Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
02/2003
02/20/2003US20030036016 Particularly sub-170 nm such as 157 nm.; a fluorine-containing polymer, a photoactive component, and a solvent component that is a mixture of least two distinct solvents
02/20/2003US20030035896 Method of controlling drying stresses by restricting shrinkage of ceramic coating
02/20/2003US20030034251 Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing
02/20/2003US20030033956 Paste for formation of ceramic capacitor electrode
02/19/2003EP1284307A1 Method for providing a metal surface with a vitreous layer
02/19/2003EP1284306A2 Silane composition, silicon film forming method and solar cell production method
02/19/2003EP1283742A1 Separation module and method for producing the same
02/19/2003EP1141442B1 METHOD FOR PRODUCING A METAL ALLOY POWDER SUCH AS MCrAlY AND COATINGS OBTAINED WITH SAME
02/19/2003EP1141441B1 METHOD FOR FORMING A METAL ALLOY COATING OF THE TYPE MCrAlY
02/19/2003CN1398426A Improvement of liquid deposition by selection of liquid viscosity and other precursor properties
02/19/2003CN1397751A Metal pad plate and its prodn. method
02/19/2003CN1397420A Local welding method for parts otd. by jet moulding process
02/18/2003US6522009 Apparatus to electroless plate a metal layer while eliminating the photo electric effect
02/18/2003US6521285 Method for printing a catalyst on substrates for electroless deposition
02/13/2003WO2003012845A1 Semiconductor fabrication device and semiconductor fabrication method
02/13/2003WO2003011479A1 Selective electroless deposition and interconnects made therefrom
02/13/2003US20030031803 Coating with layer of polymer matrix doped with photoreducer material dielectric particles, irradiating the surface to be metallized with laser, and immersing the irradiated part in an autocatalytic bath containing metal ions
02/12/2003EP1283526A1 Metallisation of nucleic acids via metal nanoparticles produced ex-situ
02/12/2003CN1396304A Process for preparing high-performance Ni-P alloy solution for chemical plating
02/12/2003CN1396303A Metallic plating liquid
02/12/2003CN1396302A Electroosmosis regeneration system for chemical sedimentation groove electrolyte
02/12/2003CN1101351C Method for forming silver coating on glas substrate
02/11/2003US6518676 Metal interconnections and active matrix substrate using the same
02/11/2003US6518198 Electroless deposition of doped noble metals and noble metal alloys
02/11/2003US6518182 Via-filling process
02/11/2003US6517911 Process for the formation of silicon oxide films
02/11/2003US6517642 Method and apparatus of producing thin film of metal or metal compound
02/06/2003WO2003010356A1 Method for manufacturing pipe formed product and pipe formed product
02/06/2003WO2002079542A3 Improved adhesion of polymeric materials to metal surfaces
02/06/2003US20030027195 Metallisation of nucleic acids via metal nanoparticles produced ex-situ
02/06/2003US20030027020 Process for the coating of passivated metallic surfaces of components and such coated components
02/06/2003US20030026916 Method of metallization of an optical waveguide
02/06/2003US20030026912 Treatment for improved magnesium surface corrosion-resistance
02/06/2003US20030024432 Combination of an organometallic salt, an organosilane, and a borate, phosphate, or zinc functional component.
02/06/2003US20030024431 Containing dihydric copper ions, a complexing agent, an aldehyde acid, and an organic alkali; forming a thin film copper interconnection for a semiconductor device
02/06/2003DE10124002C1 Aqueous acid bath used for the currentless or galvanic deposition of silver contains silver in the form of a silver salt of a sulfonic or mercapto-carboxylic acid, and a thiodiethanol derivative as additional complex former
02/05/2003EP1281793A1 Method of metallising plastic surfaces
02/05/2003EP1281787A2 Additives for accelerator solution for electroless metal plating
02/05/2003EP1171646B1 Non-electrolytic gold plating compositions and methods of use thereof
02/05/2003CN1100910C Process for making electroless plated aromatic polyamide surface
02/04/2003US6514670 Method for designing and manufacturing a micromechanical device
02/04/2003US6513581 Heat exchanger with a reduced tendency to produce deposits and method for producing same
01/2003
01/30/2003WO2003009369A2 Sol solution for producing glass coatings for electrically conductive materials that can be used in anodic bonding
01/30/2003US20030022492 Metal film and manufacturing method therefor, and laminated ceramic electronic component and manufacturing method therefor
01/30/2003US20030022005 Laminated metal and rubber
01/30/2003US20030021887 Compositions containing heterocylcic nitrogen compounds and glycols for texturing resinous material and desmearing and removing resinous material
01/30/2003US20030021079 Ceramic film and manufacturing method therefor, ferroelectric capacitors, semiconductor device and other devices
01/30/2003US20030020157 Ceramic and method of manufacturing the same, dielectric capacitor, semiconductor device, and element
01/30/2003US20030019756 Reaction is executed in a reaction vessel containing matter in a supercritical or subcritical state and an electrolytic solution; free of generated liquid waste, no need to clean the electrode
01/30/2003US20030019653 Intermetallic contact surface structure and connector
