Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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08/20/2008 | CN101245148A Monodisperse high-performance conductive silver particle |
08/20/2008 | CN101244459A Chemical plating silver copper powder, chemical plating liquid and chemical plating method |
08/20/2008 | CN101244376A Method for producing metallic hydrogen absorption material with hydrogen absorption ability in hydrogen gas containing mixed gas |
08/20/2008 | CN100412232C Method for chemical plating nickel-boron alloy on magnesium alloy surface |
08/19/2008 | US7413983 Plating method including pretreatment of a surface of a base metal |
08/14/2008 | WO2008096671A1 Material for electroless plating, coating liquid for catalyst adhesion, electroless plating method, and plating method |
08/14/2008 | WO2008096670A1 Material for electroless plating, coating liquid for catalyst adhesion, electroless plating method, and plating method |
08/14/2008 | WO2008022420A8 Liquid or pulp aeration device |
08/14/2008 | WO2007033188A3 Substrate-enhanced electroless deposition (seed) of metal nanoparticles on carbon nanotubes |
08/13/2008 | EP1956115A2 Protective barrier coatings |
08/13/2008 | EP1956114A1 A layer assembly, a method of forming said layer assembly and a circuit carrier comprising said layer assembly |
08/13/2008 | EP1956043A1 Resin composition for direct metal plating, molded article, and metal-plated molded article |
08/13/2008 | EP1954367A2 Hydrogen transport membrane fabrication method |
08/13/2008 | EP1786621A4 Process of metallizing polymeric foam to produce an anti-microbial and filtration material |
08/13/2008 | EP1606431B1 Solution for etching copper surfaces and method of depositing metal on copper surfaces |
08/13/2008 | CN101243209A Microfabrication using replciated patterned topography and self-assembled monolayers |
08/13/2008 | CN101243205A Method for electrically conductive circuit formation |
08/13/2008 | CN101242892A Layer composite and production thereof |
08/13/2008 | CN101240418A Substrates with photocatalytic TiO2 layer |
08/13/2008 | CN100410424C Method for coating Ni-P layer in same liquid by chemically plating and electrobath |
08/12/2008 | US7410900 Metallisation |
08/12/2008 | US7410698 Conductive core materials form projections on the outer surface of a base particle, which is covered by a film of a different a conductive material; enhanced conduction reliability; low connection resistance |
08/07/2008 | WO2008093867A1 Method of fiber pretreatment for plating and process for producing plated fiber |
08/07/2008 | WO2008093842A1 Process and apparatus for producing polymer member |
08/07/2008 | WO2008092708A1 A method of soldering a circuit carrier, a layer assembly, a method of forming said layer assembly and a circuit carrier comprising said layer assembly |
08/06/2008 | EP1954109A1 Formation of metallic portions on a substrate |
08/06/2008 | EP1953264A2 Halogen-free trivalent chromium conversion coating |
08/06/2008 | EP1953262A1 Catalyst treatment method, electroless plating method, and method for formation of circuit by using the electroless plating method |
08/06/2008 | EP1953261A2 Method of fabricating plastic part having three-dimensional image and visual effect and structure thereof |
08/06/2008 | CN101238239A Cobalt electroless plating in microelectronic devices |
08/06/2008 | CN101238062A Process for the production of doped metal oxide particles |
08/06/2008 | CN101237027A Substrate carrier enclosure |
08/06/2008 | CN101235496A Method for preparing chemical composite plating crystal whisker enhancement nickel-base plating coat under magnetic field |
08/06/2008 | CN101235495A Method for chemically plating Ni-Mo-P on silicon dioxide |
08/06/2008 | CN101235494A Device and method for chemical plating |
08/06/2008 | CN101234855A On-site chemical modification method for preparing zinc oxide nano-stick array thin film and use thereof |
08/06/2008 | CN100409468C Bipolar electrochemical battery of stacked wafer cells |
08/06/2008 | CN100408725C Process for compound surface sheilding of metal magnesium and magnesium alloy |
08/06/2008 | CN100408722C Method for compound chemical plating of nickel-phosphorus-carbon-oxygen alloy |
08/06/2008 | CN100408202C Electroless plating solution and process |
08/05/2008 | US7407821 Substrate processing method |
08/05/2008 | US7407689 Aqueous acidic immersion plating solutions and methods for plating on aluminum and aluminum alloys |
08/05/2008 | US7406972 Substrate proximity processing structures |
07/31/2008 | US20080180121 Probe card assembly and kit |
07/31/2008 | US20080178800 Substrate processing unit and substrate processing apparatus |
07/30/2008 | EP1950324A2 Method of forming metal pattern, and metal salt mixture |
07/30/2008 | EP1948847A2 Method for producing a ceramic-coated metal support substrate |
07/30/2008 | CN101230456A Copper-plating graphite composite material and preparation method thereof |
07/30/2008 | CN101230455A Method for forming a displacement tin alloy plated film, displacement tin alloy plating bath and method for maintaining a plating performance |
07/30/2008 | CN100406613C Laser induced selective chemical plating process |
07/24/2008 | WO2007082961A3 Metallized composite material |
