| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 09/27/2001 | DE10015213C1 Electronic or micro-electronic component is formed by number of insulation layers on substrate structured for free surfaces to be activated so that seeded by metallizing solution |
| 09/26/2001 | EP1135547A2 Decorative beverage can bodies |
| 09/26/2001 | EP0708983B1 Chemical vapor deposition process for fabricating layered superlattice materials |
| 09/26/2001 | CN1314829A Printing of electronic circuit and components |
| 09/26/2001 | CN1071806C Printed circuit board manufacture |
| 09/26/2001 | CN1071805C Method for forming silver plating on metal surface |
| 09/26/2001 | CN1071804C Process for manufacturing inductive counting system |
| 09/25/2001 | US6294467 Process for forming fine wiring |
| 09/25/2001 | US6294218 Process for coating a substrate |
| 09/20/2001 | WO2001069640A2 Method for applying metallic strip conductors acting as electrodes on a channel plate made of glass for large-surface flat screens |
| 09/20/2001 | WO2001068950A1 Method for the surface treatment of objects and means for carrying out said method |
| 09/20/2001 | US20010022990 Using mixture of organometallic compound and additive |
| 09/20/2001 | US20010022989 Protective coating on metal pads, apertures |
| 09/20/2001 | US20010022206 Comprises metal oxide film (of platinum, iridium, ruthenium, titanium, tantalum, and/or rhodium) on surface of reaction vessel; corrosion resistance; durability |
| 09/20/2001 | DE10024239C1 Process for galvanically treating workpieces used e.g. in the production of circuit boards comprises contacting the workpieces with a palladium colloidal solution, and recovering the solution after use |
| 09/20/2001 | DE10011455A1 Applying metallic conducting pathways as electrodes to a glass channel plate for large surface flat screens comprises roughening the channel plate in the electrode regions of the channels |
| 09/19/2001 | EP1134224A2 Cyclosilane compound, and solution composition and process for forming a silicon film |
| 09/19/2001 | EP0938457B1 Method for manufacturing substrates with transparent and colour coatings stable at high temperatures and in the presence of ultraviolet, coating composition and use |
| 09/19/2001 | CN1313410A Environment protection type catalytic liquid for special surface alloying |
| 09/18/2001 | US6291025 Electroless coatings formed from organic liquids |
| 09/18/2001 | US6290088 Includes electroless nickel phosphorous layer overlying inner surface of a steel alloy cylinder which reduces the contamination of liquefied corrosive gases stored in the gas cylinder |
| 09/13/2001 | WO2001066825A1 Coating compositions containing nickel and boron |
| 09/13/2001 | WO2001011098A3 Copper deposit process |
| 09/13/2001 | US20010021760 Polysilanes |
| 09/13/2001 | US20010021730 Conductive filler |
| 09/13/2001 | US20010020546 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
| 09/13/2001 | US20010020545 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
| 09/12/2001 | EP1109627A4 Manufacturing process for noncontinuous galvanization with zinc-aluminum alloys over metallic manufactured products |
| 09/12/2001 | CN1312670A Formation of metal interconnection structure |
| 09/12/2001 | CN1312399A Material surface brighting alloy catalyst liquid |
| 09/12/2001 | CN1312119A Radioactive 32P blood vessel support and its manufacture |
| 09/11/2001 | US6287631 High temperature thermal decomposition |
| 09/11/2001 | US6287371 To form gold plating layer for electronic industrial parts or articles, such as a print wiring base board; adherence |
| 09/11/2001 | US6286207 Resin structure in which manufacturing cost is cheap and sufficient adhesive strength can be obtained and method of manufacturing it |
| 09/06/2001 | US20010019892 Process for fabricating a semiconductor device |
| 09/06/2001 | US20010019888 Metal deposit process |
| 09/06/2001 | US20010019776 Coating, drying, roasting |
| 09/06/2001 | US20010019744 Process for plating metal coatings |
| 09/06/2001 | US20010019739 On synthetic resin substrates |
| 09/05/2001 | CN1311897A Misted precursor deposition apparatus and method with improved mist and mist flow |
| 09/05/2001 | CN1311896A Low temp. process for fabricating layered superlattice materials and making electronic devices including same |
| 09/05/2001 | CN1311721A Casting steel strip |
| 09/05/2001 | CN1311526A Method for mfg. conductive seat used for electric connection and formed conductive seat therefor |
| 09/05/2001 | CN1311349A Formula for chemical plating nickel and application thereof |
| 09/04/2001 | US6285048 Barium strontium titanate integrated circuit capacitors and process for making the same |
| 09/04/2001 | US6284682 Process for making chemically bonded sol-gel ceramics |
| 09/04/2001 | US6284122 Non-continuous galvanization of a metal object with a zinc-aluminum alloy by pre-coating with a metallic layer to protect from oxidation, immersing in hydrochloric acid, allowing to dry with a chloride salt, immersing in the alloy |
| 08/30/2001 | WO2001063005A1 Method of pretreatment of plastic for plating and method of plating |
| 08/30/2001 | WO2001016052A3 Process for making chemically bonded sol-gel ceramics |
| 08/30/2001 | US20010017300 Corrosion resistant gas cylinder and gas delivery system |
| 08/29/2001 | EP1127372A1 Nanoporous dielectric thin films |
| 08/28/2001 | US6281157 Bath comprising nickel sulfate, sodium hypophosphite as a reducing agent, acetic acid as a buffer, traces of lead as a stabilizer, a citrate used as a complexing agent and associated with a gluconate |
| 08/28/2001 | US6281090 Method for the manufacture of printed circuit boards with plated resistors |
