Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
01/2007
01/02/2007US7157287 Method of substrate surface treatment for RRAM thin film deposition
01/02/2007US7157114 Applying Pt(acetylacetonate)2 onto a nonmetal, matal or alloy substrate, wrapping substrate with a metal foil; heating substrate and foil, wherein Pt(acetylacetonate)2 decomposes to deposit pure platinum on the substrate
01/02/2007US7156904 Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby
01/02/2007US7155959 Nanodisk sensor and sensor array
12/2006
12/28/2006WO2006137730A1 Method for metallizing a microscopic synthetic substrate and a metallized substrate
12/28/2006WO2006137555A1 Apparatus and method for manufacturing plated film
12/28/2006WO2006137225A1 Metal mold for glass shaping and process for producing the same
12/28/2006US20060292434 Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells
12/28/2006US20060292294 Electroless plating bath composition and method of use
12/27/2006EP1736567A1 Treatment for improved magnesium surface corrosion-resistance
12/27/2006EP1735824A2 Adhesion of a metal layer to a substrate and related structures
12/27/2006CN1886255A Aluminum phosphate compounds, compositions, materials and related metal coatings
12/27/2006CN1884614A Vibration chemical plating method for steel ball
12/21/2006WO2006135113A1 Coating liquid for nickel film formation, nickel film and method for producing same
12/21/2006WO2006135079A1 Electroless gold plating liquid
12/21/2006US20060286828 Contact Structures Comprising A Core Structure And An Overcoat
12/21/2006US20060286348 Object
12/21/2006US20060286304 Methttod for producing metal conductors on a substrate
12/21/2006US20060283354 Method of producing composition for forming dielectric film, composition for forming dielectric film, dielectric film and method of producing dielectric film
12/21/2006DE19729891B4 Verfahren zur gezielten Aufrauhung von Kunststoffoberflächen und Vorrichtung zur Ausführung des Verfahrens A method for the targeted roughening plastic surfaces and apparatus for carrying out the method
12/20/2006EP1734539A1 Corrosion-resistant rare earth magnets and process for production thereof
12/20/2006EP1734156A1 Process for the direct metallization of nonconductive substrates
12/20/2006EP1415019A4 Treatment for improved magnesium surface corrosion-resistance
12/20/2006CN1880549A Washing ball for drum washing machine and method for making same
12/20/2006CN1880502A Magnesium alloy nano chemical composite plating solution and process for preparing same and application thereof
12/19/2006US7150926 Thermal barrier coating with stabilized compliant microstructure
12/14/2006WO2006132241A1 Method for forming metal film and metal wiring pattern, foundation composition for formation of metal film and metal wiring pattern, and metal film
12/14/2006US20060280860 Cobalt electroless plating in microelectronic devices
12/14/2006US20060279300 Probe Card Assembly And Kit
12/14/2006US20060278123 Composition for the currentless deposition of ternary materials for use in the semiconductor industry
12/13/2006EP1732113A2 Silver metallization by damascene method
12/13/2006EP1730328A2 Method for the production of iridium oxide coatings
12/13/2006EP1295344B1 Direct printing of thin-film conductors using metal-chelate inks
12/13/2006CN1876892A Corrosion-resistant metal-based composite material for plate type heat exchanger
12/13/2006CN1876891A Method for direct metallization of non-conducting substrates
12/13/2006CN1289711C Magnesium alloy chemical plating nickel solution and its plating method
12/13/2006CN1289614C Substance for forming electrically-conducting film and electrically-conducting film and its manufacturing method
12/12/2006US7147896 Surface of zirconia ceramic is cleaned, acid etched, rinsed; activating surface is achieved by first applying a tin sensitizer, rinsing, and then a palladium activator, then applying electroless nickel to surface of material and rinsing; surface can be subsequently plated with gold, nickel, copper, tin
12/12/2006US7147805 Composition for forming a transparent conducting film, solution for forming a transparent conducting film and method of forming a transparent conducting film
12/12/2006US7147767 Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor
12/07/2006WO2006129806A1 Separator for fuel cell and method for manufacturing the same
12/06/2006EP1078114A4 Coating compositions containing nickel and boron
12/06/2006CN1875469A Processes for fabricating conductive patterns using nanolithography as a patterning tool
12/06/2006CN1875130A Resin substrate having a resin-metal composite layer and method for manufacturing thereof
12/06/2006CN1873053A Technique for plating nickel and phosphor under acidity for lead brass stylus
12/06/2006CN1873044A Technique for heat-treating lead brass stylus coated by nickel and phosphor
12/06/2006CN1288278C Method of silver plating layer in fine structure deposited from non aqueous solution and application
12/05/2006US7144679 Polyimide resin precursor solution, laminates for electronic components made by using the solution and process for production of the laminates
12/05/2006US7144627 Multi-layer nanoshells comprising a metallic or conducting shell
