Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
05/2007
05/10/2007US20070102683 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
05/10/2007US20070102682 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
05/10/2007US20070102681 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
05/10/2007US20070102680 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
05/10/2007US20070102679 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
05/10/2007US20070102678 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
05/10/2007US20070102677 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
05/09/2007EP1783783A1 Conductive fine particle, method for producing conductive fine particle and electroless silver plating liquid
05/09/2007EP1783160A1 Plated resin molding
05/09/2007EP1781727A1 A method for hardening at a surface a component, devices having one or more hardened surfaces and devices for retaining and presenting for use a plurality of components
05/09/2007EP1310142B1 Improved adhesion of polymeric materials to metal surfaces
05/09/2007CN1961620A 金属沉积 Metal deposition
05/09/2007CN1960826A Copper-containing tin powder and method for producing the copper-containing tin powder, and electroconductive paste using the copper-containing tin powder
05/09/2007CN1958844A Method for etching non-conductive substrate surfaces
05/09/2007CN1315157C Preparation method of nano-gap electrode
05/09/2007CN1314835C Method for electroless nickel plating
05/08/2007US7215235 Conductive substrate with resistance layer, resistance board, and resistance circuit board
05/03/2007WO2007003813A3 Method for the rapid densification of a porous substrate, comprising the formation of a solid deposit within the porosity of the substrate
05/03/2007US20070099330 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
05/03/2007US20070099020 Metal foam
05/03/2007US20070096065 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
05/03/2007US20070096064 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
05/03/2007US20070096063 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
05/03/2007US20070096062 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
05/03/2007US20070095249 Electroless gold plating liquid
05/02/2007EP1780821A1 Cylindrical alkaline battery
05/02/2007EP1780306A2 Apparatus and method for electroless plating
05/02/2007EP1780305A2 Dielectric film and process for its fabrication
05/02/2007EP1778892A1 Method for producing highly textured, strip-shaped high-temperature superconductors
05/02/2007EP1778473A1 Electroless plating with nanometer particles
05/02/2007CN2895661Y Plastic-steel door-window section material
05/02/2007CN1957112A Anode for oxygen evolution
05/02/2007CN1957023A Particle with rough surface for plating or vapor deposition
05/02/2007CN1955339A Chemical copper coating process for surface of cylinder jacket
05/02/2007CN1313641C Method for chemical plating nickel phosphor alloy
05/01/2007US7211300 Passing a donor compound suspended in a carrier gas, the donor compound including the one or more elements for deposition over substrate so as to form a film of the donor compound on the substrate; irradiating with optical radiation
05/01/2007US7211298 Coating an aqueous adhesive of an emulsion resin having a glass transition temperature of -40 to 40 degrees C., aqueous coloring pigment dispersion, defoamer and pH modifier on a surface treated steel sheet
05/01/2007US7211292 Applying liquid metal carboxylate to substrate material and exposing the substrate material to an environment causing vaporization or dissipation of excess carboxylic acids, converting the metal carboxylates to metal oxides
05/01/2007CA2178724C Cracking processes
04/2007
04/26/2007WO2007047374A2 Electroless plating in microchannels
04/26/2007US20070092698 Conductive core materials form projections on the outer surface of a base particle, which is covered by a film of a different a conductive material; enhanced conduction reliability; low connection resistance
04/26/2007US20070092638 Method for the structured metal-coating of polymeric and ceramic support materials, and compound that can be activated and is used in said method
04/26/2007CA2625777A1 Electroless plating in microchannels
04/25/2007EP1777203A1 Ceramic film and method of manufacturing the same, ferroelectric capacitor, semiconductor device, and other element
04/25/2007EP1776489A1 Device and method for removing foreign matter from process solutions
04/25/2007CN1954096A Method for forming plated coating, electromagnetic shielding member, and housing
04/25/2007CN1952215A Process for preparing pretreatment layer and coating on magnesium and magnesium alloy surface
04/25/2007CN1952209A Copper and nickel preprocessing technology in ion implantation before polymer surface chemical plating
04/25/2007CN1312322C A method for providing a protective coating for carbonaceous components of an electrolysis cell
04/24/2007US7208324 Liquid composition for forming ferroelectric thin film and process for producing ferroelectric thin film
04/24/2007US7208203 Method for forming metal oxide film and method for forming secondary electron emission film in gas discharge tube
04/24/2007US7208052 Method for carburizing steel components
04/19/2007WO2007043839A1 Method for preparing electroconductive particles with improved dispersion and adherence
