| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 09/19/2002 | US20020130037 System for the electrodialytic regeneration of an electroless bath electrolyte |
| 09/18/2002 | EP1241481A2 Contact structure for interconnections, interposer, semiconductor assembly and method |
| 09/18/2002 | EP1241279A1 Process for metallising a substrate |
| 09/18/2002 | EP1241209A2 Solvent swell containing heterocyclic nitrogen compounds and glycols for texturing resinous material and desmearing and removing resinous material |
| 09/18/2002 | EP0946785B1 A process for treating aramid surfaces to be plated |
| 09/17/2002 | US6451685 Method for multilevel copper interconnects for ultra large scale integration |
| 09/17/2002 | US6451450 Method of depositing a protective layer over a biaxially textured alloy substrate and composition therefrom |
| 09/17/2002 | US6451377 Pyrolysis of metal-containing polymers |
| 09/17/2002 | US6451375 Process for depositing a film on a nanometer structure |
| 09/17/2002 | US6449835 Resin structure in which manufacturing cost is cheap and sufficient adhesive strength can be obtained and method of manufacturing it |
| 09/12/2002 | WO2002070780A1 Method for plating polymer molding material, circuit forming component and method for producing circuit forming component |
| 09/12/2002 | WO2001077419A3 Process for the direct metal-plating of a plastic substrate |
| 09/12/2002 | US20020127790 Electroless plating apparatus and method |
| 09/12/2002 | US20020127348 Method for depositing copper or a copper alloy |
| 09/12/2002 | US20020127335 Method for preparing and forming a thick coating of PZT using sol-gel process |
| 09/12/2002 | US20020124413 Cutting tool with an electroless nickel coating |
| 09/11/2002 | EP1239057A1 System for the electrolytic regeneration of a bath for electroless plating |
| 09/11/2002 | CN1090454C Antibacterial solid, process for producing the same, and method of utilizing the same |
| 09/10/2002 | US6447914 Seeding and electroless plating; dielectric layer is an epoxy resin, which is a phenoxy polyol resin, the condensate of an epihalohydrin and bisphenol a or an epoxidized bisphenol a formaldehyde novolac resin |
| 09/05/2002 | US20020123176 Method for fabricating electric interconnections and interconnection substrate having electric interconnections fabricated by the same method |
| 09/05/2002 | US20020121709 External connection terminal and semiconductor device |
| 09/05/2002 | US20020121441 Chemical plating method, electrolytic cell and automotive oxygen sensor using it |
| 09/05/2002 | US20020121154 Plated synthetic resin member for vehicle |
| 09/04/2002 | EP1236813A2 Members coated with composite oxide coatings for preventing the permeation of hydrogen isotopes and a process for producing such members |
| 09/04/2002 | EP1236760A1 Solvent swell for texturing resinous material and desmearing and removing resinous material |
| 09/04/2002 | EP0964076B1 Microporous copper film and electroless copper plating solution for obtaining the same |
| 09/04/2002 | CN1367273A Chemical preparation method of controllable metal nano conductor |
| 09/03/2002 | US6444109 Immersion silver deposits created are resistant to electromigration, electronics |
| 09/03/2002 | US6444083 Corrosion resistant component of semiconductor processing equipment and method of manufacturing thereof |
| 09/03/2002 | US6443581 Method for forming a metallic mirror surface on an underlay |
| 08/29/2002 | WO2002066728A2 Iron and sole plate for an iron |
| 08/29/2002 | WO2002066727A2 Domestic appliance and method of manufacturing thereof |
| 08/29/2002 | WO2002066701A2 Process for depositing a metal coating containing nickel and boron |
| 08/29/2002 | US20020119851 Pulley with microprofiled surface |
| 08/29/2002 | US20020119657 Bonding copper nucleation layer to barrier undercoatings |
| 08/29/2002 | US20020119251 Depositing catalytic particles on a selected area of the stamp including raised region, applying stamp on the substrate to indent selectd region caused by raised region, transferring catalyst particles, plating selected area |
| 08/29/2002 | US20020117400 Conductor pattern is formed on surface of insulating substrate by electroless copper plating; anionic surfactant suppresses adsorption of palldium-tin mixed colloid catalyst to the plating resist solution; electronics |
| 08/29/2002 | US20020117330 Resilient contact structures formed and then attached to a substrate |
| 08/29/2002 | US20020117107 Continuous ceramic composite plating method and apparatus for long doctor base materials |
| 08/28/2002 | EP1234063A2 Chemical fluid deposition for the formation of metal and metal alloy films on patterned and unpatterned substrates |
| 08/28/2002 | EP0837750B1 Wire bonding, severing, and ball forming |
| 08/27/2002 | US6440751 Method of manufacturing thin film and thin film capacitor |
| 08/27/2002 | US6440576 Metal plated aromatic polyimide film |
| 08/27/2002 | US6440211 Method of depositing buffer layers on biaxially textured metal substrates |
| 08/22/2002 | WO2002065536A2 Rapid-temperature pulsing anneal method at low temperature for fabricating layered superlattice materials and making electronic devices including same |
| 08/22/2002 | WO2002064862A2 Method for producing plated molded product |
| 08/22/2002 | US20020115307 Manufacturing method for ferroelectric thin film using sol-gel process |
| 08/22/2002 | US20020112952 Object plating method and system |
| 08/21/2002 | EP1232828A1 Wire bonding, severing, and ball forming |
| 08/21/2002 | EP1232294A2 Metallizing method for dielectrics |
