| Patents for B81B 7 - Micro-structural systems (8,983) |
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| 04/02/2014 | CN203513268U Substrate structure for low-stress MEMS sensor chip packaging |
| 04/02/2014 | CN101847664B Electron device package and method for manufacturing same |
| 03/27/2014 | WO2014046981A1 Micro device stabilization post |
| 03/27/2014 | WO2014046738A1 Detecting mass on a mems biooscillating resonator array |
| 03/27/2014 | US20140087374 The Use of Microfluidic Systems in the Electrochemical Detection of Target Analytes |
| 03/27/2014 | DE102012217133A1 Mikroelektronisches Bauelement und entsprechendes Herstellungsverfahren Microelectronic component and corresponding production method |
| 03/27/2014 | DE102012216996A1 Micro-electromechanical systems (MEMS) sound transducer of MEMS sound transducer arrangement, has diaphragm whose projection is arranged above projection of substrate, and whose recess is extended themselves into recess of substrate |
| 03/27/2014 | DE102012215262A1 Micromechanical structure has shallow trench isolation (STI) trench that is lower in upper side of substrate in which piezo-resistive stips are introduced |
| 03/26/2014 | CN203503623U Monolithic integrated MEMS chip based on conductive pole wafer level packaging |
| 03/26/2014 | CN103684511A Liquid mems component and rf applications thereof |
| 03/26/2014 | CN103684510A Radio circuit and component thereof including temperature responsive liquid mems |
| 03/26/2014 | CN103681648A Electrical circuit and method for producing electrical circuit |
| 03/26/2014 | CN103675048A Metal-oxide gas sensor based on MEMS (Micro-Electro-Mechanic System) and preparation technology thereof |
| 03/26/2014 | CN103663362A 传感器封装方法以及传感器封装 Sensor packaging methods and sensor package |
| 03/26/2014 | CN103663359A Microelectronic component and corresponding production process |
| 03/26/2014 | CN103663354A Micro/nano array and application thereof in micro/nano material standard bending strain loading |
| 03/26/2014 | CN103663353A Air sound particle vibration velocity sensor and manufacturing method of air sound particle vibration velocity sensor |
| 03/26/2014 | CN103663352A MEMS microphone packaging structure and packaging method |
| 03/26/2014 | CN103663351A Wafer-level packaging of a mems integrated device and related manufacturing process |
| 03/26/2014 | CN103663350A Micromechanical sensor device with movable gate and corresponding production method |
| 03/26/2014 | CN103663349A Liquid MEMS magnetic component |
| 03/26/2014 | CN103663348A Electronic apparatus |
| 03/26/2014 | CN103663347A Liquid MEMS Component Responsive to Pressure |
| 03/26/2014 | CN103663346A Packaged device designed to be exposed to environmental air and liquids and manufacturing method thereof |
| 03/26/2014 | CN103663345A Microelectromechanical system (MEMS) device and fabrication method thereof |
| 03/26/2014 | CN102146905B Micro fluid device |
| 03/20/2014 | WO2014043358A1 Device testing using acoustic port obstruction |
| 03/20/2014 | WO2014042055A1 Semiconductor device |
| 03/20/2014 | US20140082776 Fluid Delivery for Scanning Probe Microscopy |
| 03/20/2014 | US20140078509 Microelectromechanical system (mems) and (mem) optical interferometer for hyper-spectral imaging and analysis |
| 03/20/2014 | DE10348908B4 Verfahren zur Herstellung eines Mikrosystems mit integrierter Schaltung und mikromechanischem Bauteil A process for producing a microsystem with an integrated circuit and the micromechanical component |
| 03/20/2014 | DE102012216618A1 Anordnung von mindestens zwei Wafern zum Detektieren von elektromagnetischer Strahlung und Verfahren zum Herstellen der Anordnung Arrangement of at least two wafers for detecting electromagnetic radiation and methods of making the arrangement |
