Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
05/2003
05/22/2003US20030096134 An electroless nickel plating surface layer providing hardness, excellent sliding characteristics, resist to peeling, wear resistance; non heat-treated layer
05/22/2003US20030096064 Electroless gold plating bath and method
05/22/2003US20030096059 Semiconductors; void occurence suppressed in junction layer; occurrence of cracks, swelling, and exfoliation in the plating layer suppressed
05/21/2003EP0804877B1 Antimicrobial solid material, process for producing the same, and method of utilizing the same
05/21/2003CN1419609A Method for coating apparatus and parts of apparatuses for the construction of chemical installations
05/21/2003CN1418980A Hardness increasing method for chemical nickel boron alloy cladding
05/20/2003US6566254 Method for forming a silicide film on gate electrodes and diffusion layers of MOS transistors
05/20/2003US6565774 Paste for formation of ceramic capacitor electrode
05/20/2003US6565641 Inorganic film-forming coating composition, preparation method thereof and inorganic film-forming method
05/20/2003US6565217 Silver coated mirror
05/20/2003US6564448 Resin structure in which manufacturing cost is cheap and sufficient adhesive strength can be obtained and method of manufacturing it
05/15/2003WO2003041145A1 Plating solution, semiconductor device and method for manufacturing the same
05/15/2003WO2003040432A1 Nickel-based surface treatment films excellent in heat-resistant adhesion to resin
05/15/2003WO2003040430A1 Substrate processing apparatus and method
05/15/2003WO2003039828A1 Honeycomb structural body forming ferrule and method of manufacturing the ferrule
05/15/2003WO2003039827A1 Honeycomb structural body forming ferrule, and method of manufacturing the ferrule
05/15/2003US20030092264 Substrate processing apparatus and method
05/15/2003US20030092261 Substrate processing method
05/15/2003US20030090345 Surface conductive resin, a coaxial cable, a wiring board, and process for manufacturing the same
05/14/2003EP1310579A1 Coating material for forming titanium oxide film, method for forming titanium oxide film and use of said coating material
05/14/2003EP1310142A2 Improved adhesion of polymeric materials to metal surfaces
05/14/2003EP1113886A4 Silver film incorporating protective insoluble metallic salt precipitate
05/14/2003EP1060289B1 Method of preparing lithiated vanadium oxide-coated substrates of optical quality
05/14/2003CN1418451A Electrical device having PTC conductive polymer
05/14/2003CN1417377A Preparation of coating solution for forming transparent conducting layer
05/14/2003CN1417376A Regeneration process of non-electrolysis plating liquid
05/14/2003CN1416986A High temperature antioxidant base metal composition and its production process
05/13/2003US6562408 Forming high transmittance, defect free materials for optical waveguides
05/13/2003CA2153848C Oxide thin film having quartz crystal structure and process for producing the same
05/08/2003WO2003038157A1 Method for forming electroplated coating on surface of article
05/08/2003WO2003038148A1 Plating apparatus and plating method
05/08/2003WO2003038147A2 High resolution patterning method
05/08/2003WO2003038146A2 High resolution patterning method
05/08/2003WO2003037996A1 Coating compound for forming titanium oxide film, method for forming titanium oxide film and metal substrate coated with titanium oxide film
05/08/2003WO2002016059A3 Narrow diameter needle having reduced inner diameter tip
05/08/2003US20030087097 Force-transmitting surface layer and process for its production
05/08/2003US20030085386 Process for producing transparent conductive layer forming coating liquid
05/08/2003US20030085199 Which can increase decomposition efficiency of organic substance or production of hypochlorous acid by improving performance of catalytic oxide anode
05/06/2003US6559469 Ferroelectric and high dielectric constant transistors
05/06/2003US6559071 Process for producing dielectric thin films
05/06/2003US6558516 Method of frame plating and method of forming magnetic pole of thin-film magnetic head
05/06/2003US6558463 For forming a uniform film free from uneven coating (striation)
05/06/2003US6558448 Metal deposition; accuracy controlled nucleation
05/02/2003EP1306466A2 Electroless gold plating composition
05/02/2003EP1306465A2 Stabilizers for electroless plating solutions and methods of use thereof
05/02/2003EP1305824A1 Method of making electronic materials
05/01/2003WO2003035932A1 Method for forming a micro-pattern on a substrate by using capillary force
05/01/2003US20030080083 Electroless plating apparatus, semiconductor wafer having bumps, semiconductor chip having bumps, methods of manufacturing the semiconductor wafer and the semiconductor chip, semiconductor device, circuit board, and electronic equipment
04/2003
04/30/2003DE10132478C1 Verfahren zum Abscheiden einer Metallschicht sowie Verfahren zum Regenerieren einer Metallionen in einer hohen Oxidationsstufe enthaltenden Lösung A method of depositing a metal layer as well as methods for regenerating a metal ions in a high oxidation state solution containing
04/29/2003US6555178 Process and apparatus for nickel plating and nickel-plated product
