Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
04/2007
04/04/2007CN1940135A Electroplating method of large glass fibre reinforced plastic products
04/04/2007CN1940134A Magnesium-alloy chemical nickel coating method
04/04/2007CN1940133A Method for chemically coating nickel by magnesium-alloy
04/03/2007US7198662 Aqueous solution containing sulfonate compound
03/2007
03/29/2007WO2007035091A1 Method for partially metallizing a product
03/29/2007WO2007034583A1 Process for producing metal covering-type organic crystal
03/29/2007US20070071994 Surface-treated a1 sheet having excellent solderability, heat sink using the sheet, and method for manufacturing the surface-treated a1 sheet having excellent solderability
03/29/2007US20070071904 Electroless copper plating solution and electroless copper plating method
03/29/2007DE102005000836B4 Verfahren zum Beschichten von Polymerverbundteilen A process for coating polymer composite parts
03/28/2007EP1768132A1 Conductive microparticle, process for producing the same and anisotropic conductive material
03/28/2007EP1767672A1 Tin-based plating film and method for forming the same
03/28/2007EP1767664A1 Electroless gold plating liquid
03/28/2007EP1767663A1 Method for partially metallizing a product
03/28/2007EP1364076B1 Device and method for supplying a cvd reactor with a liquid starting material entering into a gaseous phase
03/28/2007CN1936096A Copper substitutional solution for plastic electroplating and electroplating process
03/28/2007CN1936081A Graphite powder chemical-copper-plating process
03/28/2007CN1936079A Method for chemically-plating nickel-phosphor alloy cladding on magnesium alloy surface
03/28/2007CN1936078A Composite conducting microball and its preparing method
03/28/2007CN1936077A Two-step electro-zine-plating method on magnesium alloy as chemically nickel-plating intermediate transition layer
03/28/2007CN1936076A Nickel-base composite cladding for preventing cold-welding effect under high vacuum environment and its plating process
03/28/2007CN1936075A Electroplating-substituted cladding coating and process
03/28/2007CN1936074A Method and apparatus for growing three-dimensional photon crystal film by pressure-reducing self-assembling
03/27/2007US7195989 Electrochemical fabrication methods using transfer plating of masks
03/27/2007US7195795 Material for forming insulation film and film-forming method with the use of the material
03/22/2007WO2007033188A2 Substrate-enhanced electroless deposition (seed) of metal nanoparticles on carbon nanotubes
03/22/2007WO2007032222A1 Electroless plating catalyst for printed wiring board having through hole, and printed wiring board having through hole processed by using such catalyst
03/22/2007WO2007032143A1 Film forming apparatus and method of film formation
03/22/2007WO2007031712A2 Method of forming conductive tracks
03/22/2007WO2006002969A3 Device and method for chemically and electrolytically treating work pieces
03/22/2007WO2005013331A3 Supercritical fluid-assisted deposition of materials on semiconductor substrates
03/22/2007US20070065634 Use of an object as a decorative component
03/22/2007US20070062408 Composition comprising source of deposition ions selected from cobalt and nickel ions, reducing agent for reducing deposition ions onto substrate, and stabilizer comprising molybdenum oxide; for electrolessly depositing cobalt, nickel or alloys thereof onto substrate in manufacture of microelectronics
03/22/2007CA2621434A1 Film forming apparatus and film forming method
03/21/2007EP1763594A1 Method for improving solderability of nickel coatings
03/21/2007CN1934660A Corrosion-resistant rare earth magnets and process for production thereof
03/21/2007CN1934173A Method for forming surface graft, method for forming conductive film, method for forming metal pattern, method for forming multilayer wiring board, surface graft material, and conductive material
03/21/2007CN1933143A Electroless plating liquid and semiconductor device
03/21/2007CN1932078A Chemical pd-plating process for stainless steel surface with excellent anticossive performance in non-oxidant medium
03/21/2007CN1306522C Composition, solution and method for forming transparent conductive film
03/20/2007US7192850 Sulfiding, oxidation or forming intermetallics with group II element and a group VI element, doping with a transitional metals and halogen elements; enhance the uniformly dispersion of the dopants, prevent from separating out; improve light-emitting, wavelengths of the absorption properties
03/20/2007US7192510 Fluid control device and method of manufacturing the same
03/20/2007US7192509 Process for producing a metal structure in foam form, a metal foam, and an arrangement having a carrier substrate and a metal foam
03/15/2007WO2007030010A1 STEEL ARTICLE PROVIDED WITH A Zn-Fe-Co COATING AND METHOD TO DEPOSIT SUCH A COATING ON A STEEL ARTICLE
03/15/2007WO2007028234A1 Process for producing metal foams having uniform cell structure
03/15/2007WO2007008218A3 High aspect ratio metal particles and methods for forming same
03/15/2007US20070059449 Plating method of metal film on the surface of polymer
03/15/2007US20070056464 A silver deposit solution comprisingan acid,a source of silver ions andan additive selected from the group consisting of pyrroles, triazoles, tetrazoles, and mixtures ; including 1,2,3-benzotriazin-4(3H)-one; cost efficiency; simplification
