Patents for B81B 7 - Micro-structural systems (8,983)
10/2014
10/02/2014US20140291783 Cover for a mems microphone
10/02/2014US20140291782 Methods and devices for packaging integrated circuits
10/02/2014US20140291781 Method of packaging a mems transducer device and packaged mems transducer device
10/02/2014DE102014104171A1 Halbleiterbauelemente und Verfahren zum Herstellen von Halbleiterbauelementen Semiconductor devices and methods of manufacturing of semiconductor devices
10/01/2014EP2782867A1 Chip with a micro-electromechanical structure and covering element, and a method for the production of same
09/2014
09/30/2014US8848392 Co-support module and microelectronic assembly
09/30/2014US8847340 Packaged sensor structure having sensor opening and package opening aligned with sensor element
09/30/2014US8846521 Method for manufacturing an electronic component package and electronic component package
09/25/2014WO2014150798A1 Interface for microfluidic chip
09/25/2014US20140285060 Electrical component and method of manufacturing the same
09/25/2014US20140284729 Electrical component and method of manufacturing the same
09/25/2014US20140283604 Three-dimensional microelectromechanical systems structure
09/25/2014DE102013204811A1 Sensorvorrichtung zum Sensieren eines Gases, Verfahren zum Betreiben einer Sensorvorrichtung zum Sensieren eines Gases und Herstellungsverfahren für eine Sensorvorrichtung zum Sensieren eines Gases Sensor device for sensing a gas, A method of operating a sensor device for sensing a gas and manufacturing method for a sensor device for sensing a gas
09/25/2014DE102013204804A1 Sensorvorrichtung und Verfahren zum Herstellen einer Sensorvorrichtung Sensor device and method of manufacturing a sensor device
09/25/2014DE102013204763A1 Mikromechanische Sensorvorrichtung und entsprechendes Herstellungsverfahren Micromechanical sensor device and corresponding manufacturing method
09/23/2014CA2584145C Piano mems with hidden hinge
09/18/2014WO2014145882A1 Methods of manufacture of engineered materials and devices
09/18/2014WO2014145752A1 Enhanced microfluidic valves for media diagnostics
09/18/2014WO2014145646A1 Actuator plate partitioning and control devices and methods
09/18/2014WO2014142910A1 Nanowire-based mechanical switching device
09/18/2014WO2014142794A1 Mems scanning mirror field of view provision methods and apparatus
09/18/2014US20140268300 Packages of MEMS
09/18/2014US20140268275 Display apparatus incorporating an interconnect-supporting elevated aperture layer
09/18/2014US20140266246 Mcu-based compensation and calibration for mems devices
09/18/2014US20140266170 Magnetometer using magnetic materials on accelerometer
09/18/2014US20140264909 Microelectromechanical system devices having through substrate vias and methods for the fabrication thereof
09/18/2014US20140264900 Anisotropic conductor and method of fabrication thereof
09/18/2014US20140264661 MEMS Devices and Methods for Forming Same
09/18/2014US20140264659 Transportation device having a monolithically integrated multi-sensor device on a semiconductor substrate and method therefor
09/18/2014US20140264656 Mems acoustic sensor with integrated back cavity
09/18/2014US20140264654 Microphone package with integrated substrate
09/18/2014US20140264649 Micromechanical structure and corresponding production process
09/18/2014US20140264643 Methods of forming buried electromechanical structures coupled with device substrates and structures formed thereby
09/18/2014US20140264475 Mems device structure with a capping structure
09/18/2014US20140262838 Microelectrochemical Sensor and Method for Operating a Microelectrochemical Sensor
09/18/2014US20140260704 Device and system for integrated sensor system (iss)
09/18/2014US20140260616 Mems device having variable gap width and method of manufacture
09/18/2014DE102014204712A1 MEMS-Akustikwandler, MEMS-Mikrofon, MEMS-Mikrolautsprecher, Lautsprecher-Array und Verfahren zur Herstellung eines Akustikwandlers MEMS-acoustic transducer, the MEMS microphone, MEMS micro-speaker, the speaker array and methods for producing an acoustic transducer
09/18/2014DE102014103389A1 Mikroelektromechanische Resonatoren Microelectromechanical resonators
09/18/2014DE102014103341A1 Halbleiterbauelemente und Verfahren zu ihrer Bildung Semiconductor devices and methods for their formation
09/18/2014DE102013204665A1 Mikroelektrochemischer Sensor und Verfahren zum Betreiben eines mikro-elektrochemischen Sensors The micro-electro chemical sensor and method for operating a micro-electro-chemical sensor
09/18/2014DE102013204234A1 Sensor und Verfahren zum Herstellen einer Lötverbindung zwischen einem Sensor und einer Leiterplatte Sensor and method for forming a solder connection between a sensor and a printed circuit board
09/17/2014EP2778120A1 Mems sensor packaging and method thereof
09/17/2014EP2778119A2 Sensor and method for the production of a flexible soldered joint between a sensor and a printed circuit board
09/17/2014EP2776849A1 Apparatus and method for measuring phase behavior
09/16/2014US8836099 Leadless package housing having a symmetrical construction with deformation compensation
09/14/2014CA2844780A1 Fully differential capacitive architecture for mems accelerometer
09/14/2014CA2844685A1 Force feedback electrodes in mems accelerometer