| 08/28/2001 | US6279227 Method of forming a resilient contact structure |
| 08/23/2001 | WO2001061076A1 A method for providing a protective coating for carbonaceous components of an electrolysis cell |
| 08/23/2001 | US20010016236 Metal deposition; accuracy controlled nucleation |
| 08/23/2001 | US20010016232 Immersion silver plating solution containing additives |
| 08/23/2001 | US20010016229 Ferroelectric thin films and solutions: compositions and processing |
| 08/23/2001 | US20010015652 Probe card assembly and kit, and methods of making same |
| 08/22/2001 | EP1126518A2 Process for fabricating a semiconductor device |
| 08/22/2001 | EP1126512A2 Wafer plating method and apparatus |
| 08/22/2001 | EP0815285B1 Method for producing thick ceramic films by a sol gel coating process |
| 08/22/2001 | CN1309881A Method for metal coating of substrates |
| 08/21/2001 | US6277181 By adjusting the ph of the batch to a desired range by adding hydroxides of sodium, potassium, lithium, rubidium and cesium |
| 08/21/2001 | US6277180 Method of replacing evaporation losses from colloidal catalyst baths |
| 08/21/2001 | CA2106877C Electroless plated aramid surfaces |
| 08/16/2001 | EP1123424A1 Method and device for electrodialytic regeneration of an electroless metal deposition bath |
| 08/14/2001 | US6274823 Interconnection substrates with resilient contact structures on both sides |
| 08/14/2001 | US6274241 Electroless metal plating |
| 08/14/2001 | US6274022 Method for producing electro- or electroless-deposited film with a controlled crystal orientation |
| 08/14/2001 | US6273943 Electroless composite Plating Solution and Electroless composite plating method |
| 08/09/2001 | US20010012563 Undercoat layer of catalyst-free alkyd resin, a silver plated layer made from a silver mirror reaction, lower topcoat layer of polyester polyol, and upper topcoat layer of polyester polyol hardened with a diisocyanate; durability |
| 08/09/2001 | US20010012542 Alcohol solution containing nickel ions such as nickel acetate, and a reducible chelate type ligand having a hydrazone unit, such as acetal hydrazone |
| 08/09/2001 | DE19844755C2 Verfahren zum Herstellen dünner Schichten aus funktionalen Keramiken A method for producing thin layers of functional ceramics |
| 08/08/2001 | EP1122339A2 Megasonic plating using a submerged transducers-array |
| 08/08/2001 | CN1307793A Assembly of an electronic component with spring packaging |
| 08/08/2001 | CN1307648A Coating compositions containing nickel and boron |
| 08/07/2001 | US6270908 Rare earth zirconium oxide buffer layers on metal substrates |
| 08/02/2001 | WO2001055478A2 Method and device for depositing a precursor on a substrate, said precursor being present in liquid form |
| 08/02/2001 | US20010010837 Preparing an ultrafine particle dispersion liquid containing ultrafine metal particles, and dispersing the particles into an organic solvent, applying the dispersion on the substrate surface, drying and heating to join the metal or compound |
| 08/02/2001 | US20010010834 Reducing the lead content on the inner surface of the hollow component part by treatment with a hydracid aqueous reducing solution, chemically tinning the hollow parts, such as tube or joints or fittings made of copper alloy |
| 08/02/2001 | DE10003758A1 Vorrichtung und Verfahren zum Abscheiden wenigstens eines in flüssiger oder gelöster Form vorliegenden Prekursors Device and method for separating at least one present in liquid or dissolved form precursor |
| 08/02/2001 | DE10003582A1 Production of a tin layer on the inner surface of hollow copper alloy parts e.g., brass comprises reducing the lead content of the inner surface by treating with an aqueous reduction solution and plating with tin |
| 08/01/2001 | EP1120477A2 Method of manufacturing a tin layer on the internal surface of copper alloy hollow elements |
| 08/01/2001 | EP1120476A2 Solution for forming nickel metal thin film and method of forming nickel metal thin film using said solution |
| 08/01/2001 | CN1306387A Method for generating electromagnetic wave interference shielding membrane |
| 08/01/2001 | CN1306099A Process for preparing surface plasma resonance response chip by wet chemical method |
| 08/01/2001 | CN1306098A Multifunctional alloy catalyzing liquid and its treating technology |
| 07/31/2001 | US6268619 Integrated circuits |
| 07/31/2001 | US6268025 Multilayer |
| 07/31/2001 | US6268016 Electroless deposition of metals |
| 07/31/2001 | CA2225464C Internally tin-coated copper pipe and method for coating a copper pipe |
| 07/26/2001 | WO2001054203A2 Direct printing of thin-film conductors using metal-chelate inks |
| 07/26/2001 | WO2001053007A1 Method for forming thin-film conductors through the decomposition of metal-chelates in association with metal particles |
| 07/26/2001 | WO2001053005A1 Method for preparation of thermally and mechanically stable metal/porous substrate composite membranes |
| 07/26/2001 | US20010009724 Depositing coating on elongate member to give a coated elongate member, coating comprising at least one metal and at least one additive, the additive capable of codepositing with the metal, heat treating; electronics packaging |
| 07/26/2001 | DE10002102A1 Primer giving high adhesion values in electroless metallization of plastics, e.g. ABS moldings, glass or metals at low bath loads contains nanoscale hydrophilic swelling agent particles |
| 07/25/2001 | EP1118696A1 Method for plating substrate and apparatus |
| 07/24/2001 | US6265086 Electroless metal deposition on silyl hydride functional resin |
| 07/24/2001 | US6265075 Enhanced copper adhesion; metallic catalyst seed; photoimageable dielectric |