| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 04/13/2005 | CN1196807C Wet chemical prepn process of leadless functional barium titanate ceramic film |
| 04/07/2005 | WO2005031035A2 Method for producing thin semiconductor films by deposition from solution |
| 04/07/2005 | WO2005031034A1 Organotitaniuim precursors, method for their preparation and method of producing material and/or composite material using the same |
| 04/07/2005 | WO2004075248A3 Surface-coating method, production of microelectronic interconnections using said method and integrated circuits |
| 04/07/2005 | WO2004034417A3 Enhanced field emission from carbon nanotubes mixed with particles |
| 04/07/2005 | US20050074559 Plating apparatus and method |
| 04/07/2005 | US20050073047 Conductive sheet having metal layer formed on at least a portion of surface of insulating substrate, product using the same, and manufacturing method thereof |
| 04/07/2005 | US20050072667 Apparatus and method for electrolytically treating chemical plating waste liquor |
| 04/07/2005 | US20050072526 Heating apparatus to heat wafers using water and plate with turbolators |
| 04/07/2005 | US20050072525 Apparatus to improve wafer temperature uniformity for face-up wet processing |
| 04/07/2005 | US20050072358 Substrate processing apparatus and substrate processing method |
| 04/07/2005 | DE10342138A1 Coating an apparatus made from high-grade steel used in a chemical installation comprises pickling surfaces to be coated using an activator, removing the activator using an inert medium and directly coating the surfaces |
| 04/06/2005 | EP1520872A1 Single layered, oriented, with electromagnetic radiation patternable foil made of thermoplastic polyester for the production of selectively metallized foils |
| 04/06/2005 | EP1520060A2 Metallisation |
| 04/06/2005 | CN1195891C Electroless gold plating solution and method for electroless gold plating |
| 04/06/2005 | CN1195890C Chemical solution for forming silverskin and method for forming silverskin with the same chemical solution |
| 04/06/2005 | CN1195889C Electroless copper plating solution and method for electroless copper plating |
| 04/06/2005 | CN1195888C Conductor track structures arranged on nonconductive material, espectially fine conductor track structure, and method for producing the same |
| 04/05/2005 | US6875952 Substrate having repaired metallic pattern and method and device for repairing metallic pattern on substrate |
| 04/05/2005 | US6875691 Temperature control sequence of electroless plating baths |
| 04/05/2005 | US6875661 Solution deposition of chalcogenide films |
| 04/05/2005 | US6875475 Methods for producing submicron metal line and island arrays |
| 04/05/2005 | US6875474 Plating using hypophosphite as reducing agent |
| 04/05/2005 | US6875334 Immersing surface selected from magnesium, titanium, aluminum, berrylium or their alloys in an anodizing solution containing hydroxylamine, phosphate, nonioinc surfactant and alkali metal hydroxide; passing a current between surface and cathode |
| 04/05/2005 | US6875260 Copper activator solution and method for semiconductor seed layer enhancement |
| 03/31/2005 | WO2005028705A1 Apparatus and method of detecting the electroless deposition endpoint |
| 03/31/2005 | US20050069689 A multilayer, monoaxially polyester film of thickness 5-500 mu m including a metal compound which on irradiation with electromagnetic radiation liberates a metal within a layer; elasticity modulus longitudinally and/or transverse of > 500 N/mm2; printed circuit boards; ribbon cables; smart cards; labels |
| 03/31/2005 | US20050069688 Single-layer, oriented thermoplastic polyester film capable of structuring by means of electromagnetic radiation, for producing selectively metallized films |
| 03/31/2005 | US20050069647 Applying Pt(acetylacetonate)2 onto a nonmetal, matal or alloy substrate, wrapping substrate with a metal foil; heating substrate and foil, wherein Pt(acetylacetonate)2 decomposes to deposit pure platinum on the substrate |
| 03/31/2005 | US20050069646 Forming a protective film which selectively covers the surfaces of embedded interconnects by pretreatment of interconnects with a surface activating agent and excessive etch inhibitor followed by electroless plating; enhanced reliability of the interconnects and increased throughput |
