
| 02/22/2000 | US6027765 A plurality of pinch rolls for continuously straightening out plated long doctor blades from the take-up reel and a straightening furnace for baking; gravure printing; corrosion and wear resistances; durability |
| 02/17/2000 | WO2000008681A1 Misted precursor deposition apparatus and method with improved mist and mist flow |
| 02/17/2000 | WO2000007753A1 Casting steel strip |
| 02/16/2000 | CN1049510C Method for producing heatable and refrigerable element for system haudling small quantities of liquid, and method for producing same |
| 02/15/2000 | USRE36573 Mixing sol gel solution with ceramic powder to produce uniform stable dispersion, applying to substrate surface, firing to remove organic constituents |
| 02/15/2000 | US6025619 Thin films of ABO3 with excess A-site and B-site modifiers and method of fabricating integrated circuits with same |
| 02/10/2000 | WO2000006958A2 A method for preventing water accumulation and ice formation on the evaporators and condensers of refrigerators |
| 02/09/2000 | EP0788728B1 Process for coating electrically non-conducting surfaces with connected metal structures |
| 02/09/2000 | EP0784351A4 Method of manufacturing electrodes for chemical current sources |
| 02/09/2000 | EP0680523B1 Preparation of alumina ceramic surfaces for electroless and electrochemical metal deposition |
| 02/09/2000 | CN1243888A Process for generating metallic atom cluster smaller than 10 nm or sequential 2D dot-matrix of metallic atoms on single-molecular film |
| 02/08/2000 | US6022812 Dielectric polysilicate films by vapor deposition of tetra-alkoxysilane(s) on a substrate; exposing to water and acid or base catalyst to gel; drying; high porosity; low dielectric constant; semiconductors; integrated circuits |
| 02/08/2000 | US6022596 Method for photoselective seeding and metallization of three-dimensional materials |
| 02/03/2000 | WO2000005757A1 Low temperature process for fabricating layered superlattice materials and making electronic devices including same |
| 02/03/2000 | WO2000005432A1 Method of forming metal film, and method of forming electrode |
| 02/03/2000 | DE19832249A1 Chemical nickel plating method for electrical circuit board manufacture has galvanically deposited nickel layer deoxidized and activated prior to chemical nickel plating |
| 02/02/2000 | EP0976848A1 Metal composition containing metal acetilide, blank having metallic coating formed therewith, and method for forming the metallic coating |
| 02/02/2000 | CN1049020C Polymeric resin for depositing palladium catalyst on a substrate and preparation method thereof and use |
| 02/02/2000 | CN1049019C Method for preparing metal nickel film by gamma ray irradiation |
| 02/01/2000 | US6020021 Aqueous bath containing a source of nickel cations, a hypophosphite reducing agent and a nickel chelating agent |
| 01/27/2000 | DE19833593A1 Selective metallization of e.g. ceramic, glass or plastic, e.g. for circuit board or electromagnetically screened housing, comprising mechanically depositing seeds on a rough substrate surface and then chemical plating |
| 01/26/2000 | EP0973959A2 Coating method for elongated metal blanks |
| 01/26/2000 | EP0973958A1 Method for providing a metal surface with a vitreous layer |
| 01/25/2000 | US6017967 Forming a stable aqueous dispersion of a metal sulfide with a dispersant and a stabilizer having at least three alkylene oxide groups in a chain and a hydrophilic--lipophilic balance; providing a uniform metal coatings over substrate |
| 01/25/2000 | US6017613 Pattern-wise light exposure of photoresist-free seed layer comprising a metal compound and a metal oxalate, then removing unexposed layer with an alkaline solution prior to electroless deposition of metal onto seed pattern |
| 01/25/2000 | US6017609 Water-repellent glass plate |
| 01/25/2000 | US6017580 Reflective layer of mirror, typically silver, is contacted with first solution containing specific cation and second solution containing specific anion or alkaline material which forms hydroxyl ions to form water insoluble precipitate |
| 01/20/2000 | WO2000003465A1 Spark plug electrode having iridium based sphere and method for manufacturing same |
| 01/20/2000 | WO2000003072A1 Method and apparatus for copper plating using electroless plating and electroplating |
| 01/19/2000 | EP0973195A1 Silver metallization by damascene method |
| 01/19/2000 | EP0973176A1 Nickel barrier end termination and method |
| 01/13/2000 | WO2000002241A1 Vapor deposition routes to nanoporous silica |
| 01/13/2000 | WO2000001862A1 Pretreating agent for metal plating, and method for metal plating using the same |
| 01/13/2000 | CA2336770A1 Vapor deposition routes to nanoporous silica |
| 01/12/2000 | EP0502023B1 Metallization of non-conductors |
| 01/11/2000 | US6013798 Water-based composition for decorating substrate, i.e., ceramic or glass with bright gold film upon firing comprising a non-radioactive gold thiolate |
| 01/11/2000 | US6013382 Apparatus and method for inhibiting the leaching of lead in water |