04/19/2007WO2007043380A1 Catalyst treatment method, electroless plating method, and method for formation of circuit by using the electroless plating method
04/19/2007WO2007043337A1 Pd/Sn COLLOID CATALYST ADSORPTION ENHANCER
04/19/2007WO2007043333A1 Electroless nickel plating solution
04/19/2007WO2007042392A1 Dry composition, use of its layer system and coating process
04/19/2007WO2006135752A3 Cobalt electroless plating in microelectronic devices
04/19/2007WO2006123834A3 Graft pattern forming method and conductive pattern forming method
04/19/2007US20070087215 Use of an article as electronic structural part
04/19/2007US20070085162 Capping of copper structures in hydrophobic ild using aqueous electro-less bath
04/19/2007DE102005050075A1 Precious metal coating on metal oxide layers, is formed by cathodic contacting to enable electrochemical reduction in an aqueous acidic solution
04/18/2007EP1774840A2 Jet printing of patterned metal
04/18/2007EP1773951A2 Wood preservative composition
04/18/2007EP1436435A4 Method of anodizing of magnesium and magnesium alloys and producing conductive layers on an anodized surface
04/18/2007CN1949546A Method for preparing p type copper sulfide transparent conducting film
04/18/2007CN1948552A Cleanout method of metal deposited on surface of chemical plating equipment
04/18/2007CN1311719C Printed wiring board and production method thereof
04/17/2007US7205233 Method for forming CoWRe alloys by electroless deposition
04/17/2007US7205096 Method for forming metal pattern by using metal nanocrystals
04/17/2007US7205056 First crystal layer having a Bi-based perovskite structure is intermittently formed in a surface direction of the ceramic film, and second crystal layer having a lower melting point composed of ABO-type oxides in which Bi is in an A-site and Si or Ge is in a B-site is between the first crystals
04/17/2007US7204918 High efficiency plating apparatus and method
04/12/2007WO2007039323A1 Plastic objects for metallizing having improved shaping properties
04/12/2007US20070082803 Coating ferroelectric particles with a layer of a dielectric precurser and a solvent under supercritical temperature and pressure conditions; sintering the coated particles
04/12/2007US20070079727 Electroless copper plating solution, electroless copper plating process and production process of circuit board
04/12/2007DE102006007397B3 Forming localized coating layer on shaped article, e.g. conductive strip on biosensor or bioreactor, by forming catalytically active nuclei on deformable film, shaping to give the article and electroplating
04/12/2007DE102005048161A1 Preparing metal-plated, extruded plastic, useful as e.g. decorative particle, comprises melt blending and extrusion of plastic mixture and contacting mixture with acid, neutral or basic metal salt solution by electrolessly/glavanically
04/11/2007EP1772529A1 Dry chemical composition, use thereof to form a layer system and method for coating
04/11/2007EP1772212A1 Copper-containing tin powder and method for producing the copper-containing tin powder, and electroconductive paste using the copper-containing tin powder
04/11/2007CN1946880A Selective catalytic activation of non-conductive substrates
04/11/2007CN1946875A Method for selective coating of a composite surface production of microelectronic interconnections using said method and integrated circuits
04/11/2007CN1946486A Substrate processing unit and substrate processing apparatus
04/11/2007CN1944710A Nano mirror spray coating
04/11/2007CN1944709A Method for depositing continuous metal layer on capillary tube inner wall
04/11/2007CN1944708A Method for hydrothermally synthesizing series flower shape zinc oxide micron/nano structure
04/11/2007CN1309879C Vessel for holding silicon and method of producing the same
04/11/2007CN1309865C Treatment for improved magnesium surface corrosion-resistance
04/11/2007CN1309863C Method for forming metal oxide film and method for forming secondary electron emission film in gas discharging tube
04/11/2007CN1309862C Nonelectrolytic gold plating liquid and method thereof
04/10/2007US7202677 Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component
04/10/2007US7200930 Probe for semiconductor devices
04/05/2007WO2007037773A2 Thermal barrier coating with stabilized compliant microstructure
04/05/2007WO2007037176A1 Electroless palladium plating bath and electroless palladium plating method
04/05/2007WO2006133288A3 Dispersed metal nanoparticles in polymer films
04/05/2007WO2005085496A3 Ferroelectric thin film composites with improved top contact adhesion and devices containing the same
04/05/2007US20070077742 Composition for forming silicon-cobalt film, silicon-cobalt film and method forming same
04/05/2007US20070075715 Contact Carriers (Tiles) For Populating Larger Substrates With Spring Contacts
04/04/2007EP1770720A1 Nickel compound containing solution, method for production thereof, and method for forming thin nickel metal film using the same
04/04/2007EP1552415A4 Method and apparatus for real time monitoring of electroplating bath performance and early fault detection
04/04/2007EP1540046A4 Method and apparatus for real time monitoring of industrial electrolytes
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