| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 04/15/2004 | US20040072456 Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods |
| 04/15/2004 | US20040072419 Method for applying metal features onto barrier layers using electrochemical deposition |
| 04/15/2004 | US20040072015 Composite material with improved binding strength and method for forming the same |
| 04/15/2004 | US20040072011 Electroless brass plating method and product-by-process |
| 04/15/2004 | US20040071959 Resin-coated metal sheet for parts of electronic machinery and tools and production method thereof |
| 04/15/2004 | US20040071864 Method to produce a reliable piezoelectric thick film on a substrate |
| 04/15/2004 | US20040070326 Enhanced field emission from carbon nanotubes mixed with particles |
| 04/15/2004 | US20040069650 Coating with a resin containing dispersed metal powder; electroless deposition from solution containing ions of a second metal having an ionization potential nobler than that of first metal; electroplating film of third metal |
| 04/15/2004 | US20040069649 Production method for flexible printed board |
| 04/15/2004 | US20040069647 Plating apparatus, cartridge and copper dissolution tank for use in the plating apparatus, and plating method |
| 04/15/2004 | US20040069646 Electrolytic treatment, such as plating or etching; providing a high resistance structure having an electrical conductivity lower than that of the electrolytic solution in the solution filled between a substrate in contact with an electrode |
| 04/15/2004 | US20040068869 Mounting spring elements on semiconductor devices, and wafer-level testing methodology |
| 04/15/2004 | DE10246695A1 Manufacture of display zone e.g. of illuminated transparent plastic touch key uses galvanizable plastic base layer to which non-galvanizable and galvanic layers are applied |
| 04/15/2004 | DE10246453A1 Electrolyte used in process for high speed electroless plating with nickel film having residual compressive stress is based on nickel acetate and also contains reducing agent, chelant, accelerator and stabilizer |
| 04/15/2004 | CA2500799A1 Method of fabricating a magnetic tag |
| 04/15/2004 | CA2499559A1 Protective ceramic coating |
| 04/14/2004 | EP1408539A1 Semiconductor device and production method therefor |
| 04/14/2004 | EP1408338A2 Method for making a probe card with multiple contact tips for testing integrated circuit |
| 04/14/2004 | EP1408337A2 Probe card assembly |
| 04/14/2004 | EP1408197A1 Method for forming abrasion-resistant layer for moving blade, abrasion-resistant layer and method for regeneration thereof, and gas turbine |
| 04/14/2004 | EP1408139A1 Electroless brass plating method |
| 04/14/2004 | EP1407487A2 Sol solution for producing glass coatings for electrically conductive materials that can be used in anodic bonding |
| 04/14/2004 | CN1488934A Differential scanning calorimeter instrument and anticorrosive treating method thereof |
| 04/14/2004 | CN1488778A Liquid cement gold-plating mirror formulation and technical method thereof |
| 04/13/2004 | US6720499 Copper circuitry, and a finish coating of tin, and an alloy cap layer of at least two immersion-platable metals (tin and silver for example); solderable for at least a year |
| 04/13/2004 | US6720211 Method for fabricating electric interconnections and interconnection substrate having electric interconnections fabricated by the same method |
| 04/08/2004 | WO2004029335A1 Electrode element and method for manufacturing same |
| 04/08/2004 | WO2004029328A1 Method of electroless plating |
| 04/08/2004 | WO2004029327A1 Method for pretreating a surface of a non-conducting material to be plated |
| 04/08/2004 | WO2004029326A2 Creating layers in thin-film structures |
| 04/08/2004 | WO2004028999A2 Thin films of oxidic materials having a high dielectric constant |
| 04/08/2004 | WO2004001178A3 Method and apparatus for downhole pipe or casing repair |
