| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 05/19/2004 | CN1150349C Method of supersonic chemical plating nickel phosphorus of metallurgy material |
| 05/18/2004 | US6737173 Pretreating method before plating and composites having a plated coat |
| 05/18/2004 | US6737116 Method for fabricating plated products |
| 05/18/2004 | US6737104 Manufacturing method of anti-corrosive multi-layered structure material |
| 05/18/2004 | US6736997 Sol-gel solution in which up to 90% of said solution is a conductive powder such as metal, ceramic, interceramic and semiconductor in a uniform stable dispersion; resistance heaters |
| 05/18/2004 | US6736890 Coating material for forming titanium oxide film, method for forming titanium oxide film and use of said coating material |
| 05/18/2004 | US6736886 Electroless gold plating bath and method |
| 05/13/2004 | WO2004040044A1 Metal plating structure and method for production thereof |
| 05/13/2004 | WO2004040035A1 Method for forming thin silver mirror film, and method for forming coating film comprising thin silver mirror film |
| 05/13/2004 | WO2004040034A2 Method of preparing a solution and application of this solution to prepare functional oxide layers |
| 05/13/2004 | WO2004028999A3 Thin films of oxidic materials having a high dielectric constant |
| 05/13/2004 | US20040091625 Methods of filling a feature on a substrate with copper nanocrystals |
| 05/13/2004 | US20040090732 Plated terminations |
| 05/13/2004 | US20040089633 Pre-treatment of plastic materials |
| 05/12/2004 | EP1418619A1 Semiconductor device and production method therefor, and plating solution |
| 05/12/2004 | EP1418251A1 Plating method |
| 05/12/2004 | EP1418161A2 Method for the production of an aluminium nitride substrate |
| 05/12/2004 | EP1417706A2 Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing |
| 05/12/2004 | EP0792463B1 Mounting spring elements on semiconductor devices |
| 05/12/2004 | CN1495927A Composition for forming piezoelectrics, piezoelectric film making method, piezoelectric element and ink-jet recording head |
| 05/12/2004 | CN1495870A Composite intermediate connection element of microelectronic component and its making method |
| 05/12/2004 | CN1495868A Method for preparing porous silicon oxide film |
| 05/12/2004 | CN1495289A Method for forming metal oxide film and method for forming secondary electron emission film in gas discharging tube |
| 05/12/2004 | CN1495288A Plating method |
| 05/12/2004 | CN1495287A Plating method |
| 05/11/2004 | US6733837 Process for painting metal parts |
| 05/11/2004 | US6733823 Method for electroless gold plating of conductive traces on printed circuit boards |
| 05/11/2004 | US6733580 Titanium oxide film showing good properties in photoactivity, antibacterial, hydrophilic, pollution resistance, hazeproofness, gasdecomposition properties, deodorizing properties, water treatment properties, energy |
| 05/06/2004 | WO2004039138A1 Electromagnetic wave shielding light transmitting window material and process for producin the same |
| 05/06/2004 | WO2004038504A2 Nanometer-scale engineered structures, methods and apparatus for fabrication thereof, and applications to mask repair, enhancement, and fabrication |
| 05/06/2004 | WO2004038063A1 Substitution type electroless gold plating bath |
| 05/06/2004 | US20040087141 Post rinse to improve selective deposition of electroless cobalt on copper for ULSI application |
| 05/06/2004 | US20040087068 Method for forming thin-film, apparatus for forming thin-film, method for manufacturing semiconductor device, electro-optical unit, and electronic apparatus |
| 05/06/2004 | US20040086806 Applying photosensitive resin containing polysilane to substrate; exposing a region of photosensitive layer to a radiation and performing development to form channel portion that corresponds to metal pattern; contacting with liquid |
| 05/06/2004 | US20040086656 Formaldehyde-free |
| 05/06/2004 | US20040086648 Injecting a precursor solution comprising: an organometallic, an oxidant, a surfactant, a chelating agent and water into a structure; heating; exposing a portion of the structure to the heated precursor solution; depositing a metal oxide layer |
| 05/06/2004 | US20040086646 Method for electroless metal plating |
| 05/06/2004 | US20040084511 Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process |
| 05/06/2004 | US20040084143 Temperature-controlled substrate holder for processing in fluids |
| 05/06/2004 | US20040083850 Lightweight bearing and wave gear drive |
| 05/06/2004 | EP1416469A1 Chord winder for stringed instrument |
| 05/06/2004 | EP1416065A1 Plating method |
| 05/06/2004 | EP1415695A1 Method for separating amine borane complex from a plating solution |
| 05/06/2004 | EP1415019A2 Treatment for improved magnesium surface corrosion-resistance |
| 05/06/2004 | EP0987218B1 Process for the formation of oxide ceramic thin film |
| 05/05/2004 | CN1493711A Preparation method of carbon nano-pipe/silver complix functional material |
| 05/05/2004 | CN1493710A Preparation method of titanium dioxide bydrophilic film blended with ranadium |
| 05/05/2004 | CN1148469C Vulcanized elastic material product, article and its reinforcing structure |
| 05/04/2004 | US6730596 Method of and apparatus for forming interconnection |
| 05/04/2004 | US6730522 Method of forming solid of a ferroelectric or high dielectric material and method of manufacturing semiconductor device employing the same |
| 05/04/2004 | US6730370 Method and apparatus for processing materials by applying a controlled succession of thermal spikes or shockwaves through a growth medium |
| 05/04/2004 | CA2157487C Polymeric resin for depositing catalytic palladium on a substrate |