| 03/31/2005 | US20050069645 Method of electrolytically depositing materials in a pattern directed by surfactant distribution |
| 03/31/2005 | US20050069629 Method for coating a substrate with calcuim phosphate |
| 03/31/2005 | US20050067288 Barrier separates inlet/outlet area, as inlet lines terminate closely beneath liquid surface; plating tool/reactor |
| 03/30/2005 | EP1519630A1 Heater for cooking apparatus or the like |
| 03/30/2005 | EP1518942A1 Platinum coating process |
| 03/30/2005 | EP1518886A1 Multi layered, oriented, with electromagnetic radiation patternable foil made of thermoplastic polyester for the production of selectively metallized foils |
| 03/30/2005 | EP1518885A1 Oriented, with electromagnetic radiation patternable and aminosilane coated foil made of thermoplastic polyester for the production of selectively metallized foils |
| 03/30/2005 | EP1518635A1 Sn-Ag BASED LEAD-FREE SOLDER |
| 03/30/2005 | CN1602314A Copper deposition method using copper formate complexes |
| 03/30/2005 | CN1600899A Complex additive for chemical nickel plating |
| 03/30/2005 | CN1195099C Pretreating agent for metal plating, and method for metal plating using same |
| 03/24/2005 | WO2005027199A2 Nanodisk sensor and sensor array |
| 03/24/2005 | WO2005026414A1 Procedure for finish of objects made of aluminium alloys and bath of treatment for accomplish the procedure |
| 03/24/2005 | WO2005026219A1 Novel saccharide-graft polymers and the use thereof for screening processes. |
| 03/24/2005 | WO2005000743A3 Molybdenum doped alumina garnets |
| 03/24/2005 | WO2003096859A3 Method for producing galvanised sanitary objects made of plastic |
| 03/24/2005 | US20050064711 Oriented, aminosilane-coated film capable of structuring by means of electromagnetic radiation and composed of thermoplastic polyester for the production of selectively metallized films |
| 03/24/2005 | US20050064703 Substrate processing method |
| 03/24/2005 | DE102004026746A1 Production of a thin film or powder array by liquid source misted chemical deposition comprises producing two or more types of metal precursor liquids; producing droplets; depositing the droplets on a substrate; and thermo-processing |
| 03/23/2005 | EP1516519A1 Metallised parts made from plastic material |
| 03/23/2005 | EP1440185A4 Platable engineered polyolefin alloys |
| 03/23/2005 | CN1599950A Method for defining a source and a drain and a gap inbetween |
| 03/23/2005 | CN1598053A Plating solution of magnesium alloy nickle sulfate main salt and technology of chemical plating thereof |
| 03/23/2005 | CN1598052A Magnesium alloy chemical plating nickle solution and its plating method |
| 03/23/2005 | CN1598051A Process for selective or complete inertisation of workpieces and system parts by means of non-reactive platings |
| 03/23/2005 | CN1194117C Organocuprous precursors for chemical vapor deposition of copper film |
| 03/22/2005 | US6869875 Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process |
| 03/22/2005 | US6869637 Copper inhibitors additionally permit to positively influence the appearance of the surface by leveling the layer of copper that had been roughened by the etching process |
| 03/22/2005 | US6869510 Methods and apparatus for processing the surface of a microelectronic workpiece |
| 03/17/2005 | WO2005023704A1 Process for producing composite microparticle, composite microparticle production apparatus and composite microparticle |
| 03/17/2005 | US20050058951 photolithography technique to form an organic mono-molecular film pattern, then thin film is selectively grown on the organic monomolecular film pattern, transcribed onto a second substrate to form a micro pattern made of the thin film on the second substrate |
| 03/17/2005 | DE10336128A1 Heat-sensitive element for IR detectors comprises a flat pyroelectric with electrodes made from a ferromagnetic conducting metal oxide arranged on both side surfaces |
| 03/17/2005 | DE10328857B3 Hülse zum Transport eines Tonergemischs und Verfahren zum Herstellen einer solchen Hülse Sleeve for transporting a toner mixture and method of making such a sleeve |
