Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
12/1998
12/02/1998EP0777762B1 Metal polyoxyalkylated precursor solutions in an octane solvent and method of making the same
12/01/1998US5843538 Method for electroless nickel plating of metal substrates
12/01/1998US5843517 Composition and method for selective plating
12/01/1998US5843516 Liquid source formation of thin films using hexamethyl-disilazane
11/1998
11/26/1998WO1998053012A1 Multi-coated interference pigments
11/26/1998WO1998053011A1 Multi-coated interference pigments
11/25/1998EP0788727B1 Process for manufacturing electrical circuit bases
11/25/1998EP0779941A4 Etchant for aluminium alloys
11/24/1998US5840821 Coating solution and method for preparing the coating solution, method for forming insulating films for semiconductor devices, and method for evaluating the coating solution
11/24/1998US5840615 Coating with organometallic solution; drying; oxidative sintering
11/24/1998US5840110 Metal alkoxycarboxylate-based liquids
11/24/1998CA2089791C Electronic devices having metallurgies containing copper-semiconductor compounds
11/18/1998EP0878561A2 Process and apparatus for the regeneration of tin plating solutions
11/18/1998CN1198972A Method for surface chemical nickel plating of nickel-base alloy powder
11/18/1998CN1040785C Process for electroless plating aramid surfaces
11/17/1998CA2098559C Reducing agent regeneration system
11/12/1998WO1998050602A1 Currentless selective metallization of structured metal surfaces
11/12/1998WO1998050601A1 Metal paste and method for production of metal film
11/12/1998DE19740431C1 Metallising non-conductive substrate regions especially circuit board hole walls
11/12/1998DE19718971A1 Stromlose, selektive Metallisierung strukturierter Metalloberflächen Electroless selective metallization structured metal surfaces
11/11/1998EP0877100A1 Process for fabricating solid-solution of layered perovskite materials
11/11/1998EP0877099A1 Electrically conductvie ZnO comprising layers on substrates and process for manufacture
11/11/1998EP0859686A4 Fabricating interconnects and tips using sacrificial substrates
11/11/1998CN1198782A Process for manufacturing inductive counting systems
11/10/1998US5834065 Indicator layer between functional coating and base metal signals degradation of functional layer, phosphor powder dispersed in metallic matrix, useful in textile machinery
11/10/1998US5832601 Method of making temporary connections between electronic components
11/05/1998WO1998049721A1 Improved process for producing nanoporous silica thin films
11/05/1998WO1998049367A1 Bismuth coating protection for copper
11/03/1998US5830805 Electroless deposition equipment or apparatus and method of performing electroless deposition
11/03/1998US5829128 Method of mounting resilient contact structures to semiconductor devices
10/1998
10/29/1998DE19811042A1 Semiconductor component with via structure
10/28/1998EP0510065B1 Catalytic, water-soluble polymeric films for metal coatings
10/28/1998CN1197125A Activating catalytic solution for chemical sedimentation and its method of chemical sedimentation
10/22/1998WO1998047329A1 Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board
10/22/1998WO1998046806A2 Coating method for elongated metal blanks
10/22/1998WO1998046805A2 Method of deposition of a metal on a metal surface and the product thereof
10/22/1998WO1998046617A1 Liquid precursor for formation of metal oxides
10/21/1998EP0871695A2 Polyamino monosuccinic acid derivative degradable chelants, uses and compositions thereof
10/20/1998US5825057 Process for fabricating layered superlattice materials and making electronic devices including same
10/20/1998US5824205 Aluminising, chromising or siliconising substrate, electrolytic or electroless deposition of metal matrix and chromium-aluminum-metal alloy
10/15/1998WO1998045505A1 Method of electroplating nonconductive plastic molded product
10/15/1998WO1998045502A1 Method for providing a metal surface with a vitreous layer
10/15/1998DE19714949A1 Verfahren zum Versehen einer metallischen Oberfläche mit einer glasartigen Schicht A method for providing a metallic surface with a vitreous layer
10/14/1998EP0870075A1 Film or coating deposition and powder formation
10/14/1998EP0792388B1 Method for directly depositing metal containing patterned films
10/14/1998EP0662984B1 Process for treating plastic surfaces and swelling solution
10/13/1998US5821402 Thin film deposition method and gas sensor made by the method
10/11/1998CA2202446A1 Method of deposition of a metal on a metal surface and the product thereof
10/08/1998WO1998044165A1 Method for selective metallising of intrinsic plastic materials and integrated circuit card obtained by this method
10/07/1998EP0869200A2 Continuous ceramic composite plating method and apparatus for long doctor blade base materials
10/07/1998EP0682552B1 Apparatus for maintaining a stable autodeposition bath
