| Patents for C09K 13 - Etching, surface-brightening or pickling compositions (3,392) |
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| 04/11/2007 | EP1772495A2 Stripper |
| 04/11/2007 | CN1310341C Etching process for making electrodes |
| 04/05/2007 | WO2007038321A2 Ultrapure colloidal silica for use in chemical mechanical polishing applications |
| 04/05/2007 | US20070075292 Ultrapure colloidal silica for use in chemical mechanical polishing applications |
| 04/05/2007 | US20070075291 CMP Slurry, Preparation Method Thereof and Method of Polishing Substrate Using the Same |
| 04/05/2007 | US20070075290 Filterable Surfactant Composition |
| 04/05/2007 | US20070075042 Stabilizer-Fenton's reaction metal-vinyl pyridine polymer-surface-modified chemical mechanical planarization composition and associated method |
| 04/05/2007 | US20070075041 Chemically mechanically polishing the surface gallium-indium-arsenide-phosphide crystal using polishing slurry containing abrasive grains formed of SiO2; crystal surface having a small surface roughness can be formed at a high polishing rate and effectively |
| 04/05/2007 | US20070075040 Composition and method for planarizing surfaces |
| 04/03/2007 | US7198729 Slurry capable of reducing scratches on a region to be polished during Chemical Mechanical Polishing |
| 03/29/2007 | US20070069176 Aqueous polishing liquid and chemical mechanical polishing method |
| 03/29/2007 | US20070068902 Polishing composition and polishing method |
| 03/29/2007 | US20070068901 Composition and method for enhancing pot life of hydrogen peroxide-containing CMP slurries |
| 03/28/2007 | CN1935939A Chip-removing solution for integrated circuit packaging after treatment |
| 03/27/2007 | US7196018 Semiconductor etching paste and the use thereof for localized etching of semiconductor substrates |
| 03/22/2007 | WO2007032503A1 Aqueous solution and method for separation of conductive sintered ceramic material |
| 03/22/2007 | WO2007032502A1 Aqueous solution and method for separation of dark sintered ceramic material |
| 03/22/2007 | WO2007032501A1 Solution for separation of interlayer film and interlayer film separation method |
| 03/21/2007 | CN1934221A Composition useful for removal of bottom anti-reflection coatings from patterned ion-implanted photoresist wafers |
| 03/20/2007 | US7192885 Etching with a solution consisting of water, concentrated hydrofluoric acid and concentrated nitric acid at a temperature between 0 and 15 degrees Celsius |
| 03/20/2007 | US7192860 Highly selective silicon oxide etching compositions |
| 03/13/2007 | US7189684 Polishing composition and method for forming wiring structure using the same |
| 03/08/2007 | US20070051918 aqueous acid suspension of individualized colloidal silica particles not linked to each other by siloxane bonds, and a surfactant; for mechanical chemical polishing |
| 03/08/2007 | US20070051917 used for chemical mechanical polishing comprising oxidizing agents, abrasive particles, polyvinyl pyrrolidone, antistatic agents, a phosphate compound selected from ammonium phosphate, potassium phosphate or dipotassium phosphate, ammonium chloride, citric acid and water, having a pH of at least 8 |
| 03/08/2007 | US20070051700 Composition for cleaning substrates and method of forming gate using the composition |
| 03/08/2007 | US20070051693 Microetching solution |
| 03/07/2007 | CN1303655C Polishing method for base copper-layer |
| 03/06/2007 | US7186653 Polishing slurries and methods for chemical mechanical polishing |
| 03/01/2007 | WO2007024312A1 Improved microetching solution |
| 03/01/2007 | US20070045233 Polishing liquid composition |
| 02/28/2007 | CN1922661A Etched dielectric film in hard disk drives |
| 02/28/2007 | CN1301947C Process for producing perfluorocarbons and use thereof |
| 02/27/2007 | US7182882 Method of improving chemical mechanical polish endpoint signals by use of chemical additives |
| 02/22/2007 | US20070039921 Etching solutions and processes for manufacturing flexible wiring boards |
