| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 01/30/2001 | US6180179 Displace deposition-plated and doping-modified metal material and process for producing same |
| 01/30/2001 | US6180164 With copper conductors, fired in a non-oxidizing atmosphere so as not to oxidize the copper terminations yet without reducing the thick-film resistor to metallic ruthenium, ink containing a matrix material and an organic vehicle; |
| 01/30/2001 | CA2222158C Self accelerating and replenishing non-formaldehyde immersion coating method and composition |
| 01/25/2001 | WO2001006034A1 Spectacle frame surface treatment method |
| 01/25/2001 | WO2001005518A1 Process for plating plastics using a catalytic filler |
| 01/24/2001 | EP1069967A1 Composite powder for diffusion-welding |
| 01/24/2001 | CN1281059A Process for preparing catalyzing liquid of hard surface alloy |
| 01/23/2001 | US6177130 Forming an electrochromic devices by coating with a solution comprising a solvent, soluble lithium source, and a soluble vanadium source, heating to form a protective coatings |
| 01/18/2001 | DE19933083A1 Process for nickel plating copper-plated objects, e.g., circuit boards, comprises initially applying a copper layer to the object, activating the copper layer by applying a thin tin layer, and applying a nickel layer to the copper layer |
| 01/17/2001 | EP1069209A1 Process for plating plastics using a catalytic filler |
| 01/17/2001 | EP1069074A1 Film-forming composition and process for its production |
| 01/17/2001 | EP0850203B1 Titanium dioxide-based photocatalytic coating substrate, and titanium dioxide-based organic dispersions |
| 01/17/2001 | CN1060697C Composition and method for chemical copper plating of rare-earth containing nickel-based hydrogen storage alloy |
| 01/16/2001 | US6174647 Providing circuit layer comprising photoresist and via opening; roughening; adsorbing compound having ligand for palladium on photoresist; applying photoresist; catalyzing; metallized exposed palladium compound to form metal pad |
| 01/16/2001 | US6174564 Used to form metal oxides for use in integrated circuits, by mixing in a c7-10 alkane solvent and reacting a metal alkoxide with a metal carboxylate to form a mixed metal alkoxycarboxylate of given formula |
| 01/16/2001 | US6174353 Alkali solution, a reducing agent and a complexing agent |
| 01/16/2001 | US6174213 Fluorescent lamp and method of manufacturing same |
| 01/11/2001 | WO2001002623A1 Coating method |
| 01/10/2001 | EP1067830A1 A chemical solution treatment equipment |
| 01/10/2001 | EP1067595A2 Liquid precursor mixtures for deposition of multicomponent metal containing materials |
| 01/10/2001 | EP1067590A2 Electroplating system |
| 01/10/2001 | EP1066895A2 Article equipped with structural members and method for its manufacture |
| 01/04/2001 | WO2001000901A1 Corrosion resistant component of semiconductor processing equipment and method of manufacturing thereof |
| 01/04/2001 | WO2001000425A1 Article manufacturing method |
| 01/04/2001 | DE19929616A1 Coating agent for protecting ceramics or glass against thermal oxidation comprises a phosphorous silicate nanosol which is a hydrolysis product of metal alkoxides or metal halides and acidic organophosphate solution |
| 01/03/2001 | EP1064656A1 Thick complex porous structures made electrically conductive, and corresponding method for conductive activation |
| 01/02/2001 | US6168836 Process for plating upon a polymeric surface |
| 01/02/2001 | US6168825 Selecting substrate having clean surface to permit adhesion of blue coating of gold; applying solid phase sensitizing material; applying liquid mixture of reducing reagent and gold ion containing reagent; allowing to react and form coating |
| 12/28/2000 | WO2000079023A1 Method for printing a catalyst on substrates for electroless deposition |
| 12/27/2000 | EP1062850A2 Method for producing printed conductor structures |
| 12/26/2000 | US6165912 Electroless metal deposition of electronic components in an enclosable vessel |
