| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 04/02/2008 | CN101153388A Plating liquid for electroless zinc plating for magnesium alloy |
| 04/01/2008 | US7352196 Probe card assembly and kit |
| 04/01/2008 | US7351314 Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| 03/27/2008 | WO2008036984A2 Technique for plating substrate devices using voltage switchable dielectric material and light assistance |
| 03/27/2008 | US20080075860 exposing substrates to metal ions, then to basic environments to form thin films comprising antimicrobially active oxidized silver; medical equipment |
| 03/27/2008 | US20080075650 Deposition products, composite materials and processes for the production thereof |
| 03/27/2008 | DE102004002778B4 Verfahren zur Regenerierung von Metallisierungsbädern Process for the regeneration of metallizing |
| 03/27/2008 | CA2663064A1 Method of coating a metallic article with a surface of tailored wettability |
| 03/26/2008 | EP1903124A2 Method for manufacturing an inorganic-inorganic or inorganic-organic gradient composite coating |
| 03/26/2008 | CN101151399A Plated base material |
| 03/26/2008 | CN101149226A Sintering machine slide way with Ni base surface hard alloy layer |
| 03/26/2008 | CN101148762A One-step acid washing activating plating pre-processing technique for magnesium alloy surface |
| 03/26/2008 | CN101148757A Composition of surface chemistry plating liquid and preparation method for wooden electromagnetic screen material |
| 03/25/2008 | US7347702 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 03/20/2008 | WO2008032839A1 Base material covered with metal layer and process for producing the same |
| 03/20/2008 | WO2008012512A3 The formation of conductive metal regions on substrates |
| 03/19/2008 | CN101145532A Semiconductor sensor and method of plating semiconductor devices |
| 03/19/2008 | CN101144161A Metal surface treatment method |
| 03/19/2008 | CN101144157A Chemical nickel-plating brightener and using method thereof |
| 03/19/2008 | CN101144156A Sealing technique for plating oil pipe by nickel phosphorus |
| 03/19/2008 | CN101143950A Preparation method for ionic polymer metal composite material |
| 03/18/2008 | US7344986 Plating solution, semiconductor device and method for manufacturing the same |
| 03/18/2008 | US7344749 Method for coating a substrate with calcium phosphate |
| 03/18/2008 | CA2201934C Antimicrobial solid material, process for producing the same, and method of utilizing the same |
| 03/13/2008 | WO2008030106A1 Method and device for catchment of platinum group metals in a gas stream |
| 03/13/2008 | WO2008029839A1 Method for filling polymer actuator with electrolytic solution, method for controlling the elastic modulus of polymer actuator, and process for production of polymer actuator |
| 03/13/2008 | US20080063897 Nodular nickel boron coating |
| 03/13/2008 | US20080060381 Ferroelectric film, method of manufacturing the same, ferroelectric memory and piezoelectric device |
| 03/12/2008 | EP1897971A1 Method for electrically conductive circuit formation |
| 03/12/2008 | EP1896630A2 Cobalt electroless plating in microelectronic devices |
| 03/12/2008 | EP1579028B1 Method for coating a substrate with calcium phosphate |
| 03/12/2008 | CN101142343A Selective catalytic activation of non-conductive substrates |
| 03/12/2008 | CN101139711A Method for producing improved radio-frequency cable inner conductor pipe |
| 03/12/2008 | CN101139707A Surface processing agent for zinc or zinc alloy product |
| 03/12/2008 | CN101139706A Atomizing activating process for electroless plating on water-absorbing substrate surface |
| 03/12/2008 | CN101138895A Surface-treated steel sheet |
| 03/12/2008 | CN100375254C Temperature control sequence of electroless plating baths |
| 03/12/2008 | CN100374625C Gate bush producing method by electroforming |
| 03/11/2008 | US7341947 Methods of forming metal-containing films over surfaces of semiconductor substrates |
| 03/11/2008 | US7341634 Apparatus for and method of processing substrate |
| 03/11/2008 | US7341633 Apparatus for electroless deposition |
| 03/06/2008 | US20080054806 Silver in circuitry; ) coating of benzimazole derivatives, organosilane, a catalyst of organic amine, metal oxide, titanium, tin or zirconium; a carrier; resistors, capacitors, plasma display panel, liquid crystal display |
| 03/06/2008 | US20080054469 Electroformed metal structure |
| 03/06/2008 | US20080052904 Method Of Manufacturing An Electronic Circuit Assembly |
| 03/05/2008 | EP1894895A1 Metal mold for glass shaping and process for producing the same |
| 03/05/2008 | EP1579490A4 Method for low temperature growth of inorganic materials from solution using catalyzed growth and re-growth |
| 03/05/2008 | EP1558794A4 Measurement of the concentration of a reducing agent in an electroless plating bath |
| 03/05/2008 | CN101135052A Method for preparing metallic complex film |
| 03/05/2008 | CN100372795C Reduction preparation for silver mirror |
| 03/04/2008 | US7338686 Method for producing conductive particles |
| 02/28/2008 | WO2008024750A1 Methods and apparatus for depositing tantalum metal films to surfaces and substrates |
| 02/28/2008 | WO2008023974A1 Device for treating a plate-shaped substrate in a bath. |