| 02/21/2007 | CN1916240A Corrosion liquid for InGaP/ AIGaInP crystal material |
| 02/20/2007 | US7179744 Method for fabricating semiconductor device |
| 02/20/2007 | US7179398 Etchant for wires, a method for manufacturing the wires using the etchant, a thin film transistor array substrate and a method for manufacturing the same including the method |
| 02/15/2007 | US20070034827 Blends of gelling and non-gelling starches with gellan gums and plasticizer |
| 02/13/2007 | US7176041 PAA-based etchant, methods of using same, and resultant structures |
| 02/08/2007 | US20070029519 Surface treating solution for fine processing of glass base plate having a plurality of components |
| 02/08/2007 | US20070029281 Gas for removing deposit and removal method using same |
| 02/08/2007 | US20070029280 Photoresists; dielectrics |
| 02/08/2007 | US20070029279 Wood treating formulation |
| 02/08/2007 | DE102005037335A1 Rückstandsfrei abnehmbares Beizmittel Cleanly removable mordant |
| 02/07/2007 | CN1909192A Non-selective etched process for GaAs/AlGaAs crystal material |
| 02/06/2007 | US7172976 Extrusion-free wet cleaning process for copper-dual damascene structures |
| 02/01/2007 | US20070023731 using an aqueous slurry comprising dissolved ammonium dimolybdate and ammonium octamolybdate in water and an oxidizing agent; apply aqueous slurry between the copper and a polishing pad; apply a low pressure with high polish rates on the surface of semiconductor wafer |
| 02/01/2007 | US20070023396 Etch compositions and methods of processing a substrate |
| 02/01/2007 | DE102005035255A1 Ätzmedien für oxidische, transparente, leitfähige Schichten Etching media for oxidic, transparent, conductive layers |
| 01/30/2007 | US7169323 Fluoroalkylsulfonamide salt and acid; etching silicon oxide substrates |
| 01/30/2007 | US7169322 Aqueous dispersion, process for its production and use |
| 01/30/2007 | US7168436 Gas for removing deposit and removal method using same |
| 01/25/2007 | WO2006076392A3 Polishing slurries and methods for chemical mechanical polishing |
| 01/24/2007 | CN1902297A Removal of MEMS sacrificial layers using supercritical fluid/chemical formulations |
| 01/24/2007 | CN1900164A Blend of polyimide polymer and its use as high temperature resisting dipping glue |
| 01/18/2007 | US20070015372 Etching solution, method of forming a pattern using the same, method of manufacturing a multiple gate oxide layer using the same and method of manufacturing a flash memory device using the same |
| 01/18/2007 | US20070012662 Solution for wet treatment of hafnium containing materials, use of the solution and a wet treatment process |
| 01/18/2007 | DE102005033724A1 Druckfähige Ätzmedien für Siliziumdioxid-und Siliziumnitridschichten Printable etchants for silicon dioxide and silicon nitride layers |
| 01/17/2007 | CN1899003A Etching solution, method of etching and printed wiring board |
| 01/17/2007 | CN1896822A Etching agent and method for manufacturing liquid crystal display using same |
| 01/16/2007 | US7163644 For planarizing the surface of a substrate, storage stability |
| 01/11/2007 | US20070007248 Compositions and methods for chemical mechanical polishing silica and silicon nitride |
| 01/11/2007 | US20070007241 Methods of making and modifying porous devices for biomedical applications |
| 01/11/2007 | DE102005031469A1 Medium zur Ätzung von oxidischen, transparenten, leitfähigen Schichten Medium for the etching of oxide, transparent conductive layers |
| 01/10/2007 | EP1742256A1 Alkaline etchant for controlling surface roughness of semiconductor wafer |
| 01/10/2007 | CN1294631C Etching agent |
| 01/09/2007 | US7160482 Composition comprising an oxidizing and complexing compound |
| 01/04/2007 | US20070000871 Floor-etching solution |
| 01/02/2007 | US7157415 Post etch cleaning composition for dual damascene system |