04/29/2003US6555171 Contact displacement technique is used to form a seed layer of copper, tin and palladium (Cu/Sn/Pd) on the diffusion barrier layer, copper is electrolessly deposited autocatalytically on the activated barrier layer; void-free copper deposition
04/29/2003US6555158 Removing organic material from a plating region, surface hydrophilizing the plating region, bonding a coupling agent to the surface, bonding catalytic metal with the coupling agent, exposing said metal and electrolessly plating
04/24/2003WO2003033779A2 Coating method for light metal alloys
04/24/2003WO2003033765A1 Plating apparatus
04/24/2003WO2003033764A2 Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions
04/24/2003WO2003033436A2 Coating precursor and method for coating a substrate with a refractory layer
04/24/2003WO2003033435A2 Coating precursor and method for coating a substrate with a refractory layer
04/24/2003WO2003009369A3 Sol solution for producing glass coatings for electrically conductive materials that can be used in anodic bonding
04/24/2003WO2003005784A3 Conductor track structures and method for the production thereof
04/24/2003US20030075808 Semiconductor device, method for manufacturing the same, and plating solution
04/24/2003US20030074814 Iron and sole plate for an iron
04/24/2003CA2464340A1 Coating precursor and method for coating a substrate with a refractory layer
04/24/2003CA2463568A1 Coating precursor and method for coating a substrate with a refractory layer
04/23/2003EP1304022A1 Method for making a circuitry comprising conductive tracks, chips and micro-vias and use of same for producing printed circuits and multilayer modules with high density of integration
04/23/2003EP1303643A2 Improvement in the production of a zinc-aluminum alloy coating by immersion into molten metal baths
04/22/2003US6551719 Reaction vessel of oxidization and decomposition processing equipment by supercritical water and method for manufacturing the same
04/22/2003US6551661 Oxidizing pretreatment using potassium permanganate at 20-35 degrees c, washing, draining and drying; depositing pyrrole, furan, aniline, thiophen or derivatives, polymerizing to a electroconductive polymer, washing and draining
04/22/2003US6551652 Applying a first sol for forming the piezoelectric film on a substrate having the lower electrode, to form a lower film, applying second sol having greater lead content than first sol to form upper film, heat treating the films
04/17/2003WO2003032380A1 Device and method for processing substrate
04/17/2003WO2003032084A2 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
04/17/2003WO2003031683A1 Powder coated with titania film and method for production thereof
04/17/2003WO2003031682A2 Photolytic conversion process to form patterned amorphous film
04/17/2003WO2003031681A1 Iron core exhibiting excellent insulating property at end face, and method for coating end face of iron core
04/17/2003WO2003031673A1 Thin metal oxide film and process for producing the same
04/16/2003EP1302567A1 Coating method for light metal alloys
04/16/2003EP1301653A1 Coating blade and method for making same
04/16/2003EP0698191B1 Plumbing fixture carrying drinking water comprised of a copper alloy
04/16/2003CN1410593A Nickel phosphorus chemical plating method of neodymium iron boron permanent magnet material
04/16/2003CN1410592A Method of supersonic chemical plating nickel phosphorus of powder metallurgy material
04/16/2003CN1410591A Method of lowering crystallization temperature of chemical plated nickel alloy
04/16/2003CN1410590A Method of preparing diamond and diamond like film
04/15/2003US6548898 External connection terminal and semiconductor device
04/15/2003US6548412 Method of forming patterned thin film
04/10/2003WO2003030600A1 Printed wiring board and production method for printed wiring board
04/10/2003WO2003029519A1 Method for producing metal plated plastic article
04/10/2003WO2003029518A2 Precious metal recovery
04/10/2003US20030066754 Method for manufacturing copper-resin composite material
04/10/2003CA2460015A1 Precious metal recovery
04/09/2003EP1300485A1 Power transmitting surface layer and method for the production thereof
04/09/2003EP1299574A1 Surface modified stainless steel
04/09/2003EP1144723B1 Method for coating apparatuses and parts of apparatuses used in chemical manufacturing
04/09/2003CN1408899A Additive for promoter solution of chemical metal plating
04/08/2003US6544657 Synthesis of oligosilazane-containing compounds for the production of a ceramic-like material
04/08/2003US6544589 Method of controlling drying stresses by restricting shrinkage of ceramic coating
04/08/2003US6544397 Method for enhancing the solderability of a surface
04/08/2003US6544392 Apparatus for manufacturing pcb's
04/08/2003CA2072274C Improved method of applying metal coatings on cubic boron nitride and articles made therefrom
04/03/2003WO2003027353A1 Method for production of a metal layer on a support body and support body with a metal layer
04/03/2003US20030064165 Process for preparing copper-film-plated steel cord for vehicle tire
04/03/2003US20030062599 Process for producing semiconductor substrates and semiconductor substrates