Patents for C09K 13 - Etching, surface-brightening or pickling compositions (3,392)
12/2004
12/29/2004EP1490454A2 Poly(organosiloxane) materials and methods for hybrid organic-inorganic dielectrics for integrated circuit applications
12/23/2004WO2004112122A1 Semiconductor crystal defect etch
12/23/2004WO2004111157A1 Polishing fluid for metal and polishing method
12/23/2004US20040258885 Etched dielectric film in microfluidic devices
12/16/2004WO2004108592A1 Method for producing highly pure solutions using gaseous hydrogen fluoride
12/16/2004CA2526230A1 Compositions and methods for darkening and imparting corrosion-resistant properties to zinc or other active metals
12/15/2004CN1180459C Etching composition and use thereof
12/14/2004US6830500 Copper is oxidized at same or higher speed than tungsten barrier; chemical mechanical polishing
12/09/2004WO2004063083A3 Apparatus for transfer of an array of liquids and methods for manufacturing same
12/09/2004US20040247921 Controlling etching depth; dielectric film for flexible circuits containing liquid crystalline polymer and polyimide
12/09/2004US20040247814 Aligned polymer organic TFT
12/08/2004CN1552795A Preparing method for dipping solution
12/08/2004CN1552794A Dipping solution and preparing method thereof
12/02/2004US20040242019 Combined etching and doping substances
12/02/2004US20040242015 Etching compositions for silicon germanium and etching methods using the same
12/02/2004US20040242000 Etchant and array substrate having copper lines etched by the etchant
12/02/2004DE10320212A1 Verfahren zum Texturieren von Oberflächen von Silizium-Scheiben Method for texturing surfaces of silicon wafers
12/01/2004EP1481576A1 Liquid crystal polymers for flexible circuits
12/01/2004CN1550532A 抛光组合物 The polishing composition
12/01/2004CN1550531A 抛光组合物 The polishing composition
11/2004
11/24/2004CN1550124A Liquid crystal polymers for flexible circuits
11/23/2004US6821352 Compositions for removing etching residue and use thereof
11/18/2004WO2004100244A1 Method for texturing surfaces of silicon wafers
11/17/2004CN1546608A Preparation of impregnating agent asphalt
11/16/2004US6818148 Resist composition and patterning method
11/10/2004EP1475822A1 Cleaning gas and etching gas
11/10/2004EP1086191A4 Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
11/10/2004CN1545533A Etching liquid for thermoplastic polyimide resin
11/10/2004CN1544336A Chemical processing method for promotion of titanium dioxide product quality
11/03/2004CN1543494A Method to remove iron sulfide deposits from pipe lines
10/2004
10/27/2004EP1470577A1 A chemistry for etching quaternary interface layers on ingaasp mostly formed between gaas and inxga(1-x)p layers
10/27/2004CN1173413C Method for raw etching silicon solar cells
10/20/2004CN1171963C Compositions for chemical-mechanical polishing
10/19/2004US6806198 Gas-assisted etch with oxygen
10/14/2004US20040200806 Adding water to reduce concentration of phosphoric acid in the etching solution, causing silicon compound to precipitate, filtering to return the etching solution for reuse
10/12/2004US6803248 Chemistry for etching quaternary interface layers on InGaAsP mostly formed between GaAs and InxGa(1-x)P layers
10/05/2004US6800105 Abrasive for metal
09/2004
09/30/2004WO2004084288A1 Process for production of etching or cleaning fluids
09/30/2004US20040192046 Highly selective silicon oxide etching compositions
09/30/2004US20040188385 Etching agent composition for thin films having high permittivity and process for etching
09/29/2004CN1532305A 蚀刻液管理方法和蚀刻液管理装置 The etching solution and the etching solution management method managing means
09/29/2004CN1532260A Heat resistant impregnant resin and its preparing method and use
09/29/2004CN1532245A 抛光组合物 The polishing composition
09/28/2004US6797626 Method of polishing copper layer of substrate
09/15/2004CN1167110C Etching solution, etched article and method for etched article
09/15/2004CN1166986C Leveling method
09/09/2004US20040173569 Cleaning gas and etching gas
09/02/2004US20040171503 Compositions for removing etching residue and use thereof
09/02/2004US20040171264 Methods of polishing, interconnect-fabrication, and producing semiconductor devices
09/01/2004EP1124912A4 A chemical mechanical polishing slurry system having an activator solution
08/2004