| 03/16/2005 | EP1513968A1 Components for electrical connectors, and metal strip therefore |
| 03/16/2005 | EP1513965A1 Process for metallising support media made from plastic material |
| 03/16/2005 | EP1343921B1 Method for electroless nickel plating |
| 03/16/2005 | EP1268880B1 Process for the direct metal-plating of a plastic substrate |
| 03/15/2005 | US6867374 Ceramic insulation coated electric wire self-fusing ceramic insulation coated electric wire coating composition and coil and voices coil for speaker |
| 03/15/2005 | CA2148955C Forming a silver coating on a vitreous substrate |
| 03/10/2005 | WO2005021464A1 Improvements to coated articles |
| 03/10/2005 | WO2005008803A3 Semiconductor component, and method for the production thereof |
| 03/10/2005 | WO2004099459A3 Enhanced metal ion release rate for anti-microbial applications |
| 03/10/2005 | WO2004068918A3 Method for producing thin silver layers |
| 03/10/2005 | US20050053772 Electrophotography; transferring visible images |
| 03/10/2005 | US20050052326 Process for producing a metal layer on a substrate body, and substrate body having a metal layer |
| 03/09/2005 | EP1512173A1 Wafer level electroless copper metallization and bumping process, and plating solutions for semiconductor wafer and microchip |
| 03/09/2005 | EP1511882A1 Acidic solution for silver deposition and method for silver layer deposition on metal surfaces |
| 03/09/2005 | CN1592799A Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions |
| 03/09/2005 | CN1592674A Honeycomb structural body forming ferrule, and method of manufacturing ferrule |
| 03/09/2005 | CN1592528A Conductive film pattern forming method, electrooptical apparatus and electronic apparatus |
| 03/09/2005 | CN1590586A High temperature corrusion and high temperature abrasion resistant new technology process of oil pump cylinder plunger pump valve |
| 03/09/2005 | CN1192125C Process for non-tin plating of copper or copper alloys |
| 03/08/2005 | US6864146 Metal oxide integrated circuit on silicon germanium substrate |
| 03/08/2005 | US6863936 Applying a strippable coating to the substrate, selective laser ablation to activate an underlying region of the substrate surface, immersing in solution of seeding particles to adhere them to activated region, plating; printed circuits |
| 03/03/2005 | WO2005018688A1 Sanitary hose with an antimicrobial finish |
| 03/03/2005 | WO2004111287A3 Electroless gold plating solution |
| 03/03/2005 | US20050048773 Semiconductor process and composition for forming a barrier material overlying copper |
| 03/03/2005 | US20050048210 electroless deposition of metal onto flexibel polyimide substrates, by applying solution comprising a metal source, reducing agents, buffers and an aromatic sulfonic acid, to fomr metal layers having good bonding strength and smoothness |
| 03/03/2005 | US20050048205 Method of producing thin film or powder array using liquid source misted chemical deposition process |
| 03/03/2005 | US20050046664 Direct writeTM system |
| 03/03/2005 | US20050045484 Forming multilayer three dimensional microstructures; improving seed layer application and/or removal |
| 03/02/2005 | CN1191621C Method for producing conductor with high threshold electromigration and its structure |
| 03/01/2005 | US6861097 Electroless plating processes |
| 03/01/2005 | US6860944 Microelectronic fabrication system components and method for processing a wafer using such components |
| 03/01/2005 | US6860933 Process for depositing layers of zirconium oxide using soluble powders |
| 03/01/2005 | US6860925 For tarnish-resistant and solderable coating |
| 02/24/2005 | WO2005010233A3 Aqueous acidic immersion plating solutions and methods for plating on aluminum and aluminum alloys |
| 02/24/2005 | WO2004101855A3 Electrochemical fabrication methods including use of surface treatments to reduce overplating and/or planarization during formation of multi-layer three-dimensional structures |
| 02/24/2005 | WO2004099466A3 Method for electroless deposition of phosphorus-containing metal films onto copper with palladium-free activation |
| 02/24/2005 | WO2004005577A3 Substrates comprising a photocatalytic tio2 layer |