| 03/20/2014 | DE102012216493A1 Mikromechanische Sensorvorrichtung mit beweglichem Gate und entsprechendes Herstellungsverfahren Micromechanical sensor device with movable gate and method of manufacture |
| 03/19/2014 | CN203486891U Micro-motor system-level packaging structure |
| 03/19/2014 | CN103641060A Semiconductor integrated device assembly and related manufacturing process |
| 03/13/2014 | WO2014040017A1 Mems microphone package with molded interconnect device |
| 03/13/2014 | US20140070382 Pre-Molded MEMS Device Package |
| 03/13/2014 | DE202012011892U1 Kohlenstoffnanomaterial Carbon nanomaterial |
| 03/13/2014 | DE102012215897A1 Transducer device i.e. microelectromechanical system microphone, has coil formed to induce eddy current to membrane, for determination of sound pressure represented by acoustic signal depending on eddy current and impedance of coil |
| 03/13/2014 | DE102012215892A1 Sound transducer device for use in e.g. digital speaker, has thermo-acoustic transducer units which are formed on one substrate comprising semiconductor material |
| 03/13/2014 | DE102004008148B4 Sensor mit Membran und Verfahren zur Herstellung des Sensors Sensor with membrane and method of manufacturing the sensor |
| 03/12/2014 | EP2706567A1 Integrated circuit including an environmental sensor |
| 03/12/2014 | CN103630582A Micro-electromechanical system (MEMS) humidity sensor and preparation method thereof |
| 03/12/2014 | CN102167280B Super-hydrophobic silicon micron-nano composite structure and preparation method thereof |
| 03/12/2014 | CN102131139B Microphone package of micro-electro-mechanical system and manufacturing method thereof |
| 03/06/2014 | WO2014035486A1 Contact -transfer printed membranes |
| 03/06/2014 | US20140061892 Packaged device exposed to environmental air and liquids and manufacturing method thereof |
| 03/06/2014 | US20140061730 Cap and Substrate Electrical Connection at Wafer Level |
| 03/06/2014 | DE102012215600A1 Capacitive energy converter for vehicle, has capacitive array arranged corresponding to contour of vibrating electrode, and stator electrode, to perform relative movement of both electrodes of electrode assembly perpendicular to plane |
| 03/06/2014 | DE102012215239A1 Bauteil und Verfahren zum Prüfen eines solchen Bauteils Component and method for testing such a component |
| 03/05/2014 | EP2703338A1 Packaged device designed to be exposed to environmental air and liquids and manufacturing method thereof |
| 03/05/2014 | CN203461813U MEMS packaging structure |
| 03/05/2014 | CN203461812U Capacitor type micro-inertial sensor with self calibration |
| 02/27/2014 | WO2014031570A1 System and method for forming a buried lower electrode in conjunction with an encapsulated mems device |
| 02/27/2014 | WO2014031200A1 Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays |
| 02/27/2014 | WO2014030958A1 Method for preparing thin-film chip replica and microfluidic chip prepared by using the method |
| 02/27/2014 | WO2014029190A1 High performance mems thermopile infrared detector based on black silicon and method of manufacturing same |
| 02/27/2014 | WO2014029189A1 High performance mems thermopile infrared detector structure and method of manufacturing same |
| 02/27/2014 | US20140055942 Co-support module and microelectronic assembly |
| 02/27/2014 | US20140055941 Co-support system and microelectronic assembly |
| 02/27/2014 | DE102013109240A1 Mikrofluidische mischervorrichtungen und verfahren zum mischen eines fluids A microfluidic mixer devices and methods for mixing fluids of a |
| 02/27/2014 | DE102010029504B4 Bauelement mit einer Durchkontaktierung und Verfahren zu dessen Herstellung Component with a plated-through hole and process for its preparation |
| 02/27/2014 | DE102005024630B4 Halbleitersensor für eine dynamische Größe mit Selbstdiagnosefunktion Semiconductor sensor dynamic quantity with self-diagnostic function |