07/23/2008 | EP1947215A2 Method for forming a displacement tin alloy plated film, displacement tin alloy plating bath and method for maintaining a plating performance |
07/23/2008 | EP1947214A2 Transparent conducting film and manufacturing method thereof |
07/23/2008 | EP1945833A2 Inorganic substrate with a thin silica type glass layer, method of manufacturing the aforementioned substrate, coating agent, and a semiconductor device |
07/23/2008 | EP1448725A4 Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
07/23/2008 | CN201089796Y Non-electrolysis galvanization basket-hanging clamp locating structure |
07/23/2008 | CN101228293A Plating solution for electroless palladium plating |
07/23/2008 | CN101228031A Doctor blade |
07/23/2008 | CN101225518A Hot-dip galvanizing with electroless ni pre-plating method for controlling thickness of silicon-containing active steel plating |
07/23/2008 | CN101225516A Ni-W-P alloy plating solution for chemical plating and chemical plating method employing the same |
07/23/2008 | CN101225515A Method for preparing gold-nano array electrode |
07/23/2008 | CN100404142C Thermal decomposing nozzle for ultrasonic spraying |
07/22/2008 | CA2257456C Durable electrode coatings |
07/17/2008 | WO2008085261A1 Self-limiting plating method |
07/17/2008 | WO2008084658A1 Semiconductor device manufacturing method, semiconductor manufacturing apparatus and storage medium |
07/17/2008 | WO2008084619A1 Plated article and method for producing the same |
07/17/2008 | US20080171140 barium-strontium-titinate ferroelectric film structure incorporating a buffer layer prepared from a Ba0.5Sr0.5TiO3 precursor containing polyvinylpyrrolidione; size of the pores can be controlled by the polyvinylpyrrolidone content in the dielectric solution; improved top contact adhesion |
07/17/2008 | US20080168921 Method for making device for controlled reservoir opening by electrothermal ablation |
07/16/2008 | EP1943669A2 Linear and cross-linked high molecular weight polysilanes, polygermanes, and copolymers thereof, compositions containing the same, and methods of making and using such compounds and compositions |
07/16/2008 | EP1943372A1 Method for partially metallizing a product |
07/16/2008 | CN101220472A Chemical plating stannum solution |
07/16/2008 | CN101220471A Chemical plating reinforcing method and apparatus for airborne tank internal surface protection |
07/16/2008 | CN101219777A Method of forming oxide based nano structures |
07/16/2008 | CN100402705C Electrolytic electrode and process of producing the same |
07/16/2008 | CN100402700C Methyl free copper plating method and used solution thereof |
07/16/2008 | CN100402699C Method for chemical plating of nickel-boron alloy on magnesium alloy surface |
07/16/2008 | CN100402698C Electroless nickel-phosphorus plating process for Nd-Fe-Bo permanent magnet material |
07/16/2008 | CN100402161C Nano film plating process and machine for glazed ceramic tile |
07/15/2008 | US7400043 Semiconductor constructions |
07/15/2008 | US7399579 Article including a metal atom precursor is disproportionally exposed to electromagnetic radiation in an amount and intensity sufficient to convert some of the precursor to elemental meta; additional conductive material may then be deposited onto the elemental metal to produce a microstructure |
07/10/2008 | WO2008082292A1 Conductive fibrous web and method for making the same |
07/10/2008 | WO2008081637A1 Reduction-type electroless tin plating solution and tin plating films made by using the same |
07/10/2008 | WO2008081182A1 Methods of adhering particles to a material by heating |
07/10/2008 | US20080166885 Method and Apparatus for Semiconductor Wafer Planarization |
07/10/2008 | US20080166548 Coating material for thermal barrier coating having excellent corrosion resistance and heat resistance and method of producing the same |
07/09/2008 | EP1942207A1 Pre-treatment solution and method of forming a layer of a coating metal on a plastics surface containing substrate |
07/09/2008 | EP1819844B1 Method for forming anti-reflective coating |
07/09/2008 | CN101215715A Magnesium alloy pickling activate fluids |
07/09/2008 | CN101215696A Chemical composite nickel-plating liquid |
07/09/2008 | CN101215695A Aluminum alloy activated liquid |
07/09/2008 | CN101215694A High pure aluminum alloy chemical nickel-plating activated liquid and activating technique thereof |
07/09/2008 | CN101215693A Method for preparing high-performance conductive fiber |
07/09/2008 | CN100400710C Process of depositing mat metallic layers free of nickel and chromium(VI) |
07/09/2008 | CN100400708C A method for preparing silver plated copper powder |
07/08/2008 | US7396394 Nontoxic cyanide-free water soluble alkali metal salts of gold, pyrosulfurous acid, thiosulfuric acid, sulfurous acid, and aminocarboxylic acid compounds, resulting in improved solder and film adhesion |
07/08/2008 | CA2230282C Succinic acid derivative degradable chelants, uses and compositions thereof |
07/03/2008 | WO2008010824A3 Improved catalysts for fuel cell applications using electroless deposition |
07/03/2008 | US20080159939 Ceramic and method of manufacturing the same, dielectric capacitor, semiconductor device, and element |
07/03/2008 | DE10052960C9 Bleifreie Nickellegierung Lead-free nickel alloy |
07/02/2008 | EP1939324A1 Conductive fibrous web and method for making the same |