09/11/2014US20140253219 Compensation of changes in mems capacitive transduction
09/11/2014US20140252510 Signal boosting apparatus and method of boosting signals
09/11/2014US20140252507 Self-sealing membrane for mems devices
09/11/2014US20140252422 Cavity structures for mems devices
09/11/2014US20140250969 Spread-Spectrum MEMS Self-Test System and Method
09/11/2014DE102013102213A1 Miniaturisiertes Bauelement und Verfahren zur Herstellung Miniaturized device and method for producing
09/11/2014DE102013102210A1 Zur Minaturisierung geeignetes elektrisches Bauelement mit verringerter Verkopplung To miniaturization suitable electrical component with reduced coupling
09/10/2014EP2773586A2 Micromechanical element, component having a micromechanical element, and method for producing a component
09/09/2014US8829629 Capacitance type sensor
09/09/2014US8829627 Dynamic quantity sensor device and manufacturing method of the same
09/09/2014US8826734 Inertial force sensor
09/04/2014WO2014134228A1 Multiplex chemotyping microarray (mcm) system and methods
09/04/2014US20140246740 Implantation of gaseous chemicals into cavities formed in intermediate dielectrics layers for subsequent thermal diffusion release
09/04/2014US20140246739 Top Port MEMS Cavity Package and Method of Manufacture Thereof
09/04/2014US20140246738 Top Port MEMS Cavity Package and Method of Manufacture Thereof
09/04/2014US20140246708 MEMS Structures and Methods of Forming the Same
09/04/2014DE102010061340B4 Mehrkomponentenspritzgusssystem und Verfahren zu dessen Herstellung Multi-component injection molding system and process for its preparation
09/03/2014EP2770904A1 Apparatus, system and methods for measuring a blood pressure gradient
08/2014
08/28/2014WO2014130135A1 Capacitive micromachined ultrasound transducers with pressurized cavities
08/28/2014WO2014130047A1 Component assembly using a temporary attach material
08/28/2014US20140240944 Insulating low signal loss substrate, integrated circuits including a non-silicon substrate and methods of manufacture of integrated circuits
08/28/2014US20140239421 Surface charge mitigation layer for mems sensors
08/28/2014US20140239353 Method for mems structure with dual-level structural layer and acoustic port
08/28/2014DE112013000341T5 Hybride Hochfrequenzkomponente A hybrid high-frequency component
08/28/2014DE102013101051B4 Plasmazelle und Verfahren zur Herstellung einer Plasmazelle Plasma cell and method of manufacturing a plasma cell
08/27/2014EP2769957A2 Vacuum sealed semiconductor device and method of manufacturing the same
08/27/2014EP2769956A1 Circuit board comprising spatial light modulator
08/27/2014EP2768767A1 Stacked vias for vertical integration
08/26/2014US8816453 MEMS component and a semiconductor component in a common housing having at least one access opening
08/21/2014US20140232241 Piezoelectric array employing integrated mems switches
08/21/2014US20140231986 Through substrate via (tsuv) structures and method of making the same
08/21/2014US20140231979 Stacked assembly of a mems integrated device having a reduced thickness
08/21/2014US20140231938 Micro-electro-mechanical device with buried conductive regions, and manufacturing process thereof
08/21/2014US20140231937 Method for manufacturing a protective layer against hf etching, semiconductor device provided with the protective layer and method for manufacturing the semiconductor device
08/21/2014US20140231936 Micro-electro-mechanical system (mems) and related actuator bumps, methods of manufacture and design structures
08/21/2014US20140231934 Electrical component and method of manufacturing the same
08/21/2014US20140230546 Microelectromechanical device with signal routing through a protective cap
08/21/2014DE102014101448A1 Beschleunigungsaufnehmer mit niedriger Empfindlichkeit gegenüber thermomechanischer Spannung Accelerometer with low sensitivity to thermo-mechanical stress
08/19/2014US8810110 Micro-mechanical component with cantilever integrated electrical functional element
08/19/2014US8809784 Incident radiation detector packaging
08/19/2014US8809135 MEMS device and interposer and method for integrating MEMS device and interposer
08/14/2014US20140225759 Micro-electro-mechanical systems (mems), systems, and operating methods thereof
08/14/2014US20140225250 Methods and systems for fabrication of low-profile mems cmos devices
08/14/2014US20140225206 Pressure level adjustment in a cavity of a semiconductor die
08/14/2014US20140225203 Packages and methods for packaging mems microphone devices
08/14/2014US20140224018 MEMS Force Sensors Fabricated Using Paper Substrates
08/14/2014DE112012004560T5 Mikroelektromechanische Vorrichtung mit vergrabenen leitfähigen Bereichen sowie Verfahren zum Herstellen derselben A microelectromechanical device with buried conductive regions and methods of making the same
08/13/2014CN203774310U 电子器件 Electronic devices
08/13/2014CN203768004U 双压力mems芯片 Dual pressure mems chips
08/13/2014CN203768003U Mems传感器及半导体封装器件 Mems sensor and a semiconductor package device
08/13/2014CN103985649A 晶圆级封装方法及晶圆 Wafer and wafer-level packaging method
08/13/2014CN103979482A 一种能清除全氟污染物的金纳米颗粒阵列 One kind can remove perfluorinated pollutants array of gold nanoparticles
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