Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
05/2008
05/21/2008CN101185027A Method of forming graft pattern and method of forming conductive pattern
05/21/2008CN101184866A Sol for sol-gel process coating of a surface and coating method by sol-gel process using same
05/21/2008CN101183607A Method of producing zinc oxide Fe-doped rare magnetic semiconductor material
05/21/2008CN101183595A P type doping ZnO based rare magnetic semiconductor material and method of producing the same
05/21/2008CN101182637A Alkalescence chemical plating liquid
05/21/2008CN101182636A Molecule resonance chemical plating method and apparatus
05/21/2008CN101182635A Preparation method of carbon coated TiO2core-shell composite nanometer powder
05/20/2008US7374814 iron and/or alloy powders, having plated layer on the surfaces comprising lubricants dispersed in matrices; molding the powders in dies and heat treating to form compacts having green strength
05/20/2008US7374701 Organometallic precursor composition and method of forming metal film or pattern using the same
05/15/2008WO2008058250A1 System and method for controlling an electroless deposition process
05/15/2008WO2008056603A1 Electroless copper plating method
05/15/2008WO2008056537A1 Electroless plating method
05/15/2008WO2008055496A1 Method for the production of thin layers of metal-ceramic composite materials
05/15/2008WO2006114429A3 Plastic objects for metal-plating with improved shaping properties
05/15/2008DE10241137B4 Verfahren zur Metallisierung von Kunststoffen Process for the metallization of plastics
05/15/2008CA2668736A1 A method for the production of thin layers of metal-ceramic composite materials
05/14/2008EP1920924A1 Doctor blade
05/14/2008EP1920472A1 Method for applying a metallic covering layer to a high-temperature superconductor
05/14/2008EP1920082A2 Substrate with spatially selective metal coating method for production and use thereof
05/14/2008CN101177786A Double-layer copper brazing steel tube coated with zinc on external side and coated nickel on PVF inside
05/14/2008CN101177784A Magnesium alloy surface chemical plating process
05/14/2008CN101177783A Button cell cathode cover exterior conducting surface plating method
05/13/2008US7371666 with an emission spanning the visible spectrum; reacting a silicon precursor in the presence of a sheath gas with heat from a radiation beam under conditions effective to produce silicon nanoparticles; acid etching
05/13/2008US7371426 lower growth environmental bond coating of an aluminum alloy applied to the remaining base metal substrate so that upon subsequent repair of the component, less of the remaining base metal substrate is removed because of less environmental coating growth into the substrate than prior bond coat
05/08/2008US20080108218 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
05/08/2008US20080105647 Methods for Electrochemically Fabricating Structures Using Adhered Masks, Incorporating Dielectric Sheets, and/or Seed layers That Are Partially Removed Via Planarization
05/07/2008EP1919266A2 Electroless plating solution, electroless plating process, and printed circuit board
05/07/2008EP1918418A1 Method of coating a substrate
05/07/2008CN101173352A Formaldehyde free electrolesss copper compositions
05/07/2008CN101173351A Chemical nickel plating solution for magnesium alloy and nickeling technique thereof
05/07/2008CN101173350A Electroless plating method for producing basalt fibre-nickel one-dimensional nucleocapsid structure
05/07/2008CN100386857C Method for manufacturing conductive seat used for electric connection and formed conductive seat therefor
05/07/2008CN100386146C Uv curable catalyst compositions
05/06/2008US7368017 Method and apparatus for semiconductor wafer planarization
05/06/2008US7368016 Substrate processing unit and substrate processing apparatus
05/06/2008US7367118 Method for forming metal wires by microdispensing pattern
05/02/2008WO2008051344A2 Method and apparatus for coating a medical device by electroless plating
05/02/2008WO2008050715A1 Metal-film-coated material and process for producing the same, metallic-pattern-bearing material and process for producing the same, composition for polymer layer formation, nitrile polymer and method of synthesizing the same, composition containing nitrile polymer, and layered product
05/02/2008WO2008050631A1 Process for producing metal-film-coated substrate, metal-film-coated substrate, process for producing metallic-pattern material, and metallic-pattern material
05/01/2008US20080102305 Adhesiveless Copper Clad Laminates And Method For Manufacturing Thereof
04/2008
04/30/2008EP1916320A2 Electrode for hydrogen generation and process for preparation thereof
04/30/2008EP1916316A1 Electroless plating apparatus and plating liquid
04/30/2008EP1102872A4 Novel organocuprous precursors for chemical vapor deposition of a copper film
04/30/2008CN201052538Y Precision elongated punch guiding protecting device
04/30/2008CN101168838A Method for preparing mica titanium material
04/30/2008CN100385037C Method for preparing nano copper oxide on surface of SiO2
