Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
08/1999
08/03/1999US5932281 Method of manufacturing bi-layered ferroelectric thin film
07/1999
07/29/1999WO1999037582A1 Titanium oxide colloidal sol and process for the preparation thereof
07/28/1999CN1224075A Brightener for chemical nickel plating
07/27/1999US5928727 Etching a surface of said article with an etching solution comprising trivalent chromium ions, hexavalent chromium ions and chromic acid-sulfuric acid, catalyzing surface with noble metal salt solution, electrolessly depositing metal layer
07/27/1999US5926951 Method of stacking electronic components
07/22/1999WO1999036353A1 Process for the formation of oxide ceramic thin film
07/21/1999EP0930647A1 Method to selectively fill recesses with conductive metal
07/21/1999EP0752019B1 Alkaline composition for tin immersion coating
07/21/1999EP0698191A4 Plumbing fixture carrying drinking water comprised of a copper alloy
07/20/1999US5925415 Electroless plating of a metal layer on an activated substrate
07/20/1999US5925403 Method of coating a copper film on a ceramic substrate
07/20/1999US5925183 Method for producing layer-structured perovskite thin film of bismuth-based compounds having ferroelectric properties
07/15/1999WO1999035305A1 Method for designing and producing a micromechanical device
07/15/1999DE19800745A1 Design- und Herstellungsverfahren für eine mikromechanische Vorrichtung Design and manufacturing method for a micromechanical device
07/13/1999US5922414 Process for plating
07/13/1999US5922397 Metal-plating of cured and sintered transient liquid phase sintering pastes
07/07/1999EP0927776A1 Sliding member, method of treating surface of the sliding member and rotary compressor vane
07/07/1999EP0927775A2 Process for forming an electrode for a ceramic sensor element by electroless plating
07/07/1999EP0927507A1 Conducting path structures situated on a non-conductive support material, especially fine conducting path structures and method for producing same
07/06/1999US5920798 Method of preparing a semiconductor layer for an optical transforming device
07/06/1999US5919514 Process for preparing electroded donor rolls
07/01/1999DE19757320A1 Fuel cell electrode has a non-electroplated catalytically active material layer
06/1999
06/30/1999EP0926264A2 Displacement tin bath
06/30/1999EP0926263A2 Method for the manufacture of multilayer printed circuit boards
06/30/1999EP0926262A1 Process for selective deposition of a metal layer
06/30/1999EP0926261A2 Coatings for gas turbine compressor components
06/30/1999EP0925606A1 Liquid source formation of thin films using hexamethyl-disilazane
06/30/1999EP0925384A1 Substrates seeded with precious metal salts, process for producing the same and their use
06/29/1999US5917707 Flexible contact structure with an electrically conductive shell
06/29/1999US5916944 Silica precursor resin and a filler diluted in a solvent, wherein the filler is one which reacts in an oxidizing atmosphere to liberate heat.
06/29/1999US5916485 Method of manufacturing highly conducting composites containing only small proportions of electron conductors
06/29/1999CA2059246C Recovery process for electroless plating baths
06/24/1999WO1999031293A1 Pretreating fluid and method of pretreatment for electroless nickel plating
06/16/1999EP0886894A4 Contact carriers (tiles) for populating larger substrates with spring contacts
06/16/1999CN1219981A Electroless copper plating solution and method for electroless copper plating
06/15/1999US5911965 Process for producing tungsten oxide
06/10/1999WO1999028534A1 Process for the production of articles covered with silica-base coats
06/09/1999EP0920544A1 Durable electrode coatings
06/08/1999US5910340 Electroless nickel plating solution and method
06/08/1999US5910336 Process for producing light-absorbing chalcopyrite film
06/03/1999WO1999027159A1 Metal composition containing metal acetilide, blank having metallic coating formed therewith, and method for forming the metallic coating
06/02/1999CN1218284A Process for integrated circuit wiring
06/01/1999US5909042 Electrical component having low-leakage current and low polarization fatigue made by UV radiation process
05/1999
05/26/1999EP0917719A2 Semiconductor supercapacitor system, method for making same and articles produced therefrom
05/26/1999EP0917598A1 Currentless selective metallization of structured metal surfaces
05/26/1999EP0917597A2 Conductor track structures arranged on a nonconductive support material, especially fine conductor track structures, and method for producing the same
