| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 08/10/2004 | US6773760 Method for metallizing surfaces of substrates |
| 08/10/2004 | US6773757 Silver plate has a lower tendency to electromigrate than the same silver plate without the treatment with polymer coating |
| 08/05/2004 | WO2004065659A1 Composition for forming silicon·aluminum film, silicon·aluminum film and method for forming the same |
| 08/05/2004 | WO2004053455A3 Plating bath composition control |
| 08/05/2004 | US20040152348 Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component |
| 08/05/2004 | US20040152303 Copper bath composition for electroless and/or electrolytic filling of vias and trenches for integrated circuit fabrication |
| 08/04/2004 | EP1443063A1 New polymers and objects, mouldings or the like prepared therefrom, their preparation process and process for the preparation of metallized objects or the like therefrom |
| 08/04/2004 | EP1442860A1 Honeycomb structural body forming ferrule and method of manufacturing the ferrule |
| 08/04/2004 | EP1441864A1 Method for forming thin-film conductors through the decomposition of metal-chelates in association with metal particles |
| 08/04/2004 | EP1064656B1 Thick complex porous structures made electrically conductive, and corresponding method for conductive activation |
| 08/04/2004 | CN1518850A Conductor track structures and method for production thereof |
| 08/04/2004 | CN1518490A Cutting tool with electroless nickel coating |
| 08/04/2004 | CN1518074A Low temperature liquid-phase deposition method and cleaning method of liquid phase deposition equipment |
| 08/04/2004 | CN1160767C Vapor deposition routes to nanoporous silica |
| 08/03/2004 | US6770726 β-substituted organosilsesquioxane polymers |
| 08/03/2004 | US6770369 Conductive electrolessly plated powder, its producing method, and conductive material containing the plated powder |
| 08/03/2004 | US6770122 Heating, decomposition copper formate-organonitrogen complex |
| 08/03/2004 | CA2327810C Material for electronic components, method of connecting material for electronic components, ball grid array type electronic components and method of connecting ball grid array type electronic components |
| 07/29/2004 | WO2004063423A1 Autocatalytic nickel-boron coating process for diamond particles |
| 07/29/2004 | US20040146647 Overcoating a substrate with catalyst; transferring pattern; ink jet printing; metal plating |
| 07/29/2004 | US20040144657 Electrochemistry; immersion into bath |
| 07/29/2004 | US20040144654 Recording, detection; carbide is heat sensitive element |
| 07/29/2004 | US20040144285 Process and electrolytes for deposition of metal layers |
| 07/29/2004 | US20040144023 Multilayer interference pigments |
| 07/29/2004 | DE10301135A1 To coat a workpiece with a wear-resistant layer, without current or an electrolyte, the metal contains a proportion of non-metallic particles with the required hardness and low-friction non-stick characteristics |
| 07/28/2004 | EP1441232A2 Method for connecting electronic components |
| 07/28/2004 | EP1441047A1 Method for forming electroplated coating on surface of article |
| 07/28/2004 | EP1441045A2 Process for activating a plastic substrate to be electroplated |
| 07/28/2004 | EP1441044A1 IRON CORE EXHIBITING EXCELLENT INSULATING PROPERTY AT END FACE, AND METHOD FOR COATING END FACE OF IRON CORE |
| 07/28/2004 | EP1440185A1 Platable engineered polyolefin alloys |
| 07/28/2004 | EP1440181A2 High resolution patterning method |
| 07/27/2004 | US6767445 Method for the manufacture of printed circuit boards with integral plated resistors |
| 07/27/2004 | US6767392 Adhesion properties and high solderability |
| 07/27/2004 | US6766811 Method of removing smear from via holes |
| 07/22/2004 | WO2004061162A1 Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor |
| 07/22/2004 | WO2004061157A1 Photosensitive dispersion with adjustable viscosity for metal deposition on an insulating substrate and use of same |
| 07/22/2004 | WO2004061156A1 Method for electroless plating |
| 07/22/2004 | WO2004035496A3 Article having nano-scaled structures and a process for making such article |
| 07/22/2004 | WO2003094226A3 Contacting of nanotubes |
| 07/22/2004 | US20040142114 Electroless plating solution and process |
| 07/21/2004 | EP1439397A2 Method of performing a burn-in |
| 07/21/2004 | EP1439244A2 Method for plating and plating solution thereof |
| 07/21/2004 | EP1439243A1 Method of non-chromate pretreatment for metal alloys |
| 07/21/2004 | EP1438271A2 Coating precursor and method for coating a substrate with a refractory layer |
| 07/21/2004 | EP1113987B1 Process for preparing silica or silica-based thick vitreous films according to the sol-gel technique and thick films thereby obtained |
| 07/21/2004 | CN1514889A Copper plating solution and method for copper plating |
| 07/21/2004 | CN1158406C Process for preparing light metallic microspheres with natural pollen as core skeleton |
| 07/20/2004 | US6764626 Piece having a portion of its visible surface galvanized, wherein the non-galvanized portion of its visible surface is covered in a film of non-galvanizable material that adheres strongly to the galvanized material |
| 07/20/2004 | US6764585 Electronic device manufacturing method |
| 07/20/2004 | US6764537 Copper metal precursor |
| 07/15/2004 | WO2004059722A1 Semiconductor sensor and plating method for semiconductor device |
| 07/15/2004 | WO2004058863A2 Surface treatment of polyacetal articles |
| 07/15/2004 | WO2004033754A3 Pretreatment method for electroless plating material and method for producing member having plated coating |