| 02/28/2008 | WO2008022420A1 Liquid or pulp aeration device |
| 02/28/2008 | US20080050611 Tin-Based Plating Film and Method for Forming the Same |
| 02/28/2008 | CA2661140A1 Liquid or pulp aeration device |
| 02/27/2008 | EP1892319A1 Dip-coating unit for continuous coating of elongated substrates |
| 02/27/2008 | EP1891251A2 Formation of layers on substrates |
| 02/27/2008 | CN101133187A Resin substrate, substrate for electronic component having electroless plating applied thereon, and process for production of substrate for electronic component |
| 02/27/2008 | CN101130875A Circular knitter cylinder and its manufacturing method |
| 02/27/2008 | CN101130862A Surface processing technology for Mg-alloy |
| 02/27/2008 | CN101130838A Copper-coating compound powder and method for making the same |
| 02/27/2008 | CN100372178C Method for producing steel grounding device coated with anti-corrosion layer |
| 02/27/2008 | CN100371089C Improved coating for silver plated circuits |
| 02/21/2008 | WO2007146082A3 Molded polymer comprising silicone and at least one metal trace and a process of manufacturing the same |
| 02/21/2008 | US20080042111 Copper-Containing Tin Powder, Method for Producing the Copper-Containing Tin Powder and Electro-Conductive Paste Using the Copper-Containing Tin Powder |
| 02/21/2008 | DE202007015936U1 Deckelement für Prozessreaktor Cover element for process reactor |
| 02/20/2008 | EP1888813A2 Method for the rapid densification of a porous substrate, comprising the formation of a solid deposit within the porosity of the substrate |
| 02/20/2008 | EP1888812A1 Method for improving the barrier characteristics of ceramic barrier layers |
| 02/20/2008 | EP1888811A2 Dispersed nanoparticle monolayer films |
| 02/20/2008 | CN101128621A Composite material consisting of a porous matrix and metal or metal oxide nanoparticles |
| 02/20/2008 | CN101126156A Technique used for ABS plastic substrate chemical plating pre-processing |
| 02/19/2008 | US7332198 plating bath of a double bath structure including an inner bath holding a plating solution, and an outer bath surrounding the inner bath and is in communication with it; and a heater in the outer bath; uniform temperature control; especially for electroless deposition of copper or silver |
| 02/19/2008 | US7332193 Depositing cobalt, nickel or alloys thereof onto a metal-based substrate in manufacture of microelectronic devices, involving a source of cobalt and nickel, a reducing agent for reducing the depositions ions to metal onto the substrate, and a hydrazine-based leveling agent |
| 02/19/2008 | CA2341985C Silver film incorporating protective insoluble metallic salt precipitate |
| 02/14/2008 | WO2008018471A1 Partial plating method, laser plating apparatus, and plated member |
| 02/14/2008 | US20080035370 Device applications for voltage switchable dielectric material having conductive or semi-conductive organic material |
| 02/14/2008 | DE4392931B4 Fluidheizvorrichtung Fluid heating apparatus |
| 02/13/2008 | EP1886801A1 Thin film forming method and transparent conductive film |
| 02/13/2008 | EP1885911A2 Sol for sol-gel process coating of a surface and coating method by sol-gel process using same |
| 02/13/2008 | CN101124676A Supercritical fluid-assisted deposition of materials on semiconductor substrates |
| 02/13/2008 | CN101122020A Preparation method for large-area nano zinc oxide directional array |
| 02/13/2008 | CN101122016A Silicon rubber chemical copper-plating technique |
| 02/13/2008 | CN100368596C Production technology of ceramic outer shell cover plate of crystal oscillator |
| 02/13/2008 | CN100368595C Complex additive for chemical nickel plating |
| 02/13/2008 | CN100368594C Fe3O4/Si nanometer porous array composite material preparation method |
| 02/12/2008 | US7329768 Chemical vapor deposition precursors for deposition of tantalum-based materials |
| 02/07/2008 | WO2008016182A1 Plated resin molded body |
| 02/07/2008 | WO2008016142A1 Process for producing light-transmitting electromagnetic-shielding material, light-transmitting electromagnetic-shielding material, and filter for display |
| 02/07/2008 | WO2008015168A1 Method for applying a metal layer to a substrate |
| 02/07/2008 | WO2008015167A1 Dispersion for applying a metal layer |
| 02/07/2008 | US20080032117 Aqueous/Organic Metal Oxide Dispersion And Coated Substrates And Mouldings Produced Therewith |
| 02/06/2008 | CN101117713A Method for preparing super-hydrophobic modified SiO2-polyurethane composite coating by using immersion-self-assembly |
| 02/06/2008 | CN101117708A Liquid deposition preparing method for germanium dioxide material |
| 02/06/2008 | CN100367525C Superconductor method and reactor |
| 02/06/2008 | CN100367474C Method for preparing porous silicon oxide film |
| 02/06/2008 | CN100366795C Non-electrolytic segregating method of metal |
| 02/06/2008 | CN100366794C Formular of polymer powder chemical nickel-plating and technique thereof |
| 02/06/2008 | CN100366583C Method for preparing diamond film surface metal patternization |
| 02/05/2008 | US7326302 Apparatus and method for processing a substrate |
| 01/31/2008 | WO2008013210A1 Terminally modified hyperbranched polyimide, metal-plated terminally modified hyperbranched polyimide, and method for producing the same |