05/26/1999CN1217389A Surface alloyed aluminium-alloy section and producing method therefor
05/19/1999EP0754249B1 Use of a compound
05/18/1999US5905336 Method of manufacturing a glass substrate coated with a metal oxide
05/14/1999WO1999023152A1 Electrically conductive filler and method for the production thereof
05/14/1999WO1999022894A1 Coated powder and process for the preparation thereof
05/14/1999CA2309074A1 Electrically conductive filler and method for the production thereof
05/12/1999EP0915183A1 Tinning of copper tubes
05/12/1999EP0915182A1 Plating method
05/11/1999US5901997 Conveyor device for vertically guiding plate-like objects for electroylic surface-treatment
05/06/1999EP0913502A1 Method of electroplating nonconductive plastic molded product
05/06/1999EP0913498A1 Electroless plating processes
05/06/1999EP0913497A1 Method and apparatus for plating a substrate
05/06/1999EP0590046B1 Basic accelerating solutions for direct electroplating
05/06/1999DE19851101A1 Selective deposition of a metal layer or polar compound
05/04/1999US5900738 Method of testing semiconductor devices
04/1999
04/28/1999CN1215096A Plating method
04/27/1999US5897965 Heat treated to temperature below melting; high hardness, lubricating (sliding) ability, wear resistance for aluminum alloys, such as where hfc-134a exists as refrigerant
04/27/1999US5897848 Mixing sodium hypophosphite and nickel sulfate to produce sodium sulfate and nickel hypophosphite, separating nickel hypophosphite from waste stream containing sodium sulfate, cooling to crystallize out sodium sulfate, recycling waste
04/27/1999US5897692 Electroless plating solution
04/27/1999US5897326 Method of exercising semiconductor devices
04/22/1999WO1999019722A1 Chemical plating method, electrolytic cell and automotive oxygen sensor using it
04/22/1999DE19745797A1 Aqueous electroless gold plating solution contains a trivalent gold salt and formaldehyde
04/22/1999CA2307346A1 Chemical plating method, electrolytic cell and automotive oxygen sensor using it
04/21/1999EP0909838A1 Electroless copper plating solution and method for electroless copper plating
04/21/1999EP0724657B1 Protective coating
04/20/1999US5895563 Immersion mixture of iron, fluoride, and acid compounds; cyanide-free; uniformity; electroplating
04/15/1999WO1999018255A1 Selective substrate metallization
04/15/1999WO1999018254A2 Solution and method for currentless deposition of gold coating
04/15/1999WO1999018253A2 Method and solution for producing gold coating
04/15/1999WO1999008803A3 Method for forming a metallic film using non-isothermal plasma
04/15/1999DE19745601A1 Solution for current-less gold plating
04/14/1999EP0795043B1 Silver plating
04/13/1999US5894064 Solution routes to metal oxide films through ester elimination reactions
04/13/1999US5894047 Heat reflecting glass
04/13/1999US5894038 Direct deposition of palladium
04/07/1999CN1213457A Method and apparatus for babricating silion dioxide and silicon glass layer in integrated circuits
04/06/1999US5892618 Low polarization sensitivity gold mirrors on silica
04/06/1999US5891523 Heat treatment for dimensional distortion, coating
04/06/1999US5891513 Semiconductors
04/06/1999CA2016081C Deposition of silver layer on nonconducting substrate
04/01/1999WO1999015280A1 Ordered mesoporous thin films
04/01/1999DE19844755A1 Multiple seed process for mixed oxide functional ceramic thin film production
03/1999
03/31/1999EP0905278A1 Method of manufacturing a ceramic coating
03/31/1999EP0905277A1 Process for making a Bi-containing ceramic layer like strontium-bismuth-tantalate
03/31/1999EP0904887A1 Gold plated solder material and method of fluxless soldering using said solder
03/31/1999CN1212734A Misted precursor deposition apparatus and method with improved mist and mist flow
03/31/1999CN1212733A Data carrier for storing binary data and process for producing data carrier
03/30/1999US5888583 Misted deposition method of fabricating integrated circuits
03/30/1999US5888372 Continuously from nonconducting film by electroless and galvanic metallization
03/30/1999CA2036647C Method of producing grain oriented silicon steel sheets having improved magnetic properties and bending properties
03/25/1999WO1999013994A1 Deposition of substances on a surface
03/25/1999WO1998059091A3 Activation bath for electroless nickel plating
03/25/1999CA2302252A1 Deposition of substances on a surface
03/24/1999EP0903323A1 Process for producing hypophosphite compounds