| 07/15/2004 | US20040137229 Autocatalytic nickel-boron coating process for diamond particles |
| 07/15/2004 | US20040137162 Copper plating solution and method for copper plating |
| 07/15/2004 | US20040137161 Device and method for electroless plating |
| 07/15/2004 | US20040134682 Printed wiring board and its manufacturing method |
| 07/15/2004 | US20040134375 Solution composition and method for electroless deposition of coatings free of alkali metals |
| 07/14/2004 | EP1436445A1 Process for making thin film porous ceramic-metal composites and composites obtained by this process |
| 07/14/2004 | EP1436435A2 Method of anodizing of magnesium and magnesium alloys and producing conductive layers on an anodized surface |
| 07/14/2004 | EP1436240A2 Coating precursor and method for coating a substrate with a refractory layer |
| 07/14/2004 | CN1512181A Biological analogue material with surface nano array and its preparing method |
| 07/14/2004 | CN1157500C Method for applying coating to metal substrate or repairing applied to same |
| 07/14/2004 | CN1157497C Self-catalytic plating Ni-Sn-P alloy solution and its plated layer |
| 07/13/2004 | US6761985 Conductivity, stability, and extended transmissivity into the infrared; film may be used as an optical coating for infrared sensors, actuators, light emitting diodes, transistors, solar cells, and flat panel displays |
| 07/13/2004 | US6761932 Applying a zirconium alkoxide and phosphoric acid or a phosphoric acid ester to metal before the primer; automotive refinishing |
| 07/13/2004 | US6761929 Gas pressure on one side of porous substrate controls penetration depth of the deposited metal (palladium, silver, platinum, copper, gold, nickel) from electroless plating bath; hydrogen purification; permselectivity |
| 07/08/2004 | WO2004057055A1 Plating of multi-layer structures |
| 07/08/2004 | WO2004057054A1 Electroless nickel plating bath for forming anisotropically grown bump, method for forming anisotropically grown bump, article having anisotropically grown bump formed thereon and anisotropic growth accelerator for electroless nickel plating bath |
| 07/08/2004 | WO2004020682A3 Improvements to oxide films |
| 07/08/2004 | US20040132300 Procedure for activation of substrates for plastic galvanizing |
| 07/08/2004 | US20040131792 Electroless deposition of cu-in-ga-se film |
| 07/08/2004 | US20040131766 Substrate processing method and apparatus |
| 07/08/2004 | US20040129918 employs as stabilizer, at least one of 1,8-diazabicyclo[5.4.0]-7-undecene, 1,5-diazabicyclo[4.3.0]non-5-ene, and 1,4-diazabicyclo[2.2.2]octane; stabilizes metal alkoxide and/or a metal salt by an electron donation; shows little surface unevenness |
| 07/08/2004 | US20040129917 leak current is sharply reduced when the halogen content is 10 ppm or less, preferably 3 ppm or less |
| 07/08/2004 | US20040129677 Surface treatment of polyacetal articles |
| 07/08/2004 | US20040129575 rotating substrate holding member to remove plating liquid; and sucking liquid remaining on the substrate-contacting portion or in its vicinity, while the holding member is rotated |
| 07/07/2004 | EP1435402A1 Powder coated with titania film and method for production thereof |
| 07/07/2004 | EP1434899A2 Photolytic conversion process to form patterned amorphous film |
| 07/07/2004 | CN1510773A Bipolar laminated unit electrochemical battery |
| 07/07/2004 | CN1156607C Surface metallizing process of ceramic electronic device |
| 07/07/2004 | CN1156606C Acid chemical plating liquid of nickel-base multicomponent alloy resisting corrosin of sea water |
| 07/07/2004 | CN1156605C Method of making light type composite hollow metal microball |
| 07/06/2004 | US6759751 Constructions comprising solder bumps |
| 07/06/2004 | US6759087 Solution for sealing porous metal substrates and process of applying the solution |
| 07/01/2004 | WO2004055246A1 Copper electrolytic solution and electrolytic copper foil produced therewith |
| 07/01/2004 | WO2004055110A1 Thermoplastic polyimide resin film, multilayer body and method for manufacturing printed wiring board composed of same |
| 07/01/2004 | WO2004036964A3 Method for the manufacture of printed circuit boards with integral plated resistors |
| 07/01/2004 | WO2003002784A3 Electrolysis cell for restoring the concentration of metal ions in electroplating processes |
| 07/01/2004 | US20040127025 Processes for fabricating conductive patterns using nanolithography as a patterning tool |
| 07/01/2004 | US20040126548 ULSI wiring and method of manufacturing the same |
| 07/01/2004 | US20040126502 spraying a powder including AlN grains covered with a layer of an oxide precursor onto a support at a high temperature and at a high speed, yielding an oxide forming a liquid phase around the AlN grains during spraying |
| 07/01/2004 | DE10259187A1 Verfahren zur Aktivierung von Substraten für die Kunststoffgalvanisierung A process for the activation of substrates for plating on plastics |
| 06/30/2004 | EP1432845A2 Method for the deposition of materials from mesomorphous films |
| 06/30/2004 | CN1509344A Surface coating of black platinum |
| 06/30/2004 | CN1508287A Method for activating substrate for plating on plastic |
| 06/30/2004 | CN1508286A Metal film formation method, semiconductor device and wiring substrate board |
| 06/30/2004 | CN1508285A Metal-film formation processing method, semiconductor device and wiring substrate board |
| 06/24/2004 | WO2004054019A1 Method for forming reaction layer on electrolyte membrane of fuel cell and electrolyte membrane |
| 06/24/2004 | WO2004053455A2 Plating bath composition control |