| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 06/24/2004 | WO2004053207A1 Vessel for holding silicon and method of producing the same |
| 06/24/2004 | WO2004053202A1 Methods for forming copper interconnect structures by co-plating of noble metals and structures formed thereby |
| 06/24/2004 | WO2004053191A1 Copper activator solution and method for semiconductor seed layer enhancement |
| 06/24/2004 | WO2004053182A2 Nodular nickel boron coating |
| 06/24/2004 | WO2004009869A3 Corrosion-inhibiting coating for metal surfaces |
| 06/24/2004 | WO2003033764A3 Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions |
| 06/24/2004 | US20040121595 Method of forming a metal film, semiconductor device and wiring board |
| 06/24/2004 | US20040118693 rotation of parallel wafers with laminar motion at constant speed; eliminates photolithographic definition steps |
| 06/24/2004 | US20040118690 successive conditioning, Pd activation, electroless copper plating, and electrolytic copper plating treatments; irradiation with ultraviolet light in the presence of treatment solution; resin is activated to improve copper adhesion |
| 06/24/2004 | US20040118332 Method of producing a crystalline ITO dispersed solution |
| 06/24/2004 | US20040118317 From gold-sulfite complex using cytosine as decomposition inhibitor; dipping |
| 06/24/2004 | CA2507389A1 Vessel for holding silicon and method of producing the same |
| 06/23/2004 | EP1432293A1 Printed wiring board and production method for printed wiring board |
| 06/23/2004 | EP1431415A1 Method for producing metal plated plastic article |
| 06/23/2004 | EP1430163A2 Precious metal recovery |
| 06/23/2004 | EP1297198B1 Electroless platinum-rhodium alloy plating |
| 06/23/2004 | CN1506494A Non-electrolytic goldplating liquid |
| 06/23/2004 | CN1506493A Chemical copper and nickel plating technique |
| 06/23/2004 | CN1155304C Adhesive for electroless plating, and printed wiring board |
| 06/22/2004 | US6753034 Preremoval of stabilizer; electroless deposition of metal |
| 06/17/2004 | WO2004042742A3 Hydrothermal deposition of thin and adherent metal oxide coatings for high temperature corrosion protection |
| 06/17/2004 | WO2004028999B1 Thin films of oxidic materials having a high dielectric constant |
| 06/17/2004 | US20040116286 Method for preparing highly loaded, highly dispersed platinum metal on a carbon substrate |
| 06/17/2004 | US20040115470 Thermal barrier coating protected by infiltrated alumina and method for preparing same |
| 06/17/2004 | US20040115462 Article including a substrate with a metallic coating and a protective coating thereon, and its preparation and use in component restoration |
| 06/17/2004 | US20040115361 Method for depositing a film on a substrate |
| 06/17/2004 | US20040115353 Pretreating using ozone solution; then contacting with anionic surfactant, nonionic surfactant and base; activating surface treatment; applying catalyst |
| 06/17/2004 | US20040112756 Using copper perfluoro(imidosulfonyl or sulfonyl) compound |
| 06/17/2004 | US20040112634 Method for plating polymer molding material, circuit forming component and method for producing circuit forming component |
| 06/17/2004 | US20040111947 Nodular nickel boron coating |
| 06/16/2004 | EP1428903A2 Article including a substrate with a metallic coating and a protective coating thereon, and its preparation and use in component restoration |
| 06/16/2004 | EP1428902A1 Thermal barrier coating protected by infiltrated alumina and method for preparing same |
| 06/16/2004 | EP1428250A1 Chemical surface deposition of ultra-thin semiconductors |
| 06/16/2004 | EP1427869A2 Regeneration method for a plating solution |
| 06/16/2004 | CN1504592A Paste for electroless plating and method of producing metallic structured body, micrometallic component, and conductor circuit using the paste |
| 06/16/2004 | CN1153845C Composition and making process of electrothermal semiconductor film |
| 06/16/2004 | CN1153638C Powder coated with multilayer film and process for preparing the same |
| 06/15/2004 | US6750475 Method for fabricating electric interconnections and interconnection substrate having electric interconnections fabricated by the same method |
| 06/15/2004 | US6750143 Method for forming a plating film, and device for forming the same |
| 06/15/2004 | US6749945 Advanced composite ormosil coatings |
| 06/15/2004 | US6749798 High density ceramic thick film fabrication method by screen printing |
| 06/15/2004 | US6749307 Which is not covered with a protective layer of copper; automobile rear view mirror; tin and palladium at surface of glass sheet, paint layer covering the silver coating |
| 06/10/2004 | WO2003084628A3 Process for preparing palladium alloy composite membranes for use in hydrogen separation, palladium alloy composite membranes and products incorporating or made from the membranes |
| 06/10/2004 | US20040110374 Precursor for solution that activates surface to facilitate electroless plating of copper including water, chloride ions, copper, tin/ii/ and nickel ions for formation of activator layer, antioxidant compound which prevents oxidation of tin |
| 06/10/2004 | US20040108221 Oxygen-removing pre-process for copper interconnect grown by electrochemical displacement deposition |
| 06/10/2004 | US20040108217 Forming aperture in dielectric overcoating substrate; forming barrier; plating with copper alloy |
| 06/10/2004 | US20040108213 Plating bath composition control |
| 06/10/2004 | US20040108212 Apparatus and methods for transferring heat during chemical processing of microelectronic workpieces |