| 01/11/2000 | US6013320 Activating substrate by bringing it into contact with activating solution comprising a pd/sn solution at a selected temperature and selecting concentration of components of activating solution to allow optimum metallization |
| 01/11/2000 | US6013206 Dissolving lipid in a methanol/ethanol/water solvent with specific ratios of methanol and ethanol; allowing microtubules to self-assemble in the solvent; separating lipid microtubules from solvent |
| 01/11/2000 | CA2153345C Low polarization sensitivity gold mirrors on silica |
| 01/11/2000 | CA2069865C Metallization of non-conductors |
| 01/06/2000 | WO2000001208A1 Assembly of an electronic component with spring packaging |
| 01/06/2000 | WO2000000497A1 Precursors for growth of heterometal-oxide films by mocvd |
| 01/06/2000 | CA2336342A1 Precursors for growth of heterometal-oxide films by mocvd |
| 01/05/2000 | EP0612360B1 Electrodeposited composite coatings |
| 01/05/2000 | CN1240238A Self-catalytic nickel alloy plating layer and plating process thereof |
| 01/05/2000 | CN1240237A Electroless metal deposition on silyl hydride functional resin |
| 12/30/1999 | DE19828846A1 Verfahren zum Beschichten eines Substrats A method for coating a substrate |
| 12/29/1999 | WO1999067441A1 Foam-coating method for making antenna elements |
| 12/29/1999 | WO1999067321A2 Method for depositing a metallic layer on a polymer surface of a workpiece |
| 12/29/1999 | WO1999043869A3 Method for producing a corrosion protective coating and a coating system for substrates made of light metal |
| 12/29/1999 | EP0967301A2 Pickling-activating solution for pre-treatment of aluminium-steel composites before electroless tin plating |
| 12/29/1999 | EP0967299A1 Process for partial electroless plating |
| 12/29/1999 | EP0967298A2 Electroless metal deposition on silyl hydride functional resin |
| 12/29/1999 | EP0967297A1 Process for the production of articles covered with silica-base coats |
| 12/29/1999 | EP0967296A2 Method for coating a substrate |
| 12/29/1999 | EP0650537B1 Metallisation of plastics |
| 12/28/1999 | US6007868 Method of manufacturing ferroelectric bismuth-titanate layers on a substrate from solution |
| 12/22/1999 | EP0965656A1 Method for selective activation and metallisation of materials |
| 12/21/1999 | US6005705 Electrochromic thin-film systems and components thereof |
| 12/21/1999 | US6004633 Microstructured dies made of non-conductive resins. |
| 12/16/1999 | WO1999064168A1 Manufacturing process for noncontinuous galvanization with zinc-aluminum alloys over metallic manufactured products |
| 12/16/1999 | WO1997034320A9 Method and apparatus for fabricating silicon dioxide and silicon glass layers in integrated circuits |
| 12/16/1999 | CA2334596A1 Manufacturing process for noncontinuous galvanization with zinc-aluminum alloys over metallic manufactured products |
| 12/15/1999 | EP0964076A1 Microporous copper film and electroless copper plating solution for obtaining the same |
| 12/15/1999 | EP0799329B1 Conveyor device for vertically guiding plate-like objects for chemical or electrolytic surface-treatment |
| 12/15/1999 | CN1238227A Method for removing metal ion and pollutant from self-sedimentation bath |
| 12/14/1999 | US6001416 Suitable for use in thin film condensers and capacitors, piezoelectric devices, pyroelectric devices, and the like. |
| 12/09/1999 | WO1999062822A1 Titanium oxide layer |
| 12/09/1999 | DE19828811C1 Mordant activation solution for aluminum-steel compound material to be tin-plated |
| 12/08/1999 | CN1237649A Chemical nickel-plating method for surface of metal material |
| 12/07/1999 | US5998522 Coating solution containing polysiloxane and solvent |
| 12/07/1999 | US5998228 Method of testing semiconductor |
| 12/07/1999 | US5998011 Oxide particles of indium and tin having a particle diameter of 30 to 100 nm. |
| 12/07/1999 | US5997997 Substrate coated with a polymeric dielectric layer comprising hydroxyl groups and scavenging groups including sulfur moieties or atoms; surfactant on the dielectric layer; seed overlayer; electrolessly deposited metal layer |
| 12/02/1999 | WO1999061182A2 Layer system for protecting light metals and light metal alloys against corrosion |
| 12/02/1999 | DE19924687A1 Protecting light metals and their alloys from corrosion damage, especially for use in the vehicle construction industry |
| 12/01/1999 | CN1236984A Process for forming fine wiring |
| 12/01/1999 | CN1236829A Surface-treated metal component for reinforcing structures and article of manufactured comprising the same |
| 11/30/1999 | US5993892 Method of monitoring and controlling electroless plating in real time |
| 11/25/1999 | WO1999060189A2 Method for metal coating of substrates |
| 11/25/1999 | WO1999060095A2 Formation and metallization of high aspect ratio lipid microtubules |
| 11/25/1999 | DE19823112A1 Dielectric substrates for producing electrochemical electrodes |
| 11/25/1999 | CA2331757A1 Process for coating substrates with metals |