12/05/2006US7144491 Used in the manufacture of an electrolytic copper foil that allows fine patterning and that is superior in terms of elongation and tensile strength at ordinary temperatures and high temperatures
11/2006
11/30/2006WO2006065819A3 Metal components with silicon-containing protective coatings and methods of forming such protective coatings
11/30/2006US20060269824 Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells
11/30/2006US20060269761 Electroless gold plating liquid
11/30/2006US20060266257 Metal plating process
11/29/2006EP1726683A1 Method and apparatus for adjusting the ion concentration of an electrolytic solution
11/29/2006EP1352108A4 Coating compositions containing nickel and boron and particles
11/29/2006CN1287007C Preparation method of carbon nano-pipe/silver complex functional material
11/29/2006CN1287006C Surface anticorrosion method of submarine
11/29/2006CN1287005C Submarine surface anticorrosive process scheme
11/28/2006US7142000 Mounting spring elements on semiconductor devices, and wafer-level testing methodology
11/28/2006US7141492 Method for forming thin-film, apparatus for forming thin-film, method for manufacturing semiconductor device, electro-optical unit, and electronic apparatus
11/28/2006US7141311 Crystal structure with the c-axis oriented perpendicular to the surface
11/28/2006US7141274 Batch processing method for processing a number of substrates simultaneously; substrate holders which have heating medium flow passages regulate the temperature of the holding portions as a whole; for embedding interconnects in the surface of a substrate like a semiconductor
11/28/2006US7141269 Molding technique for copper interconnecting wires by electrochemical displacement deposition on the pre-shaped metal layer
11/28/2006US7140883 Contact carriers (tiles) for populating larger substrates with spring contacts
11/23/2006WO2006123834A2 Graft pattern forming method and conductive pattern forming method
11/23/2006US20060264139 Filter materials with a bipolar coating
11/23/2006US20060263614 Method for the formation of a coating of metal oxides on an electrically-conductive substrate, resultant activated cathode for the electrolysis of aqueous solutions of alkaline metal chlorides
11/23/2006US20060263580 providing novel ligating copolymers comprising functional groups capable of binding to substrate surface and functional groups capable of ligating to catalysts such as metal ions, metal complexes, nanoparticles, or colloids, binding thereto
11/23/2006US20060263541 Photoreduction method for metal complex ions
11/23/2006US20060260780 Use of an object as shaping tool
11/22/2006EP1724121A1 Method for producing a metallised image on a sheet material and device for carrying out said method
11/22/2006CN1868037A Composition for forming silicon-cobalt film, silicon-cobalt film, and forming method therefor
11/22/2006CN1867698A Plating solution for electroless copper plating
11/22/2006CN1867697A Electroless copper plating solution and method for electroless copper plating
11/22/2006CN1867696A Method for treating ferrous alloy pieces by sulphidisation
11/22/2006CN1867411A Compositions and methods for the electroless deposition of NiFe on a work piece
11/22/2006CN1865501A Process for preparing nano noble metal reinforced silk fiber-base composite materials
11/22/2006CN1865500A Process for electroless copper on silicon chip
11/22/2006CN1865499A Process for preparation of anti-corrosion chemical plating of steel
11/22/2006CN1865498A Heterogeneous metal joining member excellent in corrosion resistance and process for preparing same
11/22/2006CN1285764C Electroless-plating solution
11/22/2006CN1285763C Selective fiber metallization
11/22/2006CN1285451C Method for making cutting tool with electroless nickel coating
11/21/2006US7138572 Peg for stringed instruments
11/21/2006US7138014 Electroless deposition apparatus
11/16/2006WO2006121299A2 Organometallic precursor and production of superconducting oxide thin films
11/16/2006WO2006121186A1 Coating material difficult to plate and method of pretreatment for plating
11/16/2006WO2006120387A2 Sol-gel derived coating
11/16/2006US20060257667 Composition for forming silicon-aluminum film, silicon-aluminum film and method for forming the same
11/16/2006US20060254052 Dielectric substrate with aperture; grounding layer; electroconductive overcoating; multilayer ; irradiating with ions
11/15/2006EP1722007A1 Dissimilar metal joint member with good corrosion resistance and method for manufacturing same
11/15/2006EP1157149A4 DOUBLE-DIP Pd/Sn CROSSLINKER
11/15/2006EP1099012A4 Method and apparatus for copper plating using electroless plating and electroplating
11/15/2006CN1864241A Apparatus to improve wafer temperature uniformity for face-up wet processing
11/15/2006CN1284881C Magnesium and magnesium alloy chemical-plating liquor composition
11/14/2006US7135404 Method for applying metal features onto barrier layers using electrochemical deposition
11/14/2006US7135394 Conductive layers and fabrication methods thereof
11/14/2006US7135098 Copper interconnect seed layer treatment methods and apparatuses for treating the same
11/09/2006WO2006118230A1 Material for plating and use thereof
1 ... 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 ... 163