| 06/09/2004 | EP1426465A1 Plated resin molding and process for producing the same |
| 06/09/2004 | EP1426464A1 Method for producing metal/ceramic bonding substrate |
| 06/09/2004 | EP1425111A1 Process for plating particulate matter |
| 06/09/2004 | CN1502720A Methyl free copper plating method and used solution thereof |
| 06/09/2004 | CN1502719A Growth technology for nano composite aluminium oxidation film with high specific inductive constant |
| 06/08/2004 | US6747351 Semiconductor device and method of manufacturing of the same |
| 06/08/2004 | US6746539 Scanning deposition head for depositing particles on a wafer |
| 06/03/2004 | WO2004047162A1 Method for low temperature growth of inorganic materials from solution using catalyzed growth and re-growth |
| 06/03/2004 | WO2004046419A1 Method of combining metal with surface of molded cycloolefin resin and metal-combined molded cycloolefin resin |
| 06/03/2004 | WO2004046418A1 Substrate processing apparatus and method for processing substrate |
| 06/03/2004 | WO2004046410A2 Method of electroless deposition of thin metal and dielectric films with temperature controlled on stages of film growth |
| 06/03/2004 | US20040103960 Method for the patterned, selective metallization of a surface of a substrate |
| 06/03/2004 | US20040103813 catalytic nickel powder is coated palladium; disperse tin coated nickel powder in palladium chloride solution; forming metallic film on substrate with catalytic paste as underlayer; conductor circuits; reduce the cost catalytic metal |
| 06/03/2004 | DE10251902A1 Verfahren zum Beschichten eines Substrats und beschichteter Gegenstand A method for coating a substrate and coated article |
| 06/02/2004 | CN1501987A Method of pretreatment of material to be electrolessly plated |
| 06/02/2004 | CN1501527A Bipolar electrochemical battery of stacked wafer cells |
| 06/02/2004 | CN1500910A Chemical nickel-plating method on magnesium alloy surface |
| 06/01/2004 | US6743479 Electroless copper plating solution and high-frequency electronic component |
| 06/01/2004 | US6743477 On synthetic resin substrates |
| 06/01/2004 | US6743475 Process for producing aluminum oxide films at low temperatures |
| 06/01/2004 | US6743345 Coating with layer of polymer matrix doped with photoreducer material dielectric particles, irradiating the surface to be metallized with laser, and immersing the irradiated part in an autocatalytic bath containing metal ions |
| 05/27/2004 | WO2004044272A1 Measurement of the concentration of a reducing agent in an electroless plating bath |
| 05/27/2004 | WO2004044072A1 Composition for porous film formation, porous film, process for producing the same, interlayer insulation film and semiconductor device |
| 05/27/2004 | WO2004043853A1 Dispersoid having metal-oxygen bond, metal oxide film, and monomolecular film |
| 05/27/2004 | WO2004043620A1 Arrangement for treating the inner surface of a metal tube |
| 05/27/2004 | WO2004015167A3 Mesostructured film, porous film and the method of preparing the same |
| 05/27/2004 | US20040101665 Direct patterning method |
| 05/27/2004 | DE10253180A1 Process for metallizing plastics used in the production of sanitary products, e.g. shower heads, comprises using a plastic and particles located together within a moving container |
| 05/26/2004 | EP1422773A1 Metal coated active material particles for battery electrodes |
| 05/26/2004 | EP1422318A1 Container for chemical metallisation |
| 05/26/2004 | EP1420891A1 Electroless nickel plating solution and process for its use |
| 05/26/2004 | CN1500157A Method for forming electroplated coating on surface of article |
| 05/26/2004 | CN1499992A Process for degassing queous plating solution |
| 05/26/2004 | CN1151009C Fabricating interconnects and tips using sacrificial substrates |
| 05/25/2004 | US6741085 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 05/25/2004 | US6740425 Electroless deposition using catalyst |
| 05/25/2004 | CA2303549C Method for producing a metal oxide and method for forming a minute pattern |
| 05/21/2004 | WO2004042742A2 Hydrothermal deposition of thin and adherent metal oxide coatings for high temperature corrosion protection |
| 05/21/2004 | WO2004042113A1 Substrate coating method |
| 05/21/2004 | WO2002099164A3 Electroless-plating solution and semiconductor device |
| 05/20/2004 | US20040097071 Method of electoless deposition of thin metal and dielectric films with temperature controlled on stages of film growth |
| 05/20/2004 | US20040096592 Mixture of cobalt compound, complexing agent and reducing agent |
| 05/20/2004 | US20040096584 Process for metallizing a plastic surface |
| 05/20/2004 | US20040094424 Graphite metal coating |
| 05/20/2004 | US20040094013 Chord winder for stringed instrument |
| 05/19/2004 | DE10250717A1 Process for stabilizing a chemical bath containing palladium used in the production of micro-hybrids comprises influencing the deposition rate of the palladium by adding nitrite or thiodiglycolic acid to the chemical bath |
| 05/19/2004 | CN1497830A Control power supply device for electroplating |
| 05/19/2004 | CN1497686A Method for producing aluminium nitride chip |
| 05/19/2004 | CN1497623A Method for forming metal coating and method for manufacturing chip electronic element |
| 05/19/2004 | CN1497063A Method for removing amine boron hydride compound from non-electroplate film solution |
| 05/19/2004 | CN1497062A Non-electrolytic segregating method of metal |
| 05/19/2004 | CN1150350C Nickel phosphorus chemical plating method of neodymium iron boron permanent magnet material |