| 12/28/2006 | US20060292888 Etchant, method for fabricating interconnection line using the etchant, and method for fabricating thin film transistor substrate using the etchant |
| 12/28/2006 | US20060289826 Hazardous substance decomposer and process for producing the same |
| 12/28/2006 | US20060289388 Forming indentations on a chromium alloy implant by etching with a methanol-free fluid, preferably containing hydrohalic acid, an oxidant and a chloride salt, and incubating at 10-100 degrees C.; enhances adhesion of coatings or cells, improves retention of proteins, and encourages bone in-growth |
| 12/28/2006 | US20060289387 Non-aqueous lapping composition and method using same |
| 12/28/2006 | US20060289386 Etchant, method of etching, laminate formed thereby, and device |
| 12/28/2006 | US20060289383 dielectrics, semiconductors; liquid crystal displays; photoresists |
| 12/27/2006 | EP1735825A2 Highly selective silicon oxide etching compositions |
| 12/27/2006 | CN1884214A Antiskid polished tiles |
| 12/26/2006 | US7153449 Acidic treatment liquid and method of treating copper surfaces |
| 12/26/2006 | US7153445 Hydrogen peroxide, a pH adjuster, a topography modifier, and a uniformity enhancer, and free of halogen ions. |
| 12/20/2006 | CN1883012A 功能性糊 Functional paste |
| 12/20/2006 | CN1291462C Slurry for chemical-mechanical polishing method and system and its use |
| 12/19/2006 | US7151058 Etchant for etching nitride and method for removing a nitride layer using the same |
| 12/14/2006 | WO2006119249A3 Aerogels and methods of using the same for chemical mechanical planarization and for extracting metal ions |
| 12/14/2006 | US20060278614 Polishing composition and method for defect improvement by reduced particle stiction on copper surface |
| 12/13/2006 | CN1290164C Ruthenium silicide wet etch |
| 12/12/2006 | US7148147 Composition for polishing substrates for semiconductors or abrasives and reduction agents or oxidizers |
| 12/12/2006 | US7147798 For etching an aluminum surface in the presence of solder bumps, containing phosphoric acid, nitric acid, acetic acid, an amine oxide surfactant, a Pb solubilizing additive, and deionized water; solder bumps are phosphate-free after etching. |
| 12/07/2006 | US20060276041 Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion |
| 12/06/2006 | CN1288722C Chemical and mechanical polishing size and chemical and mechanical polishing method using said size |
| 12/05/2006 | US7144817 For forming an opening in resin layer (polyimide) on the surface of a metal wiring of a flexible wiring board without toxic solvent |
| 12/05/2006 | US7144815 Chemical mechanical polishing slurry |
| 11/30/2006 | US20060270235 Dihydroxy enol compounds used in chemical mechanical polishing compositions having metal ion oxidizers |
| 11/30/2006 | US20060270232 Copper foil surface treatment step of forming an oxide film on surface of copper foil, a laser via machining step, an alkali treatment step, a molten and scattered copper etching step, a de-smearing treatment after the molten and scattered copper etching |
| 11/30/2006 | US20060266977 Use of dispersants to improve the retention of fluidity of concrete |
| 11/28/2006 | US7141180 Etchant for wire, method of manufacturing wire using etchant, thin film transistor array panel including wire and manufacturing method thereof |
| 11/23/2006 | US20060261306 Efficient polishing rate, excellent selectivity and good surface quality; composite particles of nonpolymeric organic component melamine or a melamine derivative and chemical component different from nonpolymeric organic component |
| 11/23/2006 | US20060261041 Method for manufacturing metal line contact plug of semiconductor device |
| 11/23/2006 | US20060261040 Methods for planarization of group VIII metal-containing surfaces using oxidizing agents |
| 11/22/2006 | CN1865348A Halogen-free flame-proof solvent-free insulated impregnating resin product and its preparation method |
| 11/22/2006 | CN1865314A Preparation method of vacuum pressurized impregnating epoxy resin |