03/15/2007DE112005000292T5 Metallorganische Verbindungen mit hoher Keimbildungsdichte Organometallic compounds with high nucleation density
03/15/2007CA2619013A1 Process for producing metal foams having uniform cell structure
03/14/2007EP1762640A2 Metal duplex and method
03/14/2007EP1761658A2 Device and method for chemically and electrolytically treating work pieces
03/14/2007EP1761657A2 Method for production of a substrate coated with a zeolite layer
03/14/2007CN1928160A Method for electrically plating Ti-Cu-Zn three alloys meeting three-prevention demand
03/14/2007CN1928156A Chemical plating method for Mg and its alloy
03/14/2007CN1928155A High temperature corrosion and wear resistant technical process for oil-well pump cylinder plunger valve
03/14/2007CN1928154A Technical process of chrome plating overpassing hydraulic mechanical member
03/14/2007CN1928153A Method for chemically plating alloy on surface of arc differential oxide film and chemical plating solution
03/14/2007CN1304636C Chemical nickeling phosphorus alloy plating liquid and coating process thereof
03/14/2007CN1304635C Nickel phosphorus chemical plating solution
03/14/2007CN1304634C Plating solution of chemical plating for magnesium and magnesium alloy
03/14/2007CN1304633C Chemical nickel-plating method on magnesium alloy surface
03/13/2007US7189435 Three dimensional multilayer nanostructure
03/13/2007US7189146 Method for reduction of defects in wet processed layers
03/08/2007WO2006123144A3 Formation of layers on substrates
03/08/2007US20070054112 Conductive layers and fabrication methods thereof
03/08/2007US20070054056 Composition for coating metals to protect against corrosion
03/07/2007EP1760171A1 Pretreating agent for electroless plating, method of electroless plating using the same and product of electroless plating
03/07/2007EP1759038A2 Method for selective coating of a composite surface production of microelectronic interconnections using said method and integrated circuits
03/07/2007EP1759037A2 Aqueous/organic metal oxide dispersion and coated substrates and mouldings produced therewith
03/07/2007CN1925927A Enhanced metal ion release rate for anti-microbial applications
03/07/2007CN1924095A Oxide based diluted magnetic semiconductor thin film with room temperature ferromagnetism and preparation method thereof
03/07/2007CN1924089A Preparation method of two-sided polyimide/silver composite film with reflectivity and conductivity
03/07/2007CN1924088A Polyimide polymer for preparing copper-cover laminated plate and preparation method thereof
03/07/2007CN1303261C Liquid tank
03/06/2007US7186582 Providing a chemical vapor deposition chamber having disposed therein a substrate:introducing a gas comprised of a higher-order silane of the formula SinH2n+2 and a germanium precursor to the chamber, wherein n=3 6; and depositing a SiGe-containing film onto the substrate
03/01/2007WO2007024610A1 Complex inorganic effect materials
03/01/2007WO2005112090A3 Adhesion of a metal layer to a substrate and related structures
03/01/2007US20070048525 Method for forming plated coating, electromagnetic shielding member, and housing
03/01/2007US20070048440 Ferrite thin film for high-frequency devices and production method thereof
03/01/2007US20070046313 Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology
03/01/2007DE20023858U1 Unabhängig von Aktivierungsbehandlungen zur Wasserstoffsorption befähigte Verbundmaterialien Regardless of activation treatments for hydrogen sorption capable of composite materials
02/2007
02/28/2007EP1757371A1 Substrate processing unit and substrate processing apparatus
02/28/2007EP1756333A1 Anode for oxygen evolution
02/28/2007EP1371755B1 Method of electroless plating and apparatus for electroless plating
02/28/2007CN1922344A Apparatus for electroless deposition
02/28/2007CN1922340A Method of electroplating on aluminum
02/28/2007CN1922006A Plated resin formed article
02/28/2007CN1921956A Laser processing for heat-sensitive mesoscale deposition
02/28/2007CN1919502A Coated powder and process for the preparation thereof
02/28/2007CN1301937C Method for metallizing titanate-based ceramics
02/27/2007US7182995 Plated-polyester article and production process thereof
02/22/2007WO2007021332A2 Composite electroless plating
02/22/2007WO2007021023A1 Electroless plating apparatus and plating liquid
02/22/2007WO2007020485A1 A method of producing titanium oxide films at low temperatures for photocatalytic and photovoltaic applications
02/22/2007WO2007003828A3 Sol for sol-gel process coating of a surface and coating method by sol-gel process using same
02/22/2007WO2006120387A3 Sol-gel derived coating
02/22/2007US20070042125 Electroless copper plating solution
02/22/2007DE10317793B4 Verwendung eines Gegenstands als elektrisches oder elektronisches Bauteil The use of an article as an electrical or electronic component
02/21/2007EP1558786B1 Pretreatment method for electroless plating material and method for producing member having plated coating
02/21/2007CN1918325A Method and apparatus for selectively changing thin film composition during electroless deposition in a single chamber
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