| 12/26/2000 | US6165340 Plating a shield to a permeable core in a pattern by computer and configured to achieve a controlled leakage inductance, where the predetermined pattern covers less than the entire surface area of the permeable core |
| 12/20/2000 | EP1060291A2 Method for producing a corrosion protective coating and a coating system for substrates made of light metal |
| 12/20/2000 | EP1060289A1 Method of preparing lithiated vanadium oxide-coated substrates of optical quality |
| 12/20/2000 | CN1277268A Composition and making process of electrothermal semiconductor film |
| 12/19/2000 | US6162728 Method to optimize copper chemical-mechanical polishing in a copper damascene interconnect process for integrated circuit applications |
| 12/19/2000 | US6162498 Method for providing a metal surface with a vitreous layer |
| 12/19/2000 | US6162278 Photobiomolecular deposition of metallic particles and films |
| 12/14/2000 | WO2000075415A1 An article of clothing having antibacterial, antifungal, and antiyeast properties |
| 12/14/2000 | WO2000075396A1 Electroless coatings formed from organic solvents |
| 12/14/2000 | WO2000075395A1 Electrically conductive polymeric foam and method of preparation thereof |
| 12/14/2000 | CA2376482A1 An article of clothing having antibacterial, antifungal, and antiyeast properties and a yarn for use therein |
| 12/13/2000 | EP1059174A1 Acid stable aqueous dispersion of metal particles and applications |
| 12/13/2000 | CN1276441A Three-layer coating-plating technology for metal surface |
| 12/07/2000 | WO2000073722A1 Corrosion resistant container and gas delivery system |
| 12/07/2000 | WO2000046419A3 Metallizable moulded part |
| 12/06/2000 | CN1275636A Electroplating method and the used liquid front body |
| 12/05/2000 | US6156673 Process for producing a ceramic layer |
| 12/05/2000 | US6156413 Glass circuit substrate and fabrication method thereof |
| 12/05/2000 | US6156390 Process for co-deposition with electroless nickel |
| 12/05/2000 | US6156388 Applying to substrate a mixture comprising aqueous sol or solution of matrix-forming oxidizable element and a pigment-forming metal-containing colloid, vitrification of coating |
| 12/05/2000 | US6156385 Treating an unsaturated polyampholyte resin coating with weak alkali solution to form alkali salt with the acid groups of resin, treating with palladium ion-containing acidic solution and reducing to form absorbed palladium catalyst, plating |
| 12/05/2000 | US6156218 Method of pretreatment for electroless nickel plating |
| 12/05/2000 | CA2185717C Process of mechanical plating |
| 11/29/2000 | EP1055015A1 Method for designing and producing a micromechanical device |
| 11/28/2000 | US6153539 Using hexafluorotitanic acid |
| 11/28/2000 | US6153317 Perovskite phase thin films and method of making |
| 11/23/2000 | WO2000069790A2 Method of producing aluminum oxides and products obtained on the basis thereof |
| 11/22/2000 | EP1054081A2 Composition and process for treating a surface coated with a self-accelerating and replenishing non-formaldehyde immersion coating |
| 11/21/2000 | US6150186 Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive |
| 11/16/2000 | DE19922492A1 Production of a nano-corundum used in the production of aluminum oxide sintered products uses chlorine-free inorganic precursors as starting material in a liquid medium to form a sol which is subsequently hydrolyzed |
| 11/15/2000 | EP1052225A1 Titanium oxide colloidal sol and process for the preparation thereof |
| 11/14/2000 | US6146774 Sliding member, method for treating surface of the sliding member and rotary compressor vane |
| 11/14/2000 | US6146702 Electroless nickel cobalt phosphorous composition and plating process |
| 11/14/2000 | US6146700 Pretreating solution for electroless plating, electroless plating bath and electroless plating process |
| 11/09/2000 | WO2000067300A1 Liquid precursors for formation of materials containing alkali metals |
