| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 09/22/2004 | CN1167829C Method for metallizing surface of solid polymer substrate and the product obtd. |
| 09/21/2004 | US6794315 Ultrathin oxide films on semiconductors |
| 09/21/2004 | US6794288 Method for electroless deposition of phosphorus-containing metal films onto copper with palladium-free activation |
| 09/21/2004 | US6793793 High reactability; reduced generation of liquid waste; eliminates electrode cleaning |
| 09/16/2004 | US20040180220 semiconducting materials based on metal oxides, especially titanium oxide, which are capable, under the effect of radiation of suitable wavelength, for initiating radical reactions causing the oxidation of organic substances |
| 09/16/2004 | US20040178178 for surface treatment of metals in economical and environmentally-friendly manners; grit blasting the metal with a mixture of fine particles of aluminum oxide in air and water |
| 09/15/2004 | EP1052225B1 Titanium oxide colloidal sol and process for the preparation thereof |
| 09/15/2004 | CN1529768A Substrate with photocatalytic coating |
| 09/15/2004 | CN1528714A Carbon, ceramic-nonmetallic material and metal material connection method |
| 09/15/2004 | CN1166812C Process for preparing surface plasma resonance response chip by wet chemical method |
| 09/14/2004 | US6790763 Substrate processing method |
| 09/14/2004 | US6790364 Process for stripping amine borane complex from an electroless plating solution |
| 09/14/2004 | US6790265 Aqueous alkaline zincate solutions and methods |
| 09/14/2004 | CA2167074C Method for metallising non-conductive substrates |
| 09/10/2004 | WO2004076724A1 SURFACE-TREATED Al SHEET EXCELLENT IN SOLDERABILITY, HEAT SINK USING THE SAME, AND METHOD FOR PRODUCING SURFACE-TREATED Al SHEET EXCELLENT IN SOLDERABILITY |
| 09/09/2004 | US20040175960 Ultrathin oxide films on semiconductors |
| 09/09/2004 | US20040175938 Method for metalizing wafers |
| 09/09/2004 | US20040175631 Nanometer-scale engineered structures, methods and apparatus for fabrication thereof, and applications to mask repair, enhancement, and fabrications |
| 09/09/2004 | US20040175509 Activation-free electroless solution for deposition of cobalt and method for deposition of cobalt capping/passivation layer on copper |
| 09/09/2004 | US20040173467 Immersing aluminum or aluminum alloy substrate in zincate solution comprising hydroxide, zinc, nickel, cobalt, iron, and/or copper ions; in presence of nitrogen and/or sulfur compound |
| 09/09/2004 | US20040173056 Silver plating method and articles made therefrom |
| 09/09/2004 | DE102004008875A1 Anorganisches Pulver und Verfahren zur Oberflächenbeschichtung Inorganic powder and process for the surface coating |
| 09/08/2004 | EP1455003A2 Coated cemented carbide insert |
| 09/08/2004 | EP1453988A2 Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions |
| 09/08/2004 | EP1363707A4 Narrow diameter needle having reduced inner diameter tip |
| 09/08/2004 | CN1527892A Method for producing plated molded product |
| 09/08/2004 | CN1527888A Electroless-plating solution and semiconductor device |
| 09/07/2004 | US6787286 Solvents and photoresist compositions for short wavelength imaging |
| 09/07/2004 | US6787198 Hydrothermal treatment of nanostructured films |
| 09/02/2004 | WO2004075248A2 Surface-coating method, production of microelectronic interconnections using said method and integrated circuits |
| 09/02/2004 | WO2004074544A1 Electroless nickel plating solution circulating system |
| 09/02/2004 | WO2004073890A1 Process for providing bond enhancement and an etch resist in the fabrication of printed circuit boards |
| 09/02/2004 | WO2004053182A3 Nodular nickel boron coating |
| 09/02/2004 | US20040171269 Substrate processing method |
| 09/02/2004 | US20040170849 For an underlying metal substrate of articles that operate at, or are exposed to, high temperatures |
| 09/02/2004 | US20040170846 Prepared through a wet treatment and carries tightly a metal-element-containing component or film on the surface of a resin base without having a catalyst layer, usually present when the metal film is formed through electroless plating |
| 09/02/2004 | US20040170766 Electroless plating method and device, and substrate processing method and apparatus |
| 09/02/2004 | US20040168914 Chemical plating method, electrolytic cell and automotive oxygen sensor using it |
| 09/02/2004 | DE102004005868A1 Kupferbadzusammensetzung zur stromlosen und/oder elektrolytischen Füllung von Durchkontaktierungen und Leiterbahnen bei der Herstellung von integrierten Schaltungen Kupferbadzusammensetzung for electroless and / or electrolytic filling of vias and conductive traces in the manufacture of integrated circuits |
| 09/01/2004 | EP1452619A1 Thin metal oxide film and process for producing the same |
| 09/01/2004 | EP1452078A1 Depositing solid materials |
| 09/01/2004 | EP1322798B1 Bath and method of electroless plating of silver on metal surfaces |
| 09/01/2004 | EP1018151B1 Process for fabricating layered superlattice materials and making electronic devices including same without exposure to oxygen |
| 09/01/2004 | CN1164793C Chemical preparation method of controllable metal nano conductor |
| 08/31/2004 | US6784543 Projection-like connection terminals |
| 08/31/2004 | US6784121 Integrated circuit dielectric and method |
| 08/31/2004 | US6783807 Coating of a metal-polymer dispersion layer with aid of plating bath; containers, chemical reactor walls, fittings, pumps, filters, compressors, centrifuges, columns, heat exchangers, dryers, comminuting machines, mixers and packings |
