| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 05/22/2001 | US6235352 Method of repairing a thermal barrier coating |
| 05/22/2001 | US6235093 Solutions of water and noble metals for reduction |
| 05/17/2001 | WO2001034310A1 Process for the non-galvanic tin plating of copper or copper alloys |
| 05/17/2001 | DE19954613A1 Verfahren zur stromlosen Verzinnung von Kupfer oder Kupferlegierungen A method for the electroless tin plating of copper or copper alloys |
| 05/16/2001 | EP1099962A1 Niobium oxide-based layers for thin film optical coatings and processes for producing the same |
| 05/16/2001 | EP1099012A1 Method and apparatus for copper plating using electroless plating and electroplating |
| 05/15/2001 | US6232227 Method for making semiconductor device |
| 05/10/2001 | WO2001032951A2 Chemical fluid deposition for the formation of metal and metal alloy films on patterned and unpatterned substrates |
| 05/09/2001 | EP1097472A1 Vapor deposition routes to nanoporous silica |
| 05/09/2001 | EP1097254A1 Foam-coating method for making antenna elements |
| 05/09/2001 | CN1294639A Method for producing printed conductor structures |
| 05/09/2001 | CN1065574C Acid displacement-plating liquid compsn. for steel strips plated with zinc-contg. metal |
| 05/08/2001 | US6228510 Coating and method for minimizing consumption of base material during high temperature service |
| 05/08/2001 | US6228426 Process for preparing composite inorganic membranes |
| 05/03/2001 | DE10028111A1 Anorganische,filmbildende Überzugszusammensetzung, Herstellungsverfahren hierfür und Verfahren zur Ausbildung eines anorganischen Films Inorganic film-forming coating composition, preparation method therefor and method of forming an inorganic film |
| 05/02/2001 | EP1095989A2 Resin-coated metal sheet for parts of electronic machinery and tools and production method thereof |
| 05/02/2001 | EP1095434A1 Spark plug electrode having iridium based sphere and method for manufacturing same |
| 05/01/2001 | US6224983 Article that resists microbial growth, |
| 05/01/2001 | US6224741 Electrolyte process using a hydrogen storing metal member |
| 04/26/2001 | WO2001029283A1 Plating method, wiring forming method and devices therefor |
| 04/26/2001 | WO2001028779A1 Optical recording medium and apparatus for manufacture thereof |
| 04/26/2001 | WO2000069790A3 Method of producing aluminum oxides and products obtained on the basis thereof |
| 04/25/2001 | EP1094089A1 Electrolyte for electrochromic systems |
| 04/25/2001 | CN1292430A Copperplating additive, its preparation method and application in coppered welding wire |
| 04/24/2001 | US6221440 Process for plating metal coating |
| 04/19/2001 | WO2001027983A1 Method and apparatus for forming interconnection |
| 04/19/2001 | US20010000332 Reflective layer of mirror, typically silver, is contacted, preferably with a first solution containing a specific cation and a second solution containing a specific anion, to form a water insoluble precipitate on the silver surface |
| 04/19/2001 | DE19945267C1 Verfahren zur Anbringung von flächigen Außenelektroden auf einem piezokeramischen Vielschichtaktor Method of mounting area external electrodes on a piezoceramic multilayer actuator |
| 04/18/2001 | EP1092755A1 Coating composition |
| 04/18/2001 | EP1092338A1 Assembly of an electronic component with spring packaging |
| 04/18/2001 | EP1091965A1 Precursors for growth of heterometal-oxide films by mocvd |
| 04/17/2001 | US6218019 Corrosion resistant mirror |
| 04/17/2001 | CA2211184C Method and apparatus for delivering electromagnetic energy into a solution |
| 04/11/2001 | EP1090165A2 Layer system for protecting light metals and light metal alloys against corrosion |
| 04/11/2001 | EP1089830A1 Low etch alkaline zincate composition and process for zincating aluminum |
| 04/11/2001 | EP0779941B1 A process for treating aluminium alloys |
| 04/11/2001 | CN1290580A Method for producing product mounted with member and product mounted with member |
| 04/10/2001 | US6215670 Method for manufacturing raised electrical contact pattern of controlled geometry |
| 04/05/2001 | WO2001024257A1 Methods and apparatus for treating seed layer in copper interconnctions |
| 04/05/2001 | WO2001023637A1 Electroless plating method |
| 04/05/2001 | WO2001023103A1 Method, solution and paint for forming a metallic mirror surface or metallic luster |
| 04/05/2001 | DE10038677A1 Stahlblech mit elektrostatisch aufgebrachten Fasern und Herstellungsprozess hierfür Sheet steel with electrostatically applied fibers and manufacturing process therefor |
| 04/04/2001 | EP1088121A2 Method for metal coating of substrates |
| 04/04/2001 | EP1088117A2 Method for depositing a metallic layer on a polymer surface of a workpiece |
| 04/04/2001 | CN1290309A Organocuprous precursors for chemical vapor deposition of copper film |
| 04/03/2001 | US6210781 Method for photoselective seeding and metallization of three-dimensional materials |
| 04/03/2001 | US6210752 All-alkoxide synthesis of strontium-containing metal oxides |
| 03/29/2001 | WO2001022503A1 Method for applying flat outer electrodes to a piezoceramic multi-layer actuator |
| 03/28/2001 | EP1087433A1 Process for the formation of silicon oxide films |
| 03/28/2001 | EP1087428A1 Method for forming a silicon film and ink composition for ink jet |
| 03/28/2001 | EP1086807A2 Metal article coated with multilayer surface finish for porosity reduction |