08/31/2004US6783434 Cerium oxide slurry containing cerium oxide particles, a dispersant polymer containing ammonium acrylate as a copolymerized ingredient, a polyammonium-acrylate or a polyamine-acrylate, and water
08/26/2004US20040163324 better polishing selectivity to polysilicon than to oxide films
08/25/2004EP1450396A1 Production method for silicon wafer and silicon wafer and soi wafer
08/24/2004US6780784 Etchant is hydrogen peroxide (h2o2), and a mixed solution including at least one of an organic acid, an inorganic acid, and a neutral salt; for liquid crystal display devices having copper lines
08/24/2004US6780783 Method of wet etching low dielectric constant materials
08/19/2004WO2004030041B1 High selectivity and high planarity dielectric polishing
08/18/2004EP1446460A1 Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
08/18/2004CN1522292A Process for removing contaminant from a surface and composition useful therefor
08/17/2004US6777380 Stripping photoresists
08/12/2004US20040157448 Compositions and methods for removing etch residue
08/11/2004EP1230334A4 Non-corrosive cleaning composition for removing plasma etching residues
08/04/2004CN1160205C Making process of dust-free blackboard
07/2004
07/29/2004WO2004063083A2 Apparatus for transfer of an array of liquids and methods for manufacturing same
07/29/2004US20040147206 CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate
07/28/2004CN1516892A Cleaning gas and etching gas
07/27/2004US6767476 Polishing composition for metal CMP
07/21/2004CN1158694C Material for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using same
07/08/2004US20040129679 Process and device for the wet-chemical treatment of silicon
07/08/2004US20040129676 Apparatus for transfer of an array of liquids and methods for manufacturing same
07/07/2004EP1435116A1 Combined etching and doping substances
07/07/2004CN1511338A 蚀刻液组合物 Etchant compositions
07/06/2004US6758872 Dispersion of abrasive grains comprisng compounds of cerium, copper, and/or ammonium
07/01/2004WO2004030041A3 High selectivity and high planarity dielectric polishing
06/2004
06/30/2004CN1509204A Bis (perfluoroalkanesulfonyl)imides and their salts as surfactants/additives for applications having extreme environments and methods thereof
06/29/2004US6756312 Method of fabricating a semiconductor device including time-selective etching process
06/29/2004US6755989 Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
06/24/2004US20040121600 Method of wet etching a silicon and nitrogen containing material
06/23/2004CN1507655A Ruthenium silicide wet etch
06/23/2004CN1506496A Etchant
06/23/2004CN1155061C Etchant and method for making semiconductor device with the same
06/23/2004CN1154546C Method for cleaning PZT thin film
06/22/2004US6753001 Gel containing silica sol
06/17/2004US20040115926 Method of wet etching an inorganic antireflection layer
06/17/2004US20040112869 Cleaning composition
06/16/2004EP1428417A1 Liquid crystal polymers for flexible circuits
06/16/2004CN1505694A Use of perfluoroketones as vapor reactor cleaning, etching, and doping gases
06/16/2004CN1153823C Composite for mechanochemical polishing polymer insulating material layer with low dielectric constant
06/15/2004US6750151 Etching method for ZnSe polycrystalline substrate
06/15/2004US6750128 Methods of polishing, interconnect-fabrication, and producing semiconductor devices
06/15/2004US6749766 Etched metal oxide film
06/09/2004CN1502722A Etching solution composition for metal foil using silver as main composition
06/03/2004WO2003063205A3 Poly(organosiloxane) materials and methods for hybrid organic-inorganic dielectrics for integrated circuit applications
06/02/2004EP1423491A1 Method and composition to decrease iron sulfide deposits in pipe lines
06/02/2004CN1500912A Improved cleaning c omposition
06/01/2004US6743725 High selectivity SiC etch in integrated circuit fabrication
06/01/2004US6743268 Acidic slurry of an oxidizer, deionized water, a corrosion inhibitor and a surfactant
05/2004
05/27/2004WO2004044092A1 Fluorinated surfactants for aqueous acid etch solutions
05/27/2004WO2004044091A1 Fluorinated surfactants for buffered acid etch solutions
05/26/2004CN1500130A Aqueous cleaning compsn. contg. copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
05/25/2004US6740252 Potassium hypochlorite, hydrofluoric acid and deionized water
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