C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating

Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
12/2007
12/21/2007	WO2007145630A1 Glass flux assisted sintering of chemical solution deposited thin dielectric films
12/21/2007	WO2007145175A1 Material for contact component or battery component, and battery using the same
12/21/2007	WO2007144026A1 Electroless nip adhesion and/or capping layer for copper interconnexion layer
12/21/2007	WO2007116057A3 Method for applying a metal on a substrate
12/21/2007	WO2007021527A3 Microfabrication using replciated patterned topography and self-assembled monolayers
12/20/2007	US20070292710 Method for repairing components using environmental bond coatings and resultant repaired components
12/20/2007	US20070289490 Material Composition For Producing A Coating For A Component Made From A Metallic Base Material, And Coated Metallic Component
12/20/2007	US20070289479 Nickel Compound-Containing Solution, Method of Producing the Same, and Method of Forming Nickel Metal Thin Film Using the Same
12/19/2007	EP1867752A1 Method for reducing transition metal, and method for treating surface of silicon-containing polymer, method for preparing fine transition metal particles and method for producing article and wiring board, using the reducing method
12/19/2007	EP1866462A2 Surface processing electrode
12/19/2007	EP1866454A1 Treatment of flexible web material
12/19/2007	EP1866103A1 A method for producing an aldehyde containing coating
12/19/2007	EP1763594B1 Method for improving solderability of nickel coatings
12/19/2007	CN200993021Y Mining single hydraulic prop
12/19/2007	CN101089225A Chemical nickeling ageing liquid recovering and process technology
12/19/2007	CN101089224A Chemical coppering circulation process technology
12/19/2007	CN100356547C Manufacturable cowp metal cap process for copper interconnects
12/19/2007	CN100355939C Method for cladding honeycomb metal cobalt or cobalt alloy on nickel or nickel alloy powder surface
12/19/2007	CN100355938C Laser induced selective chemical plating process for polyimide film
12/19/2007	CN100355653C Silane polymer and method for forming silicon film
12/18/2007	CA2378993C Acousto-immersion coating and process for magnesium and its alloys
12/13/2007	WO2007021332A3 Composite electroless plating
12/13/2007	US20070285114 Socket For Making With Electronic Component, Particularly Semiconductor Device With Spring Packaging, For Fixturing, Testing, Burning-In Or Operating Such A Component
12/12/2007	EP1575715B1 Arrangement for treating the inner surface of a metal tube
12/12/2007	CN101087901A Aqueous/organic metal oxide dispersion and coated substrates and mouldings produced therewith
12/12/2007	CN100355021C 衬底处理设备和衬底处理方法 The substrate processing apparatus and a substrate processing method
12/11/2007	US7306962 Electroformed metallization
12/11/2007	US7306662 Aqueous copper salt and cobalt salt; triamine complexing agent (diethylenetriamine, dipropylenetriamine, or aminoethyl-propylenediamine); sulfuric, nitric, hydrochloric, fluoroboric, or acetic acid pH modifier; can be maintained in an acidic pH environment
12/11/2007	US7305761 Method for manufacturing wiring substrate
12/06/2007	WO2007138795A1 Catalytic agent for electroless plating
12/06/2007	WO2007138323A1 A method for hardening at a surface a component, devices having one or more hardened surfaces and devices for retaining and presenting for use a plurality of components
12/06/2007	WO2006039380A8 Silver microribbon composition and method of production
12/06/2007	US20070281498 Spin-on glass composition and method of forming silicon oxide layer in semiconductor manufacturing process using the same
12/06/2007	US20070277373 Formation method of metal layer on resin layer, printed wiring board, and producution method thereof
12/05/2007	EP1861916A2 Mettalic dispersion and formation of compound film for photovoltaic device active layer
12/05/2007	EP1430163B1 Precious metal recovery
12/05/2007	CN101082127A Stainless steel surface treatment technique for stainless steel chemical boat
12/05/2007	CN101082126A Local chemical-plating technique for aluminum radiator bores
12/05/2007	CN100353496C High-level silane composition and silicon film forming method utilizing it
12/04/2007	US7303939 Electro- and electroless plating of metal in the manufacture of PCRAM devices
12/04/2007	US7303828 Ferroelectric film, method of manufacturing the same, ferroelectric memory and piezoelectric device
11/2007
11/29/2007	WO2007135869A1 Process for the formation of hard coat and process for the production of gravure printing roll
11/29/2007	WO2007135110A1 Method for production of a catalytic material and catalytic device
11/29/2007	WO2007116056A3 Method for applying a metal on paper
11/29/2007	WO2007057166A3 Method for producing a ceramic-coated metal support substrate
11/28/2007	EP1860211A2 Food-processing component and method of coating thereof
11/28/2007	EP1860076A1 Mirror
11/28/2007	EP1859074A1 Metal film and formation method of metal film
11/28/2007	EP1275273A4 Electrical device having ptc conductive polymer
11/28/2007	CN101080512A Stabilization amd performance of autocatalytic electroless processes.
