Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
08/2008
08/20/2008CN101245148A Monodisperse high-performance conductive silver particle
08/20/2008CN101244459A Chemical plating silver copper powder, chemical plating liquid and chemical plating method
08/20/2008CN101244376A Method for producing metallic hydrogen absorption material with hydrogen absorption ability in hydrogen gas containing mixed gas
08/20/2008CN100412232C Method for chemical plating nickel-boron alloy on magnesium alloy surface
08/19/2008US7413983 Plating method including pretreatment of a surface of a base metal
08/14/2008WO2008096671A1 Material for electroless plating, coating liquid for catalyst adhesion, electroless plating method, and plating method
08/14/2008WO2008096670A1 Material for electroless plating, coating liquid for catalyst adhesion, electroless plating method, and plating method
08/14/2008WO2008022420A8 Liquid or pulp aeration device
08/14/2008WO2007033188A3 Substrate-enhanced electroless deposition (seed) of metal nanoparticles on carbon nanotubes
08/13/2008EP1956115A2 Protective barrier coatings
08/13/2008EP1956114A1 A layer assembly, a method of forming said layer assembly and a circuit carrier comprising said layer assembly
08/13/2008EP1956043A1 Resin composition for direct metal plating, molded article, and metal-plated molded article
08/13/2008EP1954367A2 Hydrogen transport membrane fabrication method
08/13/2008EP1786621A4 Process of metallizing polymeric foam to produce an anti-microbial and filtration material
08/13/2008EP1606431B1 Solution for etching copper surfaces and method of depositing metal on copper surfaces
08/13/2008CN101243209A Microfabrication using replciated patterned topography and self-assembled monolayers
08/13/2008CN101243205A Method for electrically conductive circuit formation
08/13/2008CN101242892A Layer composite and production thereof
08/13/2008CN101240418A Substrates with photocatalytic TiO2 layer
08/13/2008CN100410424C Method for coating Ni-P layer in same liquid by chemically plating and electrobath
08/12/2008US7410900 Metallisation
08/12/2008US7410698 Conductive core materials form projections on the outer surface of a base particle, which is covered by a film of a different a conductive material; enhanced conduction reliability; low connection resistance
08/07/2008WO2008093867A1 Method of fiber pretreatment for plating and process for producing plated fiber
08/07/2008WO2008093842A1 Process and apparatus for producing polymer member
08/07/2008WO2008092708A1 A method of soldering a circuit carrier, a layer assembly, a method of forming said layer assembly and a circuit carrier comprising said layer assembly
08/06/2008EP1954109A1 Formation of metallic portions on a substrate
08/06/2008EP1953264A2 Halogen-free trivalent chromium conversion coating
08/06/2008EP1953262A1 Catalyst treatment method, electroless plating method, and method for formation of circuit by using the electroless plating method
08/06/2008EP1953261A2 Method of fabricating plastic part having three-dimensional image and visual effect and structure thereof
08/06/2008CN101238239A Cobalt electroless plating in microelectronic devices
08/06/2008CN101238062A Process for the production of doped metal oxide particles
08/06/2008CN101237027A Substrate carrier enclosure
08/06/2008CN101235496A Method for preparing chemical composite plating crystal whisker enhancement nickel-base plating coat under magnetic field
08/06/2008CN101235495A Method for chemically plating Ni-Mo-P on silicon dioxide
08/06/2008CN101235494A Device and method for chemical plating
08/06/2008CN101234855A On-site chemical modification method for preparing zinc oxide nano-stick array thin film and use thereof
08/06/2008CN100409468C Bipolar electrochemical battery of stacked wafer cells
08/06/2008CN100408725C Process for compound surface sheilding of metal magnesium and magnesium alloy
08/06/2008CN100408722C Method for compound chemical plating of nickel-phosphorus-carbon-oxygen alloy
08/06/2008CN100408202C Electroless plating solution and process
08/05/2008US7407821 Substrate processing method
08/05/2008US7407689 Aqueous acidic immersion plating solutions and methods for plating on aluminum and aluminum alloys
08/05/2008US7406972 Substrate proximity processing structures
07/2008
07/31/2008US20080180121 Probe card assembly and kit
07/31/2008US20080178800 Substrate processing unit and substrate processing apparatus
07/30/2008EP1950324A2 Method of forming metal pattern, and metal salt mixture
07/30/2008EP1948847A2 Method for producing a ceramic-coated metal support substrate
07/30/2008CN101230456A Copper-plating graphite composite material and preparation method thereof
07/30/2008CN101230455A Method for forming a displacement tin alloy plated film, displacement tin alloy plating bath and method for maintaining a plating performance
07/30/2008CN100406613C Laser induced selective chemical plating process
07/24/2008WO2007082961A3 Metallized composite material
07/23/2008EP1947215A2 Method for forming a displacement tin alloy plated film, displacement tin alloy plating bath and method for maintaining a plating performance
