Patents
Sitemap › B81 - Micro-structural technology › B81B - Micro-structural devices or systems, e.g. micro-mechanical devices › B81B 7 - Micro-structural systems
Patents for B81B 7 - Micro-structural systems (8,983)
12/2014
12/24/2014CN104229720A 芯片布置及用于制造芯片布置的方法 Chip layout and method for manufacturing the chip layout
12/24/2014CN104229719A 具有原子蒸气腔室的mems器件及其形成方法 Mems devices with atomic vapor chamber and forming method
12/24/2014CN103403557B 铁磁流体中目标物质的微流处理 Ferrofluid target substance in microfluidic processing
12/24/2014CN102356324B 垂直集成的mems加速度变换器 Mems vertically integrated acceleration transducer
12/24/2014CN102257374B 传感器装置和用于制造传感器装置的方法 Sensor apparatus and method for manufacturing a sensor device
12/24/2014CN102190276B 微机电器件及其封装制作工艺 MEMS devices and packaging production process
12/23/2014US8916943 MEMS devices having a plurality of cavities
12/23/2014US8916408 Leadframe-based premolded package having air channel for microelectromechanical system (MEMS) device
12/18/2014US20140367809 Viristor In Base For MEMS Microphones
12/18/2014US20140367806 Functional element, electronic apparatus, and moving object
12/17/2014CN204022464U 三维mems封装结构 Three-dimensional packaging structure mems
12/17/2014CN104220840A 具有中心悬吊件和环架结构的微机电系统(mems)多轴陀螺仪 Has a central suspension parts and micro-electromechanical systems ring frame structure (mems) multi-axis gyroscope
12/16/2014US8912638 Semiconductor device with hollow structure
12/16/2014US8912620 Getter structure with optimized pumping capacity
12/11/2014US20140361388 Capacitive sensing structure with embedded acoustic channels
12/11/2014US20140361387 Chip arrangement and method for manufacturing a chip arrangement
12/11/2014US20140360246 Micro-electro-mechanical-system resonant sensor and method of controlling the same
12/10/2014CN204008681U Mems加速度传感器的硅盖帽结构 Mems cap structure silicon accelerometer
12/10/2014CN204008531U 一种具有绝热沟槽的mems气体传感器 Adiabatic trench having a gas sensor mems
12/10/2014CN204007944U 微机电传感器 MEMS sensors
12/10/2014CN203998938U 晶圆封装设备 Wafer Packaging Equipment
12/10/2014CN203998937U 一种mems硅基微热板 One kind of silicon mems micro-hotplate
12/10/2014CN203998936U Mems器件 Mems devices
12/10/2014CN203998935U 基于薄膜体声波谐振器的mems红外传感器 Based on the thin film bulk acoustic wave resonator infrared sensor mems
12/10/2014CN104197920A 上下贯通支撑的半球谐振微陀螺 Down through the support of micro-hemispherical resonator gyro
12/10/2014CN104197917A 一种压电驱动和检测的微型半球谐振陀螺仪及其制备方法 Miniature hemispherical resonator gyro and its preparation method and detection piezoelectric drive
12/10/2014CN104192790A 一种mems器件热应力隔离结构 One kind of thermal stress mems device isolation structure
12/10/2014CN102629601B 粘接的晶圆片堆叠和电镀粘接的晶圆片堆叠的方法 Wafers stacked wafer bonding method stacking and bonding plating
12/10/2014CN102627252B 用于沟道填充的新型沟道隔离槽 For the new channel filled trench isolation groove
12/10/2014CN102616729B 一种基于soi硅片的窄沟道隔离槽刻蚀至氧化层的检测结构及检测方法 A narrow trench isolation groove is etched silicon based soi detection structure and detection method of the oxide layer
12/10/2014CN102246299B 用于制作通路互连的方法 The method for making the interconnection path
12/10/2014CN101898744B 增强抑制加速度噪声的微机电陀螺仪 Enhanced noise suppression MEMS accelerometer gyroscope
12/09/2014US8907465 Methods and devices for packaging integrated circuits
12/09/2014US8906750 Method of encapsulation of a microcomponent
12/04/2014US20140353777 Electrical device including a functional element in a cavity
12/04/2014US20140353775 Wafer-level packaging of integrated devices, and manufacturing method thereof
12/04/2014US20140352400 Transducer-including devices, and methods and apparatus for their calibration
12/02/2014US8902604 Component support and assembly having a MEMS component on such a component support
12/02/2014US8901679 Micromechanical structure, in particular sensor arrangement, and corresponding operating method
12/02/2014US8900931 In-situ cavity integrated circuit package
11/2014
11/27/2014US20140349078 Aerogel-based mold for mems fabrication and formation thereof
11/27/2014US20140346658 Fabricating a microelectronics lid using sol-gel processing
11/27/2014US20140346657 Thin film capping
11/27/2014US20140346643 Integrated bondline spacers for wafer level packaged circuit devices
11/27/2014US20140346622 Forming Semiconductor Structure with Device Layers and TRL
11/20/2014US20140339953 Mems resonator active temperature compensation method and thermally-actuated mems resonator
11/20/2014US20140339688 Techniques for the cancellation of chip scale packaging parasitic losses