04/30/2008CN100384490C Medical implants comprising biocompatible coatings
04/29/2008US7365118 Polymer-assisted deposition of films
04/24/2008WO2008048840A2 Methods of patterning a deposit metal on a polymeric substrate
04/24/2008WO2008048755A1 Manufacture of electroless cobalt deposition compositions for microelectronics applications
04/24/2008WO2008047578A1 Composition for electroless plating and method for forming metal protection film by using the composition
04/24/2008WO2008046785A2 Method for stabilizing and functionalizing porous metallic layers
04/24/2008WO2008046395A1 Method of working material by heavy ion bombardment and a subsequent etching process
04/24/2008US20080093423 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
04/24/2008US20080093422 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
04/24/2008DE102004033979B4 Verfahren zur Verbesserung der Lötbarkeit von Nickelüberzügen Process for improving the solderability of nickel coatings
04/23/2008EP1915041A1 Printed wiring board and printed wiring board manufacturing method
04/23/2008EP1915040A2 Printed wiring board and printed wiring board manufacturing method
04/23/2008EP1620580A4 Polytetrafluoroethylene dispersion for electroless nickel plating applications
04/23/2008EP1366513A4 Method for multilevel copper interconnects for ultra large scale integration
04/23/2008CN101166847A Material for plating and use thereof
04/23/2008CN101166846A Method and apparatus for selective deposition of materials to surfaces and substrates
04/23/2008CN100383279C Process for preparing composite material of carbon nano tube/NiZn ferrite
04/23/2008CN100383278C Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board
04/22/2008US7361594 Method of manufacturing a thin film transistor, thin film transistor, thin film transistor circuit, electronic device, and electronic apparatus
04/22/2008US7361262 Acid plating bath and method for the electrolytic deposition of satin nickel deposits
04/22/2008US7361225 Liquid tank
04/17/2008WO2007088008A3 Method and device for coating substrate surfaces
04/17/2008US20080090098 Ferroelectric Thin Film Formation Composition, Ferroelectric Thin Film and Method of Fabricating Ferroelectric Thin Film
04/17/2008DE112006001385T5 Separator für Brennstoffzelle und Verfahren zu dessen Herstellung A separator for fuel cell and process for its preparation
04/16/2008EP1644995B1 Semiconductor component, and method for the production thereof
04/16/2008EP1466353A4 Contamination suppression in chemical fluid deposition
04/16/2008CN101161866A Magnesium and method for preparing magnesium alloy surface coating
04/16/2008CN101161860A Method for chemical deposition of nano ceramic material and metal alloy on metal surface
04/16/2008CN101161841A Ultra-fine hard alloy composite powder and method for manufacturing same
04/15/2008US7358186 Method and apparatus for material deposition in semiconductor fabrication
04/15/2008US7358170 Methods of forming conductive interconnects, and methods of depositing nickel
04/10/2008WO2008040936A1 Curable resin films
04/10/2008WO2008040700A1 A coating method and the coating formed thereby
04/10/2008WO2008015169A3 Thermoplastic moulding composition for the production of mouldings that can be electroplated
04/10/2008WO2007147399A3 Process for producing a sol-gel-based absorber coating for solar heating
04/10/2008WO2007017015A3 Layer composite and production thereof
04/10/2008US20080085419 Electro- and Electroless Plating of Metal in the Manufacture of PCRAM Devices
04/09/2008EP1907602A1 Electroless niwp adhesion and capping layers for tft copper gate process
04/09/2008CN101160037A Heat radiator and surface treating method thereof
04/09/2008CN101158042A Metal surface protectant prepared by circuit board pickling waste water
04/09/2008CN101158036A Method for assembling nano zinc oxide on magnesium-lithium alloy surface
04/09/2008CN100379898C Solution for etching copper surfaces and method of depositing metal on copper surfaces
04/08/2008CA2255646C Process for making thermally stable metal coated polymeric monofilament or yarn
04/03/2008WO2008039577A2 Polyimide solvent cast films having low coefficient of thermal expansion and method of manufacture thereof
04/03/2008WO2008037424A1 Method for metallizing a component
04/03/2008WO2008003273A3 Corrosion-resistant substrate comprising a cr(vi)-free triple-layer coating, and method for the production thereof
04/03/2008WO2007092529A3 Techniques for depositing metallic films using ion implantation surface modification for catalysis of electroless deposition
04/03/2008WO2007055955A3 Method of reducing porosity
04/03/2008US20080081125 Method for manufacturing cover lay of printed circuit board
04/02/2008EP1905756A1 Silver beta-ketocarboxylate, material comprising the same for forming silver metal, and use thereof
04/02/2008EP1905065A2 Systems and methods for roll-to-roll patterning
04/02/2008EP1716267A4 Method for carburizing steel components
04/02/2008EP1638699A4 Enhanced metal ion release rate for anti-microbial applications
04/02/2008CN101155942A Treatment of flexible web material
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