| 03/27/2001 | US6207351 Method for pattern seeding and plating of high density printed circuit boards |
| 03/27/2001 | US6207280 Multilayer-coated powder and process for producing the same |
| 03/21/2001 | EP1084992A1 Method for the deposition of zirconia layers by using soluble powders |
| 03/20/2001 | US6203929 Gold plated solder material and method of fluxless soldering using solder |
| 03/20/2001 | US6203608 Ferroelectric thin films and solutions: compositions |
| 03/15/2001 | DE19943789A1 Verfahren zur Abscheidung von Zirkonoxid-Schichten unter Verwendung von löslichen Pulvern A process for the deposition of zirconia layers using soluble powders |
| 03/14/2001 | EP1083245A2 Fluid delivery systems for electronic device manufacture |
| 03/14/2001 | EP1082471A1 Method for coating surfaces of copper or of a copper alloy with a tin or tin alloy layer |
| 03/13/2001 | US6200636 Preelectroless plating surface of steel with metal layer |
| 03/13/2001 | US6200451 Method for enhancing the solderability of a surface |
| 03/08/2001 | WO2001016052A2 Process for making chemically bonded sol-gel ceramics |
| 03/08/2001 | CA2382591A1 Process for making chemically bonded sol-gel ceramics |
| 03/07/2001 | CN1286504A Method for mfg. hydrogen-storage alloy for Ni-H alkaline accumulator |
| 03/07/2001 | CN1286318A Process and equipment for regenerating chemically nickel-plating liquid |
| 03/06/2001 | US6197688 Interconnect structure in a semiconductor device and method of formation |
| 03/06/2001 | US6197366 Electroconductive metal film from low temperature baking fromnitrate salt and cyano compound, carbonyl compound or organic salt of metal and amino |
| 03/06/2001 | US6197364 Production of electroless Co(P) with designed coercivity |
| 03/01/2001 | DE19941043A1 Bath for producing powdered materials, especially carbon powders contains an organic solvent to which is added a hydrophobic complex of a metal with organic ligands |
| 03/01/2001 | DE19919709A1 Partiell galvanisierbares Polymerenformteil Partially galvanisierbares polymer molding |
| 02/28/2001 | EP1078114A1 Coating compositions containing nickel and boron |
| 02/28/2001 | CN1285420A Chemical nickel plating method for increasing mechanical strength of cohesive neodymium-ferro-boron permanent magnet |
| 02/27/2001 | US6194785 Method for circuitizing through-holes by photo-activated seeding |
| 02/27/2001 | US6194369 Pickling/activation solution for the pretreatment of aluminum-steel composites prior to dip tinning |
| 02/27/2001 | US6194032 Selective substrate metallization |
| 02/27/2001 | US6193789 Electroless copper plating solution and method for electroless copper plating |
| 02/20/2001 | US6190789 Slide member |
| 02/20/2001 | US6190788 Having a high crack-forming thickness limit; from a reaction product of a polysilazane compound and a dialkylalkanolamine |
| 02/20/2001 | US6190728 Wet coating process comprises steps of alternately stacking seeding layers and composite metal oxide layers to form stacked layer, seeding layers having same crystal structure as composite metal oxide and being formable at low temperature |
| 02/15/2001 | WO2001011098A2 Copper deposit process |
| 02/15/2001 | WO2001010572A1 Diffusion barrier and adhesive for parmod application to rigi d printed wiring boards |
| 02/15/2001 | CA2381503A1 Copper deposit process |
| 02/14/2001 | EP0747507B1 Pretreatment solution for electroless plating, electroless plating bath and electroless plating method |
| 02/13/2001 | US6187378 Automated system and method for electroless plating of optical fibers |
| 02/08/2001 | WO2000075396B1 Electroless coatings formed from organic solvents |
| 02/07/2001 | CN1283213A Electrically conductive filer and method for the preparation thereof |
| 02/07/2001 | CN1283143A Coated powder and process for the preparation thereof |
| 02/06/2001 | US6184587 Resilient contact structures, electronic interconnection component, and method of mounting resilient contact structures to electronic components |
| 02/06/2001 | US6183828 Plating on nonmetallic disks |
| 02/06/2001 | US6183617 Self-regulating, acidic electrolytes for dip-tin-plating aluminum alloys |
| 02/06/2001 | US6183554 Cleaned surface adsorbs polar compound |
| 02/06/2001 | US6183546 Hardness, wear and corrosion resistance |
| 02/06/2001 | US6183545 Aqueous solutions for obtaining metals by reductive deposition |
| 02/01/2001 | WO2001008213A1 REDUCED ELECTROMIGRATION AND STRESS INDUCED MIGRATION OF Cu WIRES BY SURFACE COATING |
| 02/01/2001 | DE19935434A1 Process for the current-less deposition of metallic layers e.g., silver on a substrate comprises producing a closed layer on the substrate, removing the solvent and contacting the layer with a solution containing the metal to be deposited |
| 01/31/2001 | CN1281909A System for automatic stabilizing chemical bath |
| 01/30/2001 | US6180524 Rinsing in oxygen-free ammonia solution; drainage; electroless metal deposition; electroplating |
| 01/30/2001 | US6180523 Forming contact hole in insulating layer exposing substrate; forming an adhesion layer on sidewalls of insulating layer and exposed substrate; electrolessly depositing barrier layer; activating; electrolessly plating; patterning |
| 01/30/2001 | US6180252 Semiconductor supercapacitor system, method for making same and articles produced therefrom |
| 01/30/2001 | US6180222 Gold-containing nanoporous aluminum oxide membranes a process for their production and their use |