Patents for C09K 13 - Etching, surface-brightening or pickling compositions (3,392)
02/2008
02/21/2008US20080041824 Microetching composition and method of using the same
02/21/2008US20080041823 Wet etching solution
02/21/2008US20080041813 Methods and compositions for wet etching
02/19/2008US7332436 Process of removing residue from a precision surface using liquid or supercritical carbon dioxide composition
02/19/2008US7332104 Slurry for CMP, polishing method and method of manufacturing semiconductor device
02/14/2008US20080038994 Method to passivate conductive surfaces during semiconductor processing
02/14/2008US20080035882 Composition for polishing a substrate
02/13/2008EP1885819A2 Pretreatment compositions
02/13/2008CN100368598C Copper or copper alloy surface tiny-etching treatment fluid for smoothing
02/07/2008US20080032606 Method for controlling the dishing problem associated with chemical-mechanical planarization (cmp) during manufacture of copper multilayer interconnection structures in ultra large-scale integrated circuits (ulsi)
02/07/2008US20080032214 Photoresist trimming process
01/2008
01/31/2008WO2008012984A1 Process for metallization of plastic surfaces
01/31/2008US20080023667 Fluoride tile etchants having improved safety
01/24/2008US20080020577 Gallium and chromium ions for oxide rate enhancement
01/23/2008EP1320875A4 Gas compositions for cleaning the interiors of reactors as well as for etching films of silicon-containing compounds
01/23/2008CN101110376A Method for forming soldering projection and its etchant
01/17/2008WO2007047454A3 Process and composition for electrochemical mechanical polishing
01/17/2008WO2007040752A3 Process and system for etching doped silicon using sf6-based chemistry
01/17/2008US20080011982 A Method And Composition For Selectively Stripping Nickel From A Substrate
01/17/2008US20080011981 Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the same
01/17/2008US20080011980 Polishing inhibiting layer forming additive, slurry and cmp method
01/17/2008US20080011714 Photoresist stripping solution and a method of stripping photoresists using the same
01/15/2008US7319174 Dry-etching gas for semiconductor process and preparation method thereof
01/09/2008CN101103089A Polishing slurries and methods for chemical mechanical polishing
01/08/2008US7316977 Chemical-mechanical planarization composition having ketooxime compounds and associated method for use
01/08/2008US7316603 Compositions and methods for tantalum CMP
01/08/2008CA2364745C Etching method for znse polycrystalline substrate
01/03/2008US20080003925 Cmp Polishing Slurry and Method of Polishing Substrate
01/03/2008US20080003829 Chemical mechanical polishing slurry
01/02/2008CN101098989A Copper etchant and method of etching
01/02/2008CN101096596A Silicon chip etching solution
01/01/2008US7314823 Chemical mechanical polishing composition and process
12/2007
12/27/2007US20070298618 Forming a gate stack on a semiconductor substrate, forming a conformal silicon oxide layer on the semiconductor substrate using a low temperature cyclic method involving exposing the semiconductor substrate to a silicon containing precursor to form a seed layer ; forming a spacer layer; memory cells
12/27/2007US20070298611 Selective barrier slurry for chemical mechanical polishing
12/27/2007US20070295934 Polishing slurry and polishing method
12/26/2007EP1868953A2 Composition and method for polishing a sapphire surface
12/26/2007EP1868769A2 Slurry composition and method for polishing organic polymer-based ophthalmic substrates
12/26/2007CN101092504A Solvent free resin applied to technique of vacuum pressure for dipping electrical motor in high voltage
12/25/2007US7311857 Etching composition, method of preparing the same, method of etching an oxide film, and method of manufacturing a semiconductor device
12/25/2007US7311856 Chemical-mechanical polishing of a polishing pad,and/or abrasive; surfactant with an azole group of 1,2,3-triazole, 1,2,4-triazole, pyrazole, imidazole, indazole, tetrazole, benzimidazole, and/or benzotriazole having a polymer chain attached; not polyvinylimidazole; and liquid carrier
12/25/2007US7311855 Cerium oxide, acetylene compound, and water; flattening dielectrics; semiconductors
12/21/2007WO2007111679A3 Method of selectively depositing a thin film material at a semiconductor interface
12/20/2007US20070290166 Method and composition for polishing a substrate
12/20/2007US20070290165 Comprises an abrasive component, a corrosion inhibitor, a surfactant, a diacid compound, a metal residue inhibitor, for example, 1,2,3,4-butanetetracarboxylic acid, and water; eliminates problems of metal dishing and metal residue while maintaining desired polishing rate
12/19/2007CN101089120A Preparation of water-proop immersion article for porous mineral building material
12/19/2007CN100355858C Slurry for chemical-mechanical polishing copper damascene structures
12/19/2007CN100355491C Waterpower liquid
12/13/2007WO2007075875A3 Etchant formulations and uses thereof
12/13/2007US20070287362 Polishing composition and method of polishing with the same