| 04/08/2004 | WO2003106734A3 Metallisation |
| 04/08/2004 | US20040067314 Aqueous alkaline zincate solutions and methods |
| 04/08/2004 | US20040067312 Method for forming thin film and catalyzed treatment solution used therefor |
| 04/08/2004 | US20040065540 Liquid treatment using thin liquid layer |
| 04/08/2004 | DE19755185B4 Austausch Zinnbad Exchange tin bath |
| 04/08/2004 | DE10245928A1 Process for the structured selective metallization of a surface of a substrate comprises preheating the substrate to a temperature below the deposition temperature of a predetermined metal and depositing the metal in predetermined regions |
| 04/08/2004 | DE10214859B4 Verfahren zum Verkupfern oder Verbronzen eines Gegenstandes und flüssige Gemische hierfür A process for the coppering or bronzing of an object, and liquid mixtures thereof |
| 04/07/2004 | EP1405336A2 Substrate processing method |
| 04/07/2004 | EP1404746A2 Pre-treatment of plastic materials |
| 04/07/2004 | CN1487978A Polyimide resin precursor solution, laminates for electronic components made by using the solution and process for production of the laminates |
| 04/07/2004 | CN1145231C Electrode structure body, chargeable cell and its producing method |
| 04/06/2004 | US6716795 Useful where an electronically active layer is deposited on the buffer layer |
| 04/06/2004 | US6716773 Forming a coating film by coating an insulating film-forming coating liquid on substrate mounted on a rotating disc of a spin coater; removing a projected portion of coating film formed at periphery of substrate by ejecting a solvent |
| 04/06/2004 | US6716332 Plating method and apparatus |
| 04/06/2004 | US6716330 Electroless plating apparatus and method |
| 04/01/2004 | WO2004028201A1 Method for preparing highly loaded, highly dispersed platinum metal on a carbon substrate |
| 04/01/2004 | WO2004027837A1 Temperature-controlled substrate holder |
| 04/01/2004 | WO2004027115A1 Method and solution for treating fluorocarbon surfaces |
| 04/01/2004 | WO2004027114A1 Electroless plating apparatus and electroless plating method |
| 04/01/2004 | WO2004027113A2 Improved silver plating method and articles made therefrom |
| 04/01/2004 | WO2004026509A1 Coated metallurgical particles |
| 04/01/2004 | US20040063915 Comprises protein polymers coated with metal for preparation of tubulin-based cytoskeltal fibers |
| 04/01/2004 | US20040062861 Method of electroless plating and apparatus for electroless plating |
| 04/01/2004 | US20040060874 Conveying through adsorbent bed; oxidation, decomposition, and elution |
| 04/01/2004 | US20040060824 Chemical treatment, plating, and residue elimination method |
| 04/01/2004 | US20040060436 Removing oxygen from a copper plating solution using hollow hydrophobic fiber membranes; intrusion of solution into membrane pores is avoided |
| 04/01/2004 | CA2539656A1 Improved silver plating method and articles made therefrom |
| 04/01/2004 | CA2518305A1 Method for preparing highly loaded, highly dispersed platinum metal on a carbon substrate |
| 03/31/2004 | CN1485460A Method for restoring dimension discrepancy of bearing utilizing chemical plating nickel |
| 03/31/2004 | CN1143656C Radioactive 32P blood vessel support and its manufacture |
| 03/30/2004 | US6713377 Method of electroless plating copper on nitride barrier |
| 03/30/2004 | US6713122 Methods and apparatus for airflow and heat management in electroless plating |
| 03/30/2004 | US6712998 Process for producing transparent conductive layer forming coating liquid |
| 03/30/2004 | US6712948 Etching plastic surface under mild conditions, treating with solution containing cobalt, silver, tin, and/or lead salts having ph from about 7.5 to about 12.5, treating with sulfide solution, metallizing |
| 03/26/2004 | CA2442642A1 Process for manufacturing an aluminum nitride ain substrate |
| 03/25/2004 | WO2004024986A1 Method of creating nanoparticle and electroless plating using irradiation of synchrotron x-ray |
