Patents for B81B 7 - Micro-structural systems (8,983)
02/2014
02/06/2014US20140035433 Mems device, electronic apparatus, and manufacturing method of mems device
02/06/2014US20140034503 Particle transporter
02/06/2014US20140034502 Particle transporter
02/06/2014DE102012213548A1 Bondpad zum Thermokompressionsbonden, Verfahren zum Herstellen eines Bondpads und Bauelement Bonding pad for thermo-compression bonding, bonding pads and a method for producing component
02/05/2014EP2691742A1 Measuring system having electromechanical resonators, method for manufacturing such a system, and method for reading at least two resonators
02/05/2014CN103560326A 0.5THz corrugated horn antenna and preparation method using MEMS technology
02/05/2014CN103558368A Nano electrode array structure for measuring characteristics of biological cells and manufacturing method thereof
02/05/2014CN103552980A Wafer level packaging method for micro electromechanical system (MEMS) chip and single-chip micro-miniature type MEMS chip
02/05/2014CN103552979A Heat-static strong recovering type MEMS four-point support hanging beam structure
02/05/2014CN103552978A Deflection-type recovering-assistant MEMS hanging beam structure
02/05/2014CN103552977A Wafer level package structure for micro electromechanical system and package method
02/05/2014CN103552976A Intelligent device applied to magnetic field regulation and control of micro-electro mechanical system and production method thereof
01/2014
01/30/2014WO2014018455A1 Devices and methods for protecting electromechanical device arrays
01/30/2014WO2014017341A1 Display device equipped with power generation function
01/30/2014WO2014015433A1 Patient specific instrumentation with mems in surgery
01/30/2014US20140026649 Vertically integrated systems
01/30/2014DE102012213313A1 Micromechanical structure, particularly acceleration sensor, comprises micromechanical functional structure formed on surface of substrate, and strip conductor arrangement with two insulating layers and intermediate strip conductor layer
01/30/2014DE102012213310A1 MEMS component i.e. microphone component, has vibrating body vibratorily suspended within vacuum-sealed cavity and mechanically coupled to membrane element, so that vibrating body is deformed in case of membrane deflection
01/30/2014DE102012213305A1 Method for manufacturing microelectromechanical system element of component, involves spanning rear connection opening in substrate under membrane structure, producing cavity in substrate and opening cavity by backside thinning of substrate
01/30/2014DE102012212112A1 Bauelement mit einer mikromechanischen Mikrofonstruktur Component having a micromechanical microphone structure
01/29/2014CN203411319U Semiconductor integrated device assembly and electronic device
01/29/2014CN103547957A MEMS anchor and spacer structure
01/29/2014CN103547889A Measuring system having electromechanical resonators, method for manufacturing such a system, and method for reading at least two resonators
01/29/2014CN103543292A Composite accelerometer based on capacitance effect and tunnel effect
01/29/2014CN103539064A Wet etching method of sacrificial layer of MEMS (Micro-electromechanical Systems) structure and MEMS structure
01/29/2014CN103539063A Environment micro electrical mechanical system (MEMS) sensor base plate packaging structure and manufacturing method
01/29/2014CN103539062A MEMS devices, packaged MEMS devices, and methods of manufacture thereof
01/29/2014CN103539061A Micromechanical structure, in particular sensor arrangement, and corresponding operating method
01/28/2014US8637242 Integrated sequencing apparatuses and methods of use
01/28/2014US8636022 Production of microfluidic polymeric devices by photo-assisted and/or thermally assisted printing
01/28/2014CA2807564C Microfluidic devices and methods of using same
01/27/2014DE202013009362U1 Mikrosystem Microsystems
01/23/2014US20140021639 Vertical System Integration
01/23/2014US20140021565 Sensor package
01/23/2014US20140021515 Micromechanical structure, in particular sensor arrangement, and corresponding operating method
01/23/2014DE102013213445A1 Verfahren zur Herstellung einer Membran aus Halbleitermaterial A method for producing a membrane of semiconductor material
01/23/2014DE102012212445A1 Mikromechanische Struktur, insbesondere Sensoranordnung, und entsprechendes Betriebsverfahren Micromechanical structure, in particular the sensor array and corresponding operating method
01/22/2014CN103528576A Hemispherical resonance micro mechanical gyroscope and processing technology thereof
01/22/2014CN103523745A Si conductive post based wafer-level packaging method and monolithic integrated MEMS (Micro Electro Mechanical System) chip for same
01/22/2014CN103523743A Miniature friction energy harvester and method for manufacturing same
01/22/2014CN103523742A Radiation dosage detector of MOS structure and preparation method thereof
01/22/2014CN103523