| 08/31/2004 | US6782650 Self lubricating firearm having at least one component coated with nodular nickel coating wherein the nodular nickel coating is an electroless deposited nickel boron coating |
| 08/31/2004 | CA2145870C Process for treating plastic surfaces and swelling solution |
| 08/26/2004 | WO2004072357A2 Fiber and sheet equipment wear surfaces of extended resistance and methods for their manufacture |
| 08/26/2004 | WO2004072324A1 Fabrication method and apparatus |
| 08/26/2004 | WO2004027837B1 Temperature-controlled substrate holder |
| 08/26/2004 | US20040166361 Surface coating of black platinum |
| 08/26/2004 | US20040166340 high temperature stability and structural integrity |
| 08/26/2004 | US20040164293 Method of making barrier layers |
| 08/26/2004 | US20040163252 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 08/26/2004 | DE10304668A1 Verfahren zur haftfesten, eine metallische Schicht umfassenden Beschichtung eines Substrats A process for firmly adhering a metallic layer coating comprising a substrate |
| 08/26/2004 | DE10053681B4 Gehäuse mit mindestens einem EMI abschirmender Kunststoffkörper bzw. Be- und Entlüftungselement und Verfahren zur Herstellung eines solchen Kunststoffkörpers Housing having at least one EMI shielding plastic body or ventilation element and method for manufacturing such a plastic body |
| 08/25/2004 | EP1449891A1 COATING COMPOUND FOR FORMING TITANIUM OXIDE FILM, METHOD FOR FORMING TITANIUM OXIDE FILM AND METAL SUBSTRATE COATED WITH TITANIUM OXIDE FILM |
| 08/25/2004 | EP1449241A1 Lanthanide series layered superlattice materials for integrated circuit applications |
| 08/25/2004 | EP1448725A2 Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
| 08/25/2004 | EP1088117B1 Method for depositing a metallic layer on a polymer surface of a workpiece |
| 08/25/2004 | CN1524292A Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing |
| 08/25/2004 | CN1524132A Regeneration method for a plating solution |
| 08/25/2004 | CN1524107A Pre-treatment of plastic materials |
| 08/24/2004 | US6780467 Plating pretreatment agent and metal plating method using the same |
| 08/24/2004 | US6780456 Electrons produced by oxidation of reducing agent are supplied to the electrode to form the desired metal only on the surface of the electrode, there by forming electroless plating film |
| 08/24/2004 | US6780245 Method and apparatus of producing thin film of metal or metal compound |
| 08/19/2004 | WO2004069948A2 Method for adhesively coating a substrate with a metal layer |
| 08/19/2004 | WO2004058863A3 Surface treatment of polyacetal articles |
| 08/19/2004 | WO2004055246A8 Copper electrolytic solution and electrolytic copper foil produced therewith |
| 08/19/2004 | WO2003038147A3 High resolution patterning method |
| 08/19/2004 | WO2003014416A3 Plating device and method |
| 08/19/2004 | US20040161608 Overcoating inorganic compound with metal oxide; uniform thickness; nickel electrode overcoated with titanium oxide |
| 08/19/2004 | US20040161529 Electroless plating apparatus and method |
| 08/19/2004 | US20040159553 Semiconductor manufacturing apparatus and method for manufacturing semiconductor devices |
| 08/19/2004 | US20040159550 plating in fine channels or in opening portions in a resist formed on a substrate surface after deaerating dissolved gas in the plating solution without needing to add a surface active agent |
| 08/18/2004 | EP1447846A2 Socket and method for connecting electronic components |
| 08/18/2004 | EP1447381A2 Nanoporous alumina products and process for their preparation |
| 08/18/2004 | EP1295337A4 Process for the manufacture of printed circuit boards with plated resistors |
| 08/17/2004 | US6778406 Resilient contact structures for interconnecting electronic devices |
| 08/17/2004 | US6778316 Nanoparticle-based all-optical sensors |
| 08/17/2004 | US6777094 Overcoating with organosilicon compounds; hydrolysis; contacting |
| 08/17/2004 | US6777036 Method for the deposition of materials from mesomorphous films |
| 08/17/2004 | US6776828 Electroless gold plating composition comprising one or more water soluble gold compounds, one or more gold complexing agents, one or more organic stabilizer compounds, and one or more uniformity enhancers |
| 08/17/2004 | US6776827 Method and solution for treating fluorocarbon surfaces |
| 08/17/2004 | US6776826 Composition for coating surface of non-conductive substrate which is to be plated with metal, including binding solution, carbon black powder, and aluminum powder |
| 08/12/2004 | WO2004068918A2 Method for producing thin silver layers |
| 08/12/2004 | WO2004068389A2 Method of forming a conductive metal region on a substrate |
| 08/12/2004 | WO2004067192A1 Electroless plating solution and process |
| 08/12/2004 | US20040157440 Using stabilizers in electroless solutions to inhibit plating of fuses |
| 08/12/2004 | US20040154929 Electroless copper plating of electronic device components |
| 08/12/2004 | US20040154917 Cup-shaped plating apparatus |
| 08/12/2004 | US20040154535 Modular electrochemical processing system |
| 08/11/2004 | EP1445353A1 Method and device for surface treatment of treated object |
| 08/11/2004 | EP1445347A1 Method of plating nonconductor product |
| 08/11/2004 | CN1161493C Metal plating liquid and its preparing process |
| 08/10/2004 | US6774088 Rare earth-Ba-Cu complex composition and method of producing superconductor using same |
| 08/10/2004 | US6774049 Electroless deposition of doped noble metals and noble metal alloys |
| 08/10/2004 | US6774034 Organometallic precursor for forming metal pattern and method of forming metal pattern using the same |