Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
01/2004
01/27/2004US6682642 Seed repair and electroplating bath
01/27/2004US6682220 Lightweight bearing and wave gear drive
01/27/2004CA2092159C Process for improving the adhesiveness of electrolessly deposited metal films
01/22/2004WO2004007810A1 Electromagnetic wave shield material and process for producing the same
01/22/2004WO2004007798A1 Immersion plating of silver
01/22/2004WO2004007090A1 Apparatus and method for thermally controlled processing of microelectronic workpieces
01/22/2004US20040013808 Apparatus and method for thermally controlled processing of microelectronic workpieces
01/22/2004US20040013805 Processing method of creating rainbow color, method of manufacturing article which presents rainbow-colored reflective luster, and article which presents rainbow-coloured reflective luster
01/22/2004US20040013601 From deposition solution which comprises homogeneously dissolved platinum group metal compound, a reducing agent, control agent selected from isopolyacids and heteropolyacids of niobium, tantalum, molybdenum, vanadium, tungsten
01/22/2004US20040013597 Using an electroless plating technique; use of metallized carbon nanotubes as cold cathode field emitters
01/22/2004DE10228843A1 Verfahren zur chargenweisen Beschichtung von Sägedraht A method for the batchwise coating of saw wire
01/22/2004CA2484757A1 Immersion plating of silver
01/21/2004EP1381712A2 Electroless copper plating of ferrous metal substrates
01/21/2004EP1381711A2 Method for improving metal surfaces to prevent thermal tarnishing
01/21/2004EP1381522A1 Processing method of creating rainbow color, method of manufacturing article which presents rainbow-coloured reflective luster, and article which presents rainbow-coloured reflective luster
01/21/2004CN1469938A Selective fiber metallization
01/20/2004US6680540 Multiple layers of copper wires in insulation film covered by protective film and surrounded by barrier film, in which at least one film is cobalt-boron alloy containing chromium, molybdenum, tungsten, rhenium, thallium and/or phosphorus
01/20/2004US6680440 Using permanent plating resist, which is not degraded by conventional baths, to protect substrate areas, including metallized features on substrate, from deposition of metal during plating
01/20/2004US6680273 Plating catalysts and electronic packaging substrates plated therewith
01/20/2004US6680128 Method of making lead-free solder and solder paste with improved wetting and shelf life
01/20/2004US6679996 Metal oxide pattern forming method
01/20/2004CA2236393C Method and device for regenerating tin-plating solutions
01/15/2004WO2004006305A1 Electroless plating apparatus and post-electroless plating cleaning method
01/15/2004WO2004005577A2 Substrates comprising a photocatalytic tio2 layer
01/15/2004WO2003056062A3 Polymer derivatives for treating metals
01/15/2004WO2003053895A3 Copper deposition using copper formate complexes
01/15/2004WO2003033779B1 Coating method for light metal alloys
01/15/2004WO2002047139A3 Methode of forming a copper film on a substrate
01/15/2004US20040009344 Pigmented alkoxyzirconium sol
01/15/2004US20040009298 Methods for producing submicron metal line and island arrays
01/15/2004US20040009296 Coating with calcium-containing compound before heat treating builds continuous uniform and adherent layer on surface of alloy, so that aluminum depletion of alloy is reduced under cyclic thermal stress; high temperature corrosion resistance
01/15/2004US20040009292 Including one or more water soluble gold compounds, gold complexing agents, organic stabilizer compounds, and carboxylic acid uniformity enhancers; for printed wiring board substrates, integrated circuits, lead frames, pads
01/15/2004US20040007472 Lead-free chemical nickel alloy
01/15/2004US20040007471 Method of locally plating a part
01/15/2004DE10327257A1 Verfahren zur Bildung von Metallkolloidmustern A method of forming metal colloid patterns
01/14/2004EP1380671A1 Method of pretreatment of material to be electrolessly plated
01/14/2004EP1141443B1 A method of metallizing the surface of a solid polymer substrate and the product obtained
01/14/2004CN1468326A Method for enhancing the solderability of a surface
01/14/2004CN1468324A Bath and method of electroless plating of silver on metal surfaces
01/14/2004CN1468323A Coating blade and method for making same
01/14/2004CN1468150A Supported catalyst consisting of metal of the platinum group and obtained by means of controlled electroless deposition
01/14/2004CN1468148A Supported catalyst consisting of metal of the platinum group and obtained by means of controlled electroless deposition
01/14/2004CN1467304A Non-conductor metallization manufacturing process applying ultrasonic equipment to activator containing colloid
01/08/2004WO2004003663A2 Apparatus and method for treating a substrate electrochemically while reducing metal corrosion
01/08/2004WO2004002674A1 Sn-Ag BASED LEAD-FREE SOLDER
01/08/2004WO2004002634A1 Corrosion resistant coatings and method of producing
01/08/2004US20040005483 Perovskite manganites for use in coatings
01/08/2004US20040005415 Ultraviolet light curable silver chloride compositions and method for making such a composition that may be used to produce a silver coating on a substrate. The disclosed composition does not contain any significant amount of