01/30/2003US20030019426 Plating apparatus and method
01/29/2003EP1279750A1 Pretreating agent for metal plating
01/29/2003EP1278906A2 Methods and fabrics for combating nosocomial infections
01/28/2003US6512667 Supercapacitor using iron oxide as active material of electrodes formed on current collector which is portion of peripheral surface of case, chassis, compartment, cover, frame or housing of appliance or vehicle
01/28/2003US6511538 Film deposition method and apparatus for semiconductor devices
01/23/2003WO2003006395A1 Method of metallization of an optical waveguide
01/23/2003WO2001054203A3 Direct printing of thin-film conductors using metal-chelate inks
01/23/2003US20030015498 Contacting resinous material with a lactone solvent swell composition to condition the resinous material for porous texturing with an etchant; and contacting the conditioned resinous material with an etchant
01/22/2003EP1278238A1 Method for sealing fine groove with siliceous material and substrate having siliceous coating formed thereon
01/22/2003EP1278211A1 Conductive composition
01/22/2003EP1277852A1 Process for partially galvanising a workpiece made by injection moulding
01/22/2003EP1277851A1 Coating process of passivated, metallic surfaces of work-pieces and a so coated work-piece
01/22/2003EP1277572A1 Metal gasket raw material plate and manufacturing method therefor
01/22/2003EP1135547B1 Decorative beverage can bodies
01/21/2003US6509107 Polyolefin blend comprising a propylene-containing polymer formed from a semi-crystalline homo or copolymer of propylene with ethylene or an alpha olefin, styrene- monoolefin and styrene-diolefin copolymeric compatibilizer; an ABS polymer
01/21/2003US6509103 Electroless deposition of metal and optionally polymer layer such as copper or nickel and polytetrafluoroethylene; homo-and copolymers of ethylene with low fisheye count; molding materials; films, bags
01/16/2003WO2003005784A2 Conductor track structures and method for the production thereof
01/16/2003WO2003004725A2 Regeneration method for a plating solution
01/16/2003WO2002020872A3 Uv curable silver chloride compositions for producing silver coatings
01/16/2003WO2001083844A3 Method for depositing metal and metal oxide films and patterned films
01/16/2003US20030012971 Applying a durable urethane film to a metal surface
01/16/2003US20030012968 Piece having a portion of its visible surface galvanized, wherein the non-galvanized portion of its visible surface is covered in a film of non-galvanizable material that adheres strongly to the galvanized material
01/16/2003US20030011049 Interconnect circuitry, multichip module, and methods of manufacturing thereof
01/16/2003CA2450258A1 Regeneration method for a plating solution
01/15/2003EP1275273A1 Electrical device having ptc conductive polymer
01/15/2003EP1274880A2 Method for the selective, metal-based activation of substrate surfaces for the wet-chemical metal deposition without external current and a means therefore
01/15/2003EP0917597B1 Method for producing conductor track structures, especially fine conductor track structures, arranged on a nonconductive support material
01/15/2003CN1391242A Metal membrane and manufacture thereof, laminated ceramic electronic elements and manufacture thereof
01/15/2003CN1390979A Electroplating process
01/14/2003US6506509 Selective codeposition of particulate matter and plated articles thereof
01/14/2003US6506314 Adhesion of polymeric materials to metal surfaces
01/14/2003US6506293 Process for the application of a metal film on a polymer surface of a subject
01/09/2003WO2003003440A1 Semiconductor device and production method therefor
01/09/2003WO2003003381A1 Low temperature method and compositions for producing electrical conductors
01/09/2003WO2003002784A2 Electrolysis cell for restoring the concentration of metal ions in electroplating processes
01/09/2003WO2003002780A1 Surface treatment agent, article surface-treated therewith and method of nickel plating using the agent
01/09/2003WO2003002776A2 Method of anodizing of magnesium and magnesium alloys and producing conductive layers on an anodized surface
01/09/2003WO2003002773A2 Treatment for improved magnesium surface corrosion-resistance
01/09/2003WO2002004701A3 Electroless autocatalytic platinum plating
01/09/2003WO2002004700A3 Electroless silver plating
01/09/2003US20030008243 Ultra-large-scale-integration (ULSI) metallization; forming openings through first and second insulating layers, a tungsten nitride layer in contact with the openings, and providing a copper layer
01/09/2003US20030008075 ULSI wiring and method of manufacturing the same
01/09/2003US20030007314 Ceramic electronic component and method of producing the same
01/09/2003CA2451636A1 Low temperature method and compositions for producing electrical conductors
01/08/2003EP1274288A1 Conducting path structures and method of making
01/08/2003EP1273678A1 Electroless gold plating bath and method
01/08/2003EP1272686A2 Method for coating apparatuses and parts of apparatuses for the construction of chemical installations
01/08/2003EP1272685A2 Activator metals that are encapsulated in vesicles or metal clusters that adhere to vesicles and a method for producing same
01/08/2003EP1272684A1 Method for forming on a metal substrate a protective sulphur-free metal coating
01/08/2003EP1230034A4 Process for the non-galvanic tin plating of copper or copper alloys