| 02/26/2014 | EP2699512A2 Implantation of gaseous chemicals into cavities formed in intermediate dielectric layers for subsequent thermal diffusion release |
| 02/20/2014 | DE102012107457A1 MEMS-Bauelement und Verfahren zur Herstellung MEMS device and methods for preparing |
| 02/20/2014 | DE102012015204A1 Verfahren zur Herstellung eines Flammenionisationsdetektors und entsprechender Flammenionisationsdetektor A process for producing a flame and corresponding flame ionization |
| 02/20/2014 | DE102009042319B4 Verfahren zur Herstellung eines Sensorknoten-Moduls A method for producing a sensor node module |
| 02/19/2014 | EP2697155A1 Mems package or sensor package with intra-cap electrical via and method thereof |
| 02/19/2014 | CN103596874A Out-of-plane travel restriction structures |
| 02/19/2014 | CN103588165A Three dimensional trans-scale charcoal electrode array structure and manufacture method |
| 02/19/2014 | CN102798474B High-performance MEMS (Micro Electro Mechanical System) thermopile infrared detector structure and preparation method thereof |
| 02/19/2014 | CN102145874B Micro-electro-mechanical device and manufacturing method thereof |
| 02/18/2014 | US8652883 Methods of manufacture of bottom port surface mount silicon condenser microphone packages |
| 02/13/2014 | WO2014025844A1 Variable capacitor comprising mems devices for radio frequency applications |
| 02/13/2014 | US20140042596 Bonded wafer structures |
| 02/13/2014 | DE102013108353A1 Vorrichtung mit einer eingebetteten MEMS-Vorrichtung und Verfahrenzur Herstellung einer eingebetteten MEMS-Vorrichtung A device with an embedded MEMS device and Verfahrenzur manufacturing an embedded MEMS device |
| 02/12/2014 | EP2695849A1 Micropump |
| 02/12/2014 | CN103583057A Semiconductor device and microphone |
| 02/12/2014 | CN103582607A Calibration of MEMS sensor |
| 02/12/2014 | CN103575797A Method for the production of a flame ionization detector and corresponding flame ionization detector |
| 02/12/2014 | CN103575407A Terahertz radiation detector |
| 02/12/2014 | CN103575403A Terahertz focal plane array based on MEMS technology |
| 02/12/2014 | CN103569956A Sensor package and method of forming same |
| 02/12/2014 | CN103569949A Method for encapsulating at least a microelectronic device |
| 02/12/2014 | CN103569945A Molecule detection nanopore device with anti-blocking function and manufacturing method thereof |
| 02/12/2014 | CN103569943A Friction-resistant Pt (platinum)/graphene composite structure and preparation method thereof |
| 02/12/2014 | CN103569942A Hybrid MEMS bump design to prevent in-process and in-use stiction |
| 02/12/2014 | CN103569941A Apparatus comprising MEMS and method for manufacturing embedded MEMS device |
| 02/12/2014 | CN103569940A MEMS device, electronic apparatus, and manufacturing method of MEMS device |
| 02/12/2014 | CN103569939A Micro-machine structure and corresponding making method |
| 02/12/2014 | CN103569938A Mems device, electronic module, electronic apparatus, and mobile unit |
| 02/12/2014 | CN103569937A MEMS device and method for forming the same |
| 02/12/2014 | CN102257609B Microelectromechanical device with isolated microstructures and method of producing same |
| 02/12/2014 | CN102203001B Transducer with decoupled sensing in mutually orthogonal directions |
| 02/12/2014 | CN102173375B 电子装置 Electronic devices |
| 02/06/2014 | WO2014022527A1 Mems apparatus disposed on assembly lid |
| 02/06/2014 | WO2014022487A1 Microphone assembly |
| 02/06/2014 | WO2014021868A1 Device including interposer between semiconductor and substrate |
| 02/06/2014 | WO2014020648A1 Electronic device |
| 02/06/2014 | WO2014020389A1 Methods of forming semiconductor structures including a conductive interconnection, and related structures |