01/08/2004US20040005412 Organometallic precursor mixture for forming metal alloy pattern and method of forming metal alloy pattern using the same
01/08/2004US20040003713 Fuel pump for inter-cylinder direct fuel injection apparatus
01/08/2004DE10227362A1 Komplexbildner für die Behandlung von Metall- und Kunstoffoberflächen Complexing agents for the treatment of metal and plastic surfaces
01/07/2004EP1378664A2 Fuel pump for direct fuel injection apparatus
01/07/2004EP1378584A1 Electroless nickel plating solutions
01/07/2004CN1133757C Chemical bismuth plating process
01/06/2004US6673388 Depositing and patterning metallo-organic and liquid dielectric material components, decomposing with laser light to evaporate the liquid and cause the metallic portion to react with oxygen
01/06/2004US6673387 Heating metal oxyfluoride intermediate on surface of vessel; forming oxide superconductor
01/06/2004US6673227 Seeding; solvent selective removal
01/02/2004EP1376533A1 Metal components for string instrument
01/02/2004EP1376234A1 Method for forming metal pattern
01/02/2004EP1375700A1 Deposition of silver layer on nonconducting substrate
01/02/2004EP1375699A1 Method for forming metal pattern
01/02/2004EP1375595A1 Polyimide resin precursor solution, laminates for electronic components made by using the solution and process for production of the laminates
01/02/2004EP1375334A1 A plated component with a hybrid surface and method for manufacturing same
01/02/2004EP1375043A1 Process for charge wise coating of saw wire
01/02/2004EP1373626A2 Domestic appliance and method of manufacturing thereof
01/02/2004EP1373596A2 Forming a conductor circuit on a substrate
01/02/2004EP1252362B1 Method and device for depositing a precursor on a substrate, said precursor being present in the liquid form
01/01/2004US20040001922 Method for the batch coating of saw wire
01/01/2004US20040001259 Process for producing microlens array, array master, electrolytic solution and microlens array resin material therefor and apparatus for producing master
12/2003
12/31/2003WO2004001823A1 Semiconductor device manufacturing method
12/31/2003WO2004001355A2 Temperature control sequence of electroless plating baths
12/31/2003WO2004001178A2 Method and apparatus for downhole pipe or casing repair
12/31/2003WO2004001099A2 Complexing agent for treating metallic and plastic surfaces
12/31/2003WO2003038146A3 High resolution patterning method
12/31/2003WO2002092877A3 Catalyst-imparting treatment solution and electroless plating method
12/31/2003CN1464918A Surface treatment agent, rticle surface treated therewith and method of nickel plating using the agent
12/31/2003CN1464862A Ceramic and method for preparation thereof, and dielectric capacitor, semiconductor and element
12/31/2003CN1464861A Ceramics film and production method therefor, and ferroelectric capacitor, semiconductor device, other elements
12/31/2003CN1132964C Anticorrosive wear-resistant gradient film
12/31/2003CN1132963C Formula for chemical plating nickel and application thereof
12/31/2003CA2489916A1 Complexing agent for treating metallic and plastic surfaces
12/30/2003US6670308 Electrochemistry; electromagnetism; superconductivity; biaxially orientented films
12/30/2003US6670031 Resin-coated metal sheet for parts of electronic machinery and tools and production method thereof
12/30/2003US6669997 Acousto-immersion coating and process for magnesium and its alloy
12/30/2003US6669489 Interposer, socket and assembly for socketing an electronic component and method of making and using same
12/25/2003US20030235983 Temperature control sequence of electroless plating baths
12/25/2003US20030235658 An aqueous bath mixture for forming an inorganic phosphides coatings, comprising cobalt sulfate, tungsten trioxide, tungsten-phosphoric acid (H3PW12O40) and a reducing agent; free of alkali metal ions and alkaline earth metal ions
12/25/2003US20030233960 Method for electroless plating without precious metal sensitization
12/24/2003WO2003106734A2 Metallisation
12/24/2003CN1131894C Preteatment solution for electroless plating, electroless plating bath and electroless plating method
12/24/2003CN1131893C Copperplating additive, its prepn. method and application in coppered welding wire
12/24/2003CN1131733C Soup treatment appts.
12/18/2003WO2003105548A1 Metallised parts made from plastic material
12/18/2003WO2003105200A1 Substrate processing apparatus and substrate processing method
12/18/2003WO2003104532A1 Components for electrical connectors, and metal strip therefore
12/18/2003WO2003104527A1 Acidic solution for silver deposition and method for silver layer deposition on metal surfaces
12/18/2003WO2003104526A1 Process for metallising support media made from plastic material
12/18/2003US20030232286 Forming a photosensitive layer including solvent and polysiloxane on a substrate, forming a latent image, contacting with a metal colloid solution where exposed parts adsorb metal colloid; optical filters, catalyst films
12/18/2003US20030232206 Roughening then coating with sol-gel; corrosion resistance; for use with stainless steel; not for use with lithographic plates
12/18/2003US20030232148 Mixtures of nickel salts of alkylsulfonic acid and reducing agents such as hypophosphorous acid, used for coating alloy substrates