12/12/2007EP1412453A4 Process for removing contaminant from a surface and composition useful therefor
12/12/2007CN100355034C Wafer bonding surface processing agent and wafer bonding method
12/12/2007CN100355016C Process for producing a movable structure and etchant for silicon oxide film
12/11/2007US7307778 Methylbenzyl alcohol or N-methylpyrrolidone, a low molecular weight aliphatic alcohol, isoproyl alcohol, or lactone, and water; removing the strippable layers
12/11/2007US7306747 Use of fluorinated additives in the etching or polishing of integrated circuits
12/06/2007WO2007046790A3 Chemical for data destruction
12/06/2007US20070278447 Slurry for chemical-mechanical planarization of sapphire and method for manufacturing the same
12/06/2007US20070278185 Etching composition and etching process
12/05/2007EP1862525A2 Etching composition and etching process
11/2007
11/27/2007US7300603 Aqueous solution mixture of oxidizer and abrasive; using polymaleic acid; acidity pH
11/27/2007US7300602 Selective barrier metal polishing solution
11/27/2007US7300601 Passivative chemical mechanical polishing composition for copper film planarization
11/22/2007WO2005076871A3 Lapping composition and method using same
11/21/2007CN100350008C 抛光组合物 The polishing composition
11/20/2007US7297757 A mixture for activating the surface of a first resin to enhance a close contact of the surface with a surface of a metal or a second resin containing a trivalent or tetravalent cerium compound; increased adhesive strength between, e.g., a polyimide based resin film with metal wires or another resin
11/15/2007WO2007078355A3 Microetching composition and method of using the same
11/15/2007US20070264829 Slurry and method for chemical mechanical polishing
11/15/2007US20070264748 Aligned polymers for an organic tft
11/07/2007EP1851286A2 Novel polishing slurries and abrasive-free solutions having a multifunctional activator
11/07/2007CN100347344C Etching solution composition for metal foil using silver as main composition
11/01/2007WO2007055669A3 Recyclable etching solution
11/01/2007US20070254485 Abrasive composition for electrochemical mechanical polishing
10/2007
10/30/2007US7288212 Comprises acrylic acid-maleic acid copolymer and sodium hydroxide; for chemical mechanical polishing of semiconductors
10/24/2007CN101058711A Grinding fluid for metal and grinding method
10/23/2007US7285229 Etching aqueous solution containing hydrochloric acid, nitric acid and cupric compound; process control
10/18/2007WO2007117880A1 Composition for etching a metal hard mask material in semiconductor processing
10/18/2007US20070243710 Adjuvant for CMP slurry
10/17/2007CN100343362C Polishing fluid for metal and polishing Method
10/17/2007CN100343361C Aqueous cleaning compsn. contg. copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
10/17/2007CN100343189C Etching pastes for inorganic surfaces
10/11/2007US20070235685 Etching reagent, and method for manufacturing electronic device substrate and electronic device
10/11/2007US20070235684 Composition for etching a metal hard mask material in semiconductor processing
10/10/2007CN101050348A Etchant composition, composition for polishing, method for producing polishing composition and polishing method
10/04/2007WO2007111694A2 Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon
10/04/2007US20070228011 Novel chemical composition to reduce defects
10/03/2007CN100340632C Method for roughening copper surfaces for bonding to substrates
10/02/2007US7276181 Method for preparing decorative glass using glass etching composition
10/02/2007US7276180 Chemical mechanical polishing composition and process
09/2007
09/27/2007US20070224829 Use Of Hypofluorites, Fluoroperoxides, And/Or Fluorotrioxides As Oxidizing Agent In Fluorocarbon Etch Plasmas
09/27/2007US20070224792 Manufacturing method of semiconductor device and etching solution
09/26/2007EP1836725A1 Method for selective etching
09/26/2007EP1687831B1 Functional paste
09/26/2007CN101041555A Ornamental glass having etching pattern and multicolor pattern and and method for manufacturing same
09/25/2007US7273566 Etchant composed of a carrier gas; CH2F2; CF4; and C4F6 and/or C5F8; good selectivity to both nitrides and field oxides; integrated circuits produced using these etchants are less likely to be defective due to photoresist mask misalignment
09/20/2007US20070218700 Etching solution comprising hydrofluoric acid
09/20/2007US20070218692 Copper-based metal polishing compositions and polishing processes
09/20/2007US20070215835 Surface treating fluid for fine processing of multi-component glass substrate
09/19/2007CN101037511A Method for preparing micro-hole array polyolefine film by electron beam radiation
09/13/2007WO2007103578A1 Method of polishing a tungsten carbide surface
09/13/2007US20070210278 Compositions for chemical mechanical polishing silicon dioxide and silicon nitride
09/12/2007EP1833085A1 Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
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