| 11/09/2000 | WO2000066807A1 Stainless steel material with excellent antibacterial property and process for producing the same |
| 11/09/2000 | WO2000040775A3 Method for coating reactors for high pressure polymerisation of 1-olefins |
| 11/09/2000 | WO2000040773A3 Heat exchanger with a reduced tendency to produce deposits and method for producing same |
| 11/08/2000 | CN1272892A Conductor track structures arranged on nonconductive material, espectially fine conductor track structure, and method for producing the same |
| 11/07/2000 | US6143366 Reducing the crystallization temperature |
| 11/07/2000 | US6143356 Diffusion barrier and adhesive for PARMOD™ application to rigid printed wiring boards |
| 11/07/2000 | US6143157 Covering core with a barrier coating to protect a magnetic property of core from alteration by subsequent plating, then plating a conductive shield to the core by depositing a seed layer in pattern defined by mask, plating on seed layer |
| 11/07/2000 | US6143063 Misted precursor deposition apparatus and method with improved mist and mist flow |
| 11/07/2000 | US6143059 Bath comprises nickel sulfate, sodium hypophosphite as a reducing agent, acetic acid as a buffer, traces of lead as a stabilizer, and includes a citrate used as a complexing agent associated with a gluconate used as catalyst and stabilizer |
| 11/02/2000 | WO2000065643A1 Improvements in or relating to sol gel processing of lead zirconate titanate thin films |
| 11/02/2000 | EP1048757A1 Plating method and apparatus |
| 11/02/2000 | EP1048756A1 Substrate plating device |
| 11/02/2000 | EP1048748A2 Moulded polymer part which can be partially galvanised |
| 11/02/2000 | EP1048618A1 Process for making gold salt for use in electroplating process |
| 10/31/2000 | US6140234 Method to selectively fill recesses with conductive metal |
| 10/30/2000 | CA2306319A1 Process for making gold salt for use in electroplating process |
| 10/26/2000 | WO2000063461A1 Novel organocuprous precursors for chemical vapor deposition of a copper film |
| 10/26/2000 | DE19918833A1 Non-conductive substrate surfaces, especially polymer resist layer and copper surface regions of circuit boards, are electroplated after precious metal nucleation and contact with an electroless reduction copper bath |
| 10/25/2000 | EP1045936A1 Aqueous compositions comprising complexing agents and uses therof |
| 10/24/2000 | US6136693 Method for planarized interconnect vias using electroless plating and CMP |
| 10/24/2000 | US6136513 Method of uniformly depositing seed and a conductor and the resultant printed circuit structure |
| 10/19/2000 | WO2000061287A1 Metal-deposited active carbon having selective adsorption capability for polar contaminants and preparation method thereof |
| 10/19/2000 | WO2000035259A3 Method for producing printed conductor structures |
| 10/17/2000 | US6133092 Low temperature process for fabricating layered superlattice materials and making electronic devices including same |
| 10/17/2000 | US6133050 Coating with a liquid precursor containing a plurality of metal moieties, drying by heating and exposing to an ultraviolet radiation to increase the c-axis orientation in metal oxide layered superlattice material thin film |
| 10/17/2000 | CA2120615C Electrodeposited composite coatings |
| 10/12/2000 | WO2000059622A1 Method for coating particles |
| 10/12/2000 | WO1999067321A3 Method for depositing a metallic layer on a polymer surface of a workpiece |
| 10/11/2000 | EP1043788A2 Process involving metal hydrides |
| 10/11/2000 | EP1043424A1 Method for locally removing oxidation and corrosion product from the surface of turbine engine components |
| 10/11/2000 | CN1269612A Conductive porous body and metal porous body and cell polar plate made thereby |
| 10/05/2000 | WO2000059014A1 Method for forming a silicon film and ink composition for ink jet |
| 10/05/2000 | WO2000058409A1 Coating composition |
| 10/04/2000 | EP1040885A1 Coated powder and process for the preparation thereof |