07/23/2008EP1947214A2 Transparent conducting film and manufacturing method thereof
07/23/2008EP1945833A2 Inorganic substrate with a thin silica type glass layer, method of manufacturing the aforementioned substrate, coating agent, and a semiconductor device
07/23/2008EP1448725A4 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
07/23/2008CN201089796Y Non-electrolysis galvanization basket-hanging clamp locating structure
07/23/2008CN101228293A Plating solution for electroless palladium plating
07/23/2008CN101228031A Doctor blade
07/23/2008CN101225518A Hot-dip galvanizing with electroless ni pre-plating method for controlling thickness of silicon-containing active steel plating
07/23/2008CN101225516A Ni-W-P alloy plating solution for chemical plating and chemical plating method employing the same
07/23/2008CN101225515A Method for preparing gold-nano array electrode
07/23/2008CN100404142C Thermal decomposing nozzle for ultrasonic spraying
07/22/2008CA2257456C Durable electrode coatings
07/17/2008WO2008085261A1 Self-limiting plating method
07/17/2008WO2008084658A1 Semiconductor device manufacturing method, semiconductor manufacturing apparatus and storage medium
07/17/2008WO2008084619A1 Plated article and method for producing the same
07/17/2008US20080171140 barium-strontium-titinate ferroelectric film structure incorporating a buffer layer prepared from a Ba0.5Sr0.5TiO3 precursor containing polyvinylpyrrolidione; size of the pores can be controlled by the polyvinylpyrrolidone content in the dielectric solution; improved top contact adhesion
07/17/2008US20080168921 Method for making device for controlled reservoir opening by electrothermal ablation
07/16/2008EP1943669A2 Linear and cross-linked high molecular weight polysilanes, polygermanes, and copolymers thereof, compositions containing the same, and methods of making and using such compounds and compositions
07/16/2008EP1943372A1 Method for partially metallizing a product
07/16/2008CN101220472A Chemical plating stannum solution
07/16/2008CN101220471A Chemical plating reinforcing method and apparatus for airborne tank internal surface protection
07/16/2008CN101219777A Method of forming oxide based nano structures
07/16/2008CN100402705C Electrolytic electrode and process of producing the same
07/16/2008CN100402700C Methyl free copper plating method and used solution thereof
07/16/2008CN100402699C Method for chemical plating of nickel-boron alloy on magnesium alloy surface
07/16/2008CN100402698C Electroless nickel-phosphorus plating process for Nd-Fe-Bo permanent magnet material
07/16/2008CN100402161C Nano film plating process and machine for glazed ceramic tile
07/15/2008US7400043 Semiconductor constructions
07/15/2008US7399579 Article including a metal atom precursor is disproportionally exposed to electromagnetic radiation in an amount and intensity sufficient to convert some of the precursor to elemental meta; additional conductive material may then be deposited onto the elemental metal to produce a microstructure
07/10/2008WO2008082292A1 Conductive fibrous web and method for making the same
07/10/2008WO2008081637A1 Reduction-type electroless tin plating solution and tin plating films made by using the same
07/10/2008WO2008081182A1 Methods of adhering particles to a material by heating
07/10/2008US20080166885 Method and Apparatus for Semiconductor Wafer Planarization
07/10/2008US20080166548 Coating material for thermal barrier coating having excellent corrosion resistance and heat resistance and method of producing the same
07/09/2008EP1942207A1 Pre-treatment solution and method of forming a layer of a coating metal on a plastics surface containing substrate
07/09/2008EP1819844B1 Method for forming anti-reflective coating
07/09/2008CN101215715A Magnesium alloy pickling activate fluids
07/09/2008CN101215696A Chemical composite nickel-plating liquid
07/09/2008CN101215695A Aluminum alloy activated liquid
07/09/2008CN101215694A High pure aluminum alloy chemical nickel-plating activated liquid and activating technique thereof
07/09/2008CN101215693A Method for preparing high-performance conductive fiber
07/09/2008CN100400710C Process of depositing mat metallic layers free of nickel and chromium(VI)
07/09/2008CN100400708C A method for preparing silver plated copper powder
07/08/2008US7396394 Nontoxic cyanide-free water soluble alkali metal salts of gold, pyrosulfurous acid, thiosulfuric acid, sulfurous acid, and aminocarboxylic acid compounds, resulting in improved solder and film adhesion
07/08/2008CA2230282C Succinic acid derivative degradable chelants, uses and compositions thereof
07/03/2008WO2008010824A3 Improved catalysts for fuel cell applications using electroless deposition
07/03/2008US20080159939 Ceramic and method of manufacturing the same, dielectric capacitor, semiconductor device, and element
07/03/2008DE10052960C9 Bleifreie Nickellegierung Lead-free nickel alloy
07/02/2008EP1939324A1 Conductive fibrous web and method for making the same
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