| 03/25/2004 | WO2004024985A1 Electroless-plating solution, method of electroless plating with the same, and object plated by electroless plating |
| 03/25/2004 | WO2004024984A1 Method for metal plating and pre-treating agent |
| 03/25/2004 | WO2004024983A2 Method and apparatus for electroless deposition with temperature-controlled chuck |
| 03/25/2004 | WO2003060959A3 Method for applying metal features onto barrier layers using electrochemical deposition |
| 03/25/2004 | WO2003029518A3 Precious metal recovery |
| 03/25/2004 | WO2003023086A3 Use of a solution for roughening the surface of plastics |
| 03/25/2004 | US20040058167 Article having nano-scaled structures and a process for making such article |
| 03/25/2004 | US20040058143 Resin composition, process for producing the same and electrophotographic fixing member |
| 03/25/2004 | US20040058088 Preparing a substrate of a polymer material; surface-modifying the substrate; forming a seed layer on the substrate; and forming the thick film on the seed layer |
| 03/25/2004 | US20040058079 Method for forming porous silica film |
| 03/25/2004 | US20040058071 Colloidal seed formation for printed circuit board metallization |
| 03/25/2004 | US20040058070 Filling the holes of the internal member with padding plugs each of which has a core member made from a metal material and a metal- resin composite layer covering surface of core; forming a ceramic coating film; extracting the padding plugs |
| 03/25/2004 | US20040058067 For electroless plating |
| 03/25/2004 | US20040055888 Monitoring plating bath; quantitative, qualitative analysis |
| 03/25/2004 | US20040055509 Mixture containing nonionic surfactant and stabilizer; overcoating substrate with bismuth ferrite; heat treatment |
| 03/25/2004 | US20040055503 Method and solution for treating fluorocarbon surfaces |
| 03/23/2004 | US6709980 Using stabilizers in electroless solutions to inhibit plating of fuses |
| 03/23/2004 | US6709806 Electroconductive zones on dielectric |
| 03/23/2004 | US6709803 Conductor pattern is formed on surface of insulating substrate by electroless copper plating; anionic surfactant suppresses adsorption of palldium-tin mixed colloid catalyst to the plating resist solution; electronics |
| 03/23/2004 | US6709561 Cyclic voltammetric stripping analysis; comparing the electro-deposition rate parameters for solutions; separate analyses for hypophosphite and dimethylamineborane in baths by selective decomposition of the dimethylamineborane in acid |
| 03/23/2004 | US6709555 Plating method, interconnection forming method, and apparatus for carrying out those methods |
| 03/18/2004 | WO2004023584A1 Composite current collector |
| 03/18/2004 | WO2004022815A1 Plated polyester resin article and method for production thereof |
| 03/18/2004 | WO2004022248A1 A method for depositing a film on a substrate |
| 03/18/2004 | US20040052963 Decrease in the temperature of the working solution prevents thermal decomposition and reduces formation of bubbles; semiconductors/integrated circuits; dielectrics |
| 03/18/2004 | US20040052961 Electroless copper plating of ferrous metal substrates |
| 03/18/2004 | US20040051129 Metal oxide integrated circuit on silicon germanium substrate |
| 03/18/2004 | DE10241137A1 Process for metallizing plastics comprises impinging the surface of the plastic with metal particles, covering the surface with microbes, metallizing without using an external current and reinforcing using a galvanizing method |
| 03/17/2004 | CN1482276A Topical nickel galvanization of Aluminium alloy radiator structure |
| 03/17/2004 | CN1142320C Composite coating containing inorganic fullerene structure nano material and method for preparing the same |
| 03/17/2004 | CN1142319C Environment-protecting type microcrystal alloy plating solution |
| 03/16/2004 | US6706646 Spin-on glass composition and method of forming silicon oxide layer in semiconductor manufacturing process using the same |