10/01/1998DE19713359A1 Open end spinning rotor assembly
09/1998
09/30/1998EP0867952A1 Piezoelectric element and process for producing the same
09/30/1998EP0866735A1 USE OF PALLADIUM IMMERSION DEPOSITION TO SELECTIVELY INITIATE ELECTROLESS PLATING ON Ti AND W ALLOYS FOR WAFER FABRICATION
09/30/1998CN1194472A Electrode structure body, chargeable cell and its producing method
09/29/1998US5814849 Thin films of ABO3 with excess B-site modifiers and method of fabricating integrated circuits with same
09/29/1998US5814137 Alkoxyzirconium compound, organosilane coupling agent, acid catalyst; corrosion resistance
09/23/1998EP0865515A1 Electroless deposition of metallic coatings on non-conducting substances
09/23/1998CN1194060A Metal insulator semiconductor structure with polarization-compatible buffer layer
09/22/1998US5811153 Solutions containing reaction product of metal alkoxides, acetates or beta-diketone complexes with alcohols, carboxylic anhydrides, glycols, beta-diketones or dicarboxylic acid monoesters
09/22/1998US5810913 Copper oxalate, palladium salt, alkaline solution
09/16/1998EP0787224B1 Process for separating metal coatings
09/16/1998CN1193334A Plate-like titanium dioxide pigment
09/11/1998WO1998039105A1 Metal-plating of cured and sintered transient liquid phase sintering pastes
09/09/1998CN1192485A Photoinduction method for surface metallation of insulator
09/08/1998US5804456 Electroless deposition of metal by placing the wafer in a filler block, moving filler block in process vessel for improving the mixing of metal salt
09/08/1998US5803961 Integrated circuits having mixed layered superlattice materials and precursor solutions for use in a process of making the same
09/08/1998US5803957 Electroless gold plating bath
09/03/1998WO1998038352A1 Method for gold replenishment of electroless gold bath
09/03/1998WO1998038351A1 Direct deposition of palladium
09/03/1998WO1998038350A1 Direct deposition of gold
09/02/1998EP0861924A1 Hypophosphite solutions and their use in nickel plating
09/02/1998EP0861923A1 Activating catalytic solution for electroless plating and method for electroless plating
09/01/1998US5800858 Method for conditioning halogenated polymeric materials and structures fabricated therewith
09/01/1998US5800695 Plating turbine engine components
08/1998
08/27/1998WO1998037260A1 Microporous copper film and electroless copper plating solution for obtaining the same
08/26/1998EP0859686A1 Fabricating interconnects and tips using sacrificial substrates
08/26/1998EP0765413B1 A process for making electroless plated aramid surfaces
08/26/1998CN1191500A Ribbon-like core interconnection elements
08/20/1998WO1998036107A1 Plating apparatus and method
08/19/1998CA2226744A1 Nickel hypophosphite solutions containing increased nickel concentration
08/18/1998US5795828 Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device
08/18/1998US5795619 Solder bump fabricated method incorporate with electroless deposit and dip solder
08/12/1998EP0857797A1 Process for coating of a substrate at least partially with gold
08/12/1998EP0857506A2 Apparatus for maintaining a stable autodeposition bath
08/12/1998CN1190042A Ultraviolet irradiation process preparing metal and metal oxide superfine powder and metal film
08/11/1998US5792595 Exposing photoresist layer to light, developing to form resist pattern, forming electrolytically plated layer, superposing photosensitive sheet on substrate, forming metal pattern
08/11/1998US5792248 Stannous salt, precious metal salt, and chlorine compound
08/11/1998CA2110354C Monitoring electroless plating baths
08/06/1998WO1998034446A1 New process for modification of surfaces
08/06/1998WO1998033951A1 Composition and method for priming substrate materials
08/06/1998CA2278580A1 Composition and method for priming substrate materials
08/04/1998US5789325 Coating electronic substrates with silica derived from polycarbosilane
08/04/1998US5789038 Supporting mechanism for a wobble plate and method of making same
08/04/1998US5789027 Method of chemically depositing material onto a substrate
08/04/1998US5788821 Copper-based oxidation catalyst and its application
08/04/1998US5788757 Solution of metal carboxylate in ester solvent, formation of strontium barium titantes, strontium bismuth tantalates and/or niobates, annealing
07/1998
07/29/1998EP0855752A2 Electrode structural body, rechargeable battery provided with said electrode structural body, and process for the production of said electrode structural body and said rechargeable battery
07/23/1998WO1998031849A1 Sliding member, method of treating surface of the sliding member and rotary compressor vane
07/22/1998EP0854503A1 Coating solutions for use in forming bismuth-based ferro-electric thin films, and ferro-electric thin films, ferro-electric capacitors and ferro-electric memories formed with said coating solutions, as well as processes for production thereof