| 08/20/2002 | US6436816 Patterns to form an interconnect; said metal layer composed of a material selected from the group consisting of ni, cu, and palladium, |
| 08/20/2002 | US6436803 Manufacturing computer systems with fine line circuitized substrates |
| 08/20/2002 | US6436479 Alcohol solution containing nickel ions such as nickel acetate, and a reducible chelate type ligand having a hydrazone unit, such as acetal hydrazone |
| 08/15/2002 | WO2002063672A1 Method for multilevel copper interconnects for ultra large scale integration |
| 08/15/2002 | WO2002063067A1 Method of electroless plating and apparatus for electroless plating |
| 08/15/2002 | WO2002062446A1 Process for degassing an aqueous plating solution |
| 08/15/2002 | US20020111019 Method and an apparatus to electroless plate a metal layer while eliminating the photoelectric effect |
| 08/15/2002 | US20020110958 Electronic component and method of manufacturing same |
| 08/15/2002 | US20020110934 Rapid- temperature pulsing anneal method at low temperature for fabricating layered superlattice materials and making electronic devices including same |
| 08/14/2002 | EP1230034A1 Process for the non-galvanic tin plating of copper or copper alloys |
| 08/14/2002 | CN1364311A Reduced electromigration and stress induced migration of Cu wires by surface coating |
| 08/14/2002 | CN1089121C Chemical nickel-plating method for surface of metal material |
| 08/14/2002 | CN1089120C Plating method |
| 08/13/2002 | US6432585 Electrode structural body, rechargeable battery provided with said electrode structural body, and rechargeable battery |
| 08/13/2002 | US6432474 Thin film of perovskite type manganese oxide process for producing the same thin film and an infrared sensing element using the same thin film |
| 08/13/2002 | US6432472 Method of making semiconductor supercapacitor system and articles produced therefrom |
| 08/13/2002 | US6432200 Silver film incorporating protective insoluble metallic salt precipitate |
| 08/13/2002 | CA2033934C Method for treating polyetherimide substrates and articles obtained therefrom |
| 08/08/2002 | WO2002062117A1 Method for jointing electronic parts |
| 08/08/2002 | WO2002061173A2 Advanced composite ormosil coatings |
| 08/08/2002 | WO2002061172A1 Scanning deposition head for depositing particles on a wafer |
| 08/08/2002 | US20020106890 Method for multilevel copper interconnects for ultra large scale integration |
| 08/08/2002 | US20020106884 Method for multilevel copper interconnects for ultra large scale integration |
| 08/08/2002 | US20020106451 Process for producing aluminum oxide films at low temperatures |
| 08/07/2002 | CN2504277Y Special appts. for chemical cladding nickel |
| 08/07/2002 | CN1362536A Surface metallizing process of ceramic electronic device |
| 08/01/2002 | WO2002059911A1 Ceramic insulation coated electric wire, self-fusing ceremic insulation coated electric wire, coating composition, and coil and voice coil for speaker |
| 08/01/2002 | WO2002059209A1 Polyimide resin precursor solution, laminates for electronic components made by using the solution and process for production of the laminates |
| 08/01/2002 | WO2002058775A2 Device for dilating and irradiating a vascular segment or body passageway |
| 08/01/2002 | US20020100574 Production of hollow metal microcylinders from lipids |
| 08/01/2002 | US20020100424 Scanning deposition head for depositing particles on a wafer |
| 08/01/2002 | US20020100391 Electroless Ni-B plating liquid, electronic device and method for manufacturing the same |
| 08/01/2002 | DE10050862C2 Bad und Verfahren zum stromlosen Abscheiden von Silber auf Metalloberflächen Bath and method for electroless plating of silver onto metal surfaces |
| 07/31/2002 | EP1227173A1 Electroless plating method |
| 07/31/2002 | EP1226613A1 Method for applying flat outer electrodes to a piezoceramic multi-layer actuator |
| 07/31/2002 | EP0997061B1 Method for metallization of a substrate containing electric non-conductive surface areas |
| 07/31/2002 | CN1361312A Object electroplating method and system |
| 07/30/2002 | US6426114 Hydrolysis, roasting |
| 07/25/2002 | US20020098711 Electroless deposition of doped noble metals and noble metal alloys |
| 07/25/2002 | US20020098681 Reduced electromigration and stressed induced migration of Cu wires by surface coating |
| 07/25/2002 | US20020096433 Radiating with a pulse laser (pulse width < picosecond) to excite solely electrons on the substrate surface to generate a nonequilibrium state in either temperature or energy and deposit a thin film; metal plating; energy conservation |
| 07/25/2002 | DE10103618A1 Metallization of a substrate useful for e.g. producing electromagnetic radiation shield, involves sealing surface with size containing inorganic binder and reducing agent |
| 07/24/2002 | EP1224972A1 A method for recovering catalytic metals from a colloidal solution |
| 07/24/2002 | EP1028818A4 Deposition of substances on a surface |
| 07/24/2002 | CN1360643A Spectacle frame surface treatment method |
| 07/24/2002 | CN1360086A Stack structure of electronic apparatus and method for electroless plating of gold |
| 07/23/2002 | US6423202 Process for making gold salt for use in electroplating |
| 07/23/2002 | US6423200 Depositing a copper seed layer over dielectric layer and into etched features of dielectric layer having a barrier layer; treating copper seed layer to remove oxidized layer from over copper seed layer; electroplating copper fill layer |
| 07/18/2002 | WO2002056650A2 Forming a conducor circuit on a substrate |
| 07/18/2002 | WO2002004703A3 Electroless rhodium plating |