| 04/29/2004 | WO2004036964A2 Method for the manufacture of printed circuit boards with integral plated resistors |
| 04/29/2004 | WO2004035860A1 Metal resin composite and process for producing the same |
| 04/29/2004 | WO2004035496A2 Article having nano-scaled structures and a process for making such article |
| 04/29/2004 | US20040082489 Electroplating or electroless deposition of a metal or alloy from a solution containing free dithionic acid |
| 04/29/2004 | US20040082179 Method for forming metal coating and method for manufacturing chip electronic components |
| 04/29/2004 | US20040081762 Applying to substrate a photosensitive resin composition containing polysilane, photosensitive radical generator, oxidizing agent, alkoxy containing containing silicone compound, exposing to radiation, plating |
| 04/29/2004 | DE19941043B4 Bekeimungsbad und Verfahren zur Bekeimung von pulverförmigen Werkstoffen, Verfahren zur Metallisierung eines bekeimten pulverförmigen Werkstoffs und Verfahren zur Herstellung metallisch begrenzter Hohlkörper Bekeimungsbad and method for seeding of powdered materials, processes for metallizing a nucleated powdery material and process for producing metallic hollow bodies limited |
| 04/29/2004 | CA2503159A1 Metal resin composite and process for producing the same |
| 04/28/2004 | EP1413646A2 Process for electroless plating of metals |
| 04/28/2004 | CN1493070A Metal components for strnig instrument |
| 04/28/2004 | CN1492944A Method for plating polymer molding material, circuit forming component and method for producing circuit forming component |
| 04/28/2004 | CN1492943A Electroles copper plating of ferrous metal substrates |
| 04/28/2004 | CN1492494A Coating method for internal part with holes of vacuum processing device and internal part with holes coated by said method |
| 04/27/2004 | US6727579 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
| 04/27/2004 | US6726964 Immersing microparticulate in an autocatalytic plating bath comprising the metal; inducing an ultrasonic vibration in the plating bath at a frequency corresponding to a resonance frequency of the microparticulate |
| 04/22/2004 | WO2004034417A2 Enhanced field emission from carbon nanotubes mixed with particles |
| 04/22/2004 | WO2004033763A1 Cup type plating equipment |
| 04/22/2004 | WO2004033754A2 Pretreatment method for electroless plating material and method for producing member having plated coating |
| 04/22/2004 | WO2004032831A2 Metalization of microtubules |
| 04/22/2004 | US20040076842 Ceramic isulation coated electric wire self-fusing ceramic insulation coated electric wire coating composition and coil and voices coil for speaker |
| 04/22/2004 | US20040076743 Using a mask during activation step so as to selectively activate only selected portions of the surface, thus enabling smaller areas to be plated on the printed circuit board because no plating mask is used |
| 04/22/2004 | US20040076707 Honeycomb structural body forming ferrule, and method of manufacturing the ferrule |
| 04/22/2004 | US20040076051 Electro- and electroless plating of metal in the manufacturing of PCRAM devices |
| 04/22/2004 | US20040075075 Crystal structure with the c-axis oriented perpendicular to the surface |
| 04/22/2004 | US20040074373 Metal components for a stringed instrument |
| 04/21/2004 | EP1411147A1 Formaldehyde-free electroless copper plating process and solution for use in the process |
| 04/21/2004 | EP1411141A2 Thermal spray powder and process for producing the same as well as method for spraying the same |
| 04/21/2004 | EP1411031A1 Ceramic and method for preparation thereof, and dielectric capacitor, semiconductor and element |
| 04/21/2004 | EP1411028A1 Ceramics film and production method therefor, and ferroelectric capacitor, semiconductor device, other elements |
| 04/21/2004 | EP1410403A1 Low temperature method and compositions for producing electrical conductors |
| 04/21/2004 | EP1100638B1 Casting steel strip |
| 04/21/2004 | CN1491297A Method of electroless plating and apparatus for electroless plating |
| 04/21/2004 | CN1491149A Honeycomb structural body forming ferrule, and method of manufacturing ferrule |
| 04/20/2004 | US6723679 Process of forming catalyst nuclei on substrate, process of electroless-plating substrate, and modified zinc oxide film |
| 04/20/2004 | US6723388 Method of depositing nanostructured films with embedded nanopores |
| 04/20/2004 | US6723218 System for the electrodialytic regeneration of an electroless bath electrolyte |
| 04/20/2004 | US6723198 Servo pattern formation via transfer of sol-gel layer and magnetic media obtained thereby |
| 04/15/2004 | WO2004031447A1 Method of electroless plating |
| 04/15/2004 | WO2004031446A1 Electroless metal-plating baths |
| 04/15/2004 | WO2004031445A1 Protective ceramic coating |
| 04/15/2004 | WO2004031444A2 Method of fabricating a magnetic tag |
| 04/15/2004 | WO2004030830A1 Nanostructured and nanoporous film compositions, structures, and methods for making the same |
| 04/15/2004 | WO2004008825A3 Method and apparatus for real time monitoring of electroplating bath performance and early fault detection |
| 04/15/2004 | WO2003102267A8 Method for electroless metalisation of polymer substrate |
| 04/15/2004 | WO2003004725A3 Regeneration method for a plating solution |
| 04/15/2004 | WO2002099161A3 Method for the deposition of materials from mesomorphous films |
| 04/15/2004 | WO2002092878A3 Electroless plating method and device, and substrate processing method and apparatus |
| 04/15/2004 | US20040072494 Field emission type cold cathode device, manufacturing method thereof and vacuum micro device |