11/20/2014US20140339656 Mems pressure transducer assembly
11/20/2014US20140339655 Mems package structure
11/20/2014US20140338460 Micromechanical component, manufacturing method for a micromechanical component and method for mounting a micromechanical component
11/18/2014US8891149 Microelectromechanical system (MEMS) devices with dielectric microstructure motion stopper
11/18/2014US8890631 MEMS oscillator and manufacturing method thereof
11/18/2014US8890286 Vertically integrated systems
11/18/2014US8890285 Vertically integrated systems
11/18/2014US8890283 Wafer with recessed plug
11/18/2014US8890265 Semiconductor device and microphone
11/18/2014US8887527 Foaming process for preparing wafer-level glass micro-cavities
11/13/2014US20140332945 Method of Etching a Wafer
11/11/2014US8884474 Method of fabricating a micro machine
11/11/2014US8884384 Micromachine and method for manufacturing the same
11/11/2014US8884165 Packaging device and base member for packaging
11/11/2014US8881370 Method of fabricating an inertial sensor
11/06/2014US20140327154 Micromechanical component and method for producing a micromechancal component having a thin-layer cap
11/04/2014US8878357 Electronic component device, method of manufacturing the same and wiring substrate
11/04/2014US8878314 MEMS package or sensor package with intra-cap electrical via and method thereof
10/2014
10/30/2014US20140322489 Microfabricated elastomeric valve and pump systems
10/30/2014US20140319631 MEMS Integrated Pressure Sensor Devices having Isotropic Cavities and Methods of Forming Same
10/30/2014US20140319627 Chip package and a method of manufacturing the same
10/28/2014US8873174 Mounting flexure contacts
10/28/2014US8871606 Microelectromechanical device packaging with an anchored cap and its manufacture
10/28/2014US8871551 Wafer encapsulated microelectromechanical structure and method of manufacturing same
10/23/2014US20140312734 Vibrator, oscillator, electronic device, moving object, and method of manufacturing vibrator
10/23/2014US20140312439 Microphone Module and Method of Manufacturing Thereof
10/23/2014US20140312438 Physical quantity sensor, electronic apparatus, and moving object
10/21/2014US8866241 Pressure sensing device having contacts opposite a membrane
10/21/2014US8866238 Hybrid integrated component and method for the manufacture thereof
10/21/2014US8866236 Package structure having MEMS element
10/16/2014US20140307361 Varactor and varactor system
10/16/2014US20140306312 MEMS Sensor Packaging and Method Thereof
10/14/2014US8861218 Device containing plurality of smaller MEMS devices in place of a larger MEMS device
10/14/2014US8861062 MEMS device and methods for manufacturing and using same
10/09/2014WO2014165621A2 Two-state charge-pump control-loop for mems dvc control
10/09/2014WO2014165483A1 Self-calibrating pressure sensor system with pressure sensor and reference sensor that share common sealed chamber
10/09/2014WO2014165373A1 Microfluidic products with controlled fluid flow
10/09/2014US20140300249 Mems device anchoring
10/09/2014DE102013213071B3 Herstellungsverfahren für ein mikromechanisches Bauteil Manufacturing method for a micromechanical component
10/09/2014DE102013205158A1 Mikromechanische Sensorvorrichtung und entsprechendes Betriebsverfahren Micromechanical sensor device and corresponding operating method
10/08/2014EP2786193A2 Mems scanning micromirror
10/08/2014EP2785521A1 Method for producing structured optical components
10/07/2014US8854830 Semiconductor package substrate in particular for MEMS devices
10/07/2014US8853845 Component with encapsulated active element and implantable medical advice incorporating such a component
10/07/2014US8853804 Tilting actuator with close-gap electrodes
10/07/2014US8853799 Vertically integrated systems
10/02/2014WO2014159957A1 Methods of forming buried microelectricomechanical structures coupled with device substrates and structures formed thereby
10/02/2014WO2014159946A1 Mems device having a getter
10/02/2014WO2014159583A1 Portable device with temperature sensing
10/02/2014WO2014159552A1 Mems acoustic transducer with silicon nitride backplate and silicon sacrificial layer
10/02/2014WO2014155343A1 Peristaltic pump microfluidic separator
10/02/2014US20140295122 Method for wafer-level manufacturing of objects and corresponding semi-finished products
10/02/2014US20140291784 Mems apparatus with increased back volume
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