11/28/2007	CN101078111A Chemical copper plating solution and technique thereof
11/28/2007	CN100351429C Powder body material surface treatment method and device
11/28/2007	CN100351428C Chemical tin solution for flexible printed circuit board
11/27/2007	US7300673 exposing substrates to metal ions, then to basic environments to form thin films comprising antimicrobially active oxidized silver; medical equipment
11/27/2007	US7300501 Electroless gold plating liquid
11/25/2007	CA2589840A1 Food-processing component and method of coating thereof
11/22/2007	WO2007134182A1 Plating solution for electroless deposition of copper
11/22/2007	WO2007132529A1 Metal composite film and process for producing the same
11/22/2007	WO2007046560B1 Inorganic substrate with a thin silica type glass layer, method of manufacturing the aforementioned substrate, coating agent, and a semiconductor device
11/22/2007	US20070269680 Electroless Plating Pretreatment Agent and Copper-Clad Laminate for Flexible Substrate
11/22/2007	US20070269603 Conductive Fine Particle, Method for Producing Conductive Fine Particle and Electroless Silver Plating Liquid
11/22/2007	US20070269588 Method for forming stacked via-holes in printed circuit boards
11/22/2007	US20070267298 Selective catalytic activation of non-conductive substrates
11/22/2007	US20070266886 Printed wiring board and its manufacturing method
11/22/2007	DE102006022601A1 Verfahren zum Herstellen eines Körpers A method for manufacturing a body
11/21/2007	EP1857570A2 Method for forming a nickel-based layered structure on a magnesium alloy substrate, a surface-treated magnesium alloy article made thereform, and a cleaning solution and a surface treatment solution used therefor
11/21/2007	EP1856309A2 Selective catalytic activation of non-conductive substrates
11/21/2007	CN200977499Y Surface processing device for printing circuit board
11/21/2007	CN101074479A Method for treating magnesium-alloy workpiece, workpiece therefrom and composition therewith
11/21/2007	CN100350073C Cu/Si nanometer porous array composite material preparation method
11/20/2007	US7297210 Plating apparatus
11/20/2007	US7297190 Plating solutions for electroless deposition of copper
11/15/2007	WO2007128702A1 Nickel layer containing noble metal
11/15/2007	WO2006114781A3 Deposition of materials
11/15/2007	US20070264490 Plating Target Material, Polyamic Solution And Polyimide Resin Solution Which Are Used To Form The Plating Target Material, And Printed-Wiring Board Using THem
11/15/2007	US20070261595 Active Filler particles in Inks
11/15/2007	US20070261594 Plating solution for electroless deposition of copper
11/14/2007	EP1854909A2 Coating structure and method for forming the same
11/14/2007	EP1853749A2 Method for preparing a sol-gel solution and use thereof to form a metal substrate protective coating
11/14/2007	CN200974866Y Silver spraying apparatus
11/14/2007	CN101072896A Method for forming anti-reflective coating
11/14/2007	CN101071687A Silver-nanotin oxide electric contact material and its preparing process
11/14/2007	CN101070671A Metal-coated polymer fiber and preparing method
11/14/2007	CN101070461A Super-high heat-conductive diamond-copper composite package material and production method
11/14/2007	CN101069847A Mesoporous-structure metal nickel catalyst and its preparing method and use
11/14/2007	CN100348778C Chemical copper plating process for the surface of SiC ceramic grain
11/14/2007	CN100348775C Method of electroless plating and semiconductor wafer having metal plating layer formed thereon
11/14/2007	CN100348401C Forming part, injection moulding method and device
11/13/2007	US7293571 Substrate proximity processing housing and insert for generating a fluid meniscus
11/08/2007	WO2007109784A3 Surface treatments for spiral bevel gear sets
11/08/2007	US20070256940 Device and Method for Removing Foreign Matter from Process Solutions
11/08/2007	US20070256923 Device and method for electrolytically treating work pieces
11/08/2007	DE102006020988A1 Edelmetallhaltige Nickelschicht Precious-metal nickel layer
11/08/2007	DE10134473B4 Verfahren zur Beschichtung passivierter metallischer Oberflächen aus Chrom von Bauteilen sowie derart beschichtetes Bauteil und Verwendung des Verfahrens A method for coating passivated metallic surfaces of components made of chrome and such coated component and using the method
11/07/2007	EP1851360A2 Pressurized reactor for thin film deposition
11/07/2007	EP1851359A2 Composite material consisting of a porous matrix and metal or metal oxide nanoparticles
11/07/2007	CN101067206A ABS plastic surface non-palladium activating treatment new technology
11/07/2007	CN101067205A Computer hard disk aluminium base material parts chemical nickeling technology
11/07/2007	CN101067201A Method for promoting preprocessing of copper-clad zirconium tungstate composite powder
11/07/2007	CN101067200A Method for producing magnesium-lithium alloy titanium anticorrosion coating

1 ... 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 ... 163