Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
07/2008
07/02/2008EP1661160A4 Supercritical fluid-assisted deposition of materials on semiconductor substrates
07/02/2008CN201080496Y Fixture for holding flexible circuit board
07/02/2008CN101210327A Plastic surface copper plating agent and using method thereof
07/02/2008CN101210320A Method for preparing silver-nickel core-shell particles
07/02/2008CN101210319A Chemical aluminum plating solution and chemical aluminum plating method
07/02/2008CN100399012C Automatic analyzing/controlling device for electroless composite plating solution
07/02/2008CN100398700C Surface cladding treatment method of ferro-manganese aluminium alloy
07/01/2008US7393567 Adhering a compound that has both a free radical initiating moiety and a bonding moiety to a substrate; contacting the substrate with reaction product of a hydrophilic polymer and an unsaturated monomer; and patternwise exposing the substrate to light to form a region where a graft polymer is generated
06/2008
06/26/2008US20080153291 Method and Apparatus for Material Deposition
06/26/2008DE10392819T5 Temperaturregelungsablauf von Bädern zur stromlosen Beschichtung Temperature control sequence of baths for electroless plating
06/26/2008DE10344860B4 Heizvorrichtung für ein Gargerät Heater for a cooking appliance
06/25/2008EP1935331A2 Process for the preparation of modified electrodes, electrodes prepared with said process, and enzymatic biosensors comprising said electrodes
06/25/2008EP1934383A2 Electroless plating in microchannels
06/25/2008EP1556878A4 Enhanced field emission from carbon nanotubes mixed with particles
06/25/2008EP1552729A4 Method for the manufacture of printed circuit boards with integral plated resistors
06/25/2008CN101208459A Formation of layers on substrates
06/25/2008CN101208207A Process for contact printing of pattern of electroless deposition catalyst
06/25/2008CN101208023A Precious metal jewellery and method for manufacturing the same
06/25/2008CN101204861A Titanium alloy parts protection and its preparation method and uses of hydrogen prevention crisp
06/24/2008US7390847 Polymer derivatives for the treatment of metals
06/24/2008US7390354 Electroless gold plating solution
06/19/2008WO2008072665A1 Method for producing mold for glass molding
06/19/2008WO2008072664A1 Method for producing mold for glass molding
06/19/2008US20080146022 Methods of Forming Conductive Interconnects
06/19/2008US20080142369 holders for electronics formed by adhering a patterned layer of to a previously formed layer or substrate and repeating the adhesion operation several times to form a multilayer configuration containing electrodes, conductor and dielectrics
06/19/2008DE10259187B4 Metallisierung von Kunststoffsubstraten und Lösung zum Beizen und Aktivieren Metallization of plastic substrates and solution for pickling and activating
06/18/2008EP1932943A1 Electroless nickel plating solution
06/18/2008EP1932057A2 Method of forming conductive tracks
06/18/2008EP1931811A1 Dry composition, use of its layer system and coating process
06/18/2008CN100395076C Method for preparing YBaCu3O7-delta strip on cold-rolled polycrystalline silver-base band
06/17/2008US7387839 Substrate with photocatalytic coating
06/17/2008US7387741 Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof
06/17/2008US7387717 Method of performing electrolytic treatment on a conductive layer of a substrate
06/12/2008WO2008070786A1 Microfluidic systems and methods for screening plating and etching bath compositions
06/12/2008WO2008069989A1 High peroxide autodeposition bath
06/12/2008WO2008068049A1 Pre-treatment solution and method of forming a layer of a coating metal on a plastics surface containing substrate
06/12/2008WO2008048840A3 Methods of patterning a deposit metal on a polymeric substrate
06/12/2008WO2007055955A8 Method of reducing porosity
06/12/2008US20080138629 epoxy resins whose surface is swelled in a solution containing palladium naphthenate and reaction product of imidazole and 3-glycidoxypropyltrimethoxysilane, then coated with copper in an electroless deposition process
06/12/2008US20080138507 Electroless gold plating bath, electroless gold plating method and electronic parts
06/12/2008US20080138506 Electroless gold plating bath, electroless gold plating method and electronic parts
06/12/2008US20080138505 Formation method of metal layer on resin layer, printed wiring board, and production method thereof
06/12/2008US20080136028 Semiconductor constructions comprising a layer of metal over a substrate
06/11/2008EP1930472A1 Electroless palladium plating bath and electroless palladium plating method
06/11/2008EP1930471A2 Barrier layer, composite article comprising the same, electroactive device, and method
06/11/2008EP1929068A1 Process for producing metal foams having uniform cell structure
06/11/2008EP1929067A1 A method of producing titanium oxide films at low temperatures for photocatalytic and photovoltaic applications
06/11/2008CN101198721A Electroless gold plating liquid for forming gold plating film for wire bonding
06/11/2008CN101195911A Preprocessing solution and method for forming coating metal layer on substrate with plastic surface
06/11/2008CN101195885A ZnO coating aluminum boric acid crystal whisker reinforcing aluminum base composite material and method for producing the same
06/11/2008CN101195686A Production of aniline non-platinum or self-polymerization polymeric film and chemical plating copper
06/11/2008CN100394627C Composition for forming piezoelectrics, piezoelectric film making method, piezoelectric element and ink-jet recording head
06/11/2008CN100393911C Preparation process of magnesium alloy supported nanometer TiO2 photocatalyst film
06/10/2008US7385276 Semiconductor device, and method for manufacturing the same
06/10/2008US7384458 Non-cyanide electroless gold plating solution and process for electroless gold plating
06/10/2008CA2415020C Activation of a cathode
06/05/2008WO2008067308A1 The growth of cadmium sulfide films under aqueous conditions using a biomimetic approach
06/05/2008WO2008064647A1 Ceramic coating material
06/05/2008WO2008017423A3 Thermoplastic product and method for the production of a composite product with selective electroplating
06/05/2008DE102006055763A1 Verfahren zur Metallisierung von Polyester und metallisierter Polyester Method for the metallization of polyester and metallized polyester
06/04/2008EP1927675A1 Ceramic corrosion resistant coating for oxidation resistance
06/04/2008EP1825021B1 Microfabrication using patterned topography and self-assembled monolayers
06/04/2008CN101194042A Method for forming metal film and metal wiring pattern, foundation composition for formation of metal film and metal wiring pattern, and metal film
06/04/2008CN101194041A Coating liquid for nickel film formation, nickel film and method for producing same
06/04/2008CN101191205A High corrosion resistance nickel-tin-phosphorus alloy plating liquid
06/04/2008CN100392008C Silane composition, silicon film forming method and manufacture method of solar cells
05/2008
05/29/2008WO2008063069A1 Method and apparatus for making partially coated products
05/29/2008WO2008062779A1 Resin composition for metal plating, molded article thereof, and metal-plated molded article
05/29/2008WO2008062634A1 Three-dimensional microstructure, method for manufacturing the microstructure, and apparatus for manufacturing the microstructure
05/29/2008WO2008062070A1 Advanced non-electrolytic method for metallizing a substrate by metallic salt(s) reduction and aerosol(s) projection
05/29/2008WO2008062017A1 Process for metallizing polyesters and metallized polyesters
05/29/2008WO2008029310A3 Delivery systems for delivering functional compounds to substrates and processes of using the same
05/29/2008US20080124552 increasing adherence between the two different particles and increasing adhesion of the plating nickel film or other electrically conductive film to the rough particle; endcapped and grafted polyoxyethylene glycol with polycarbodiimide; styrene-methacrylic acid copolymer coupled to silica particles
05/29/2008CA2700003A1 Process for metallizing polyesters and metallized polyesters
05/29/2008CA2670213A1 Advanced non-electrolytic method for metallizing a substrate by metallic salt(s) reduction and aerosol(s) projection
05/29/2008CA2670092A1 Method and apparatus for making partially coated products
05/28/2008EP1926109A1 Film forming apparatus and method of film formation
05/28/2008EP1925428A1 Method and apparatus for making partially coated products
05/28/2008EP1924632A2 Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and material for coupling a dielectric layer and a metal layer in a semiconductor device
05/28/2008CN101189362A Electroless nickel plating solution
05/28/2008CN101189361A Method and apparatus for material deposition
05/28/2008CN101187020A Surface chemical plating Ni-P process using nickel sulfate as main salt
05/28/2008CN101187019A Metal shell construction method using molecular sieve as core
05/28/2008CN101187018A Method for preparing silver nano antibacterial material
05/28/2008CN101187017A Method for preparing silver nano antibacterial material
05/28/2008CN101186990A Ultra-fine hard alloy coated powder and method for preparing same
05/28/2008CN101185850A Method for preparing multi-channel type hydrogen permeation palladium-based composite membrane
05/28/2008CN100390319C Method of plating nonconductor product
05/28/2008CN100390318C Method for repairing fine pattern and apparatus for repairing fine pattern
05/27/2008US7378478 Catalyst precursor composition for electroless plating, and preparation method of transparent electromagnetic interference shielding material using the same
05/22/2008WO2008059907A1 Method for forming corrosion resistant plating layer and rotating machine
05/22/2008WO2008059789A1 Silver-plated fine copper powder, conductive paste produced from silver-plated fine copper powder, and process for producing silver-plated fine copper powder
05/22/2008WO2008058430A1 Slight-alkaline silver electroless-palting solution
05/22/2008WO2007127798A3 Method for forming a tribologically enhanced surface using laser treating
05/22/2008US20080118745 Metallic Substrates Comprising A Deformable Glass-Type Coating
05/21/2008EP1923489A2 A multilayer printed circuit board and a process for manufacturing the same
05/21/2008EP1923488A2 A process for manufacturing a multilayer printed circuit board
05/21/2008EP1922436A2 Microfabrication using replciated patterned topography and self-assembled monolayers
05/21/2008EP1087428B1 Method for forming a silicon film and ink composition for inkjet printer
05/21/2008DE102007053345A1 Zweischichtiges mit Kupfer geschweißtes Stahlrohr, das außen mit Zink und PVF, innen mit Nickel beschichtet ist Two-layer welded steel with copper tube which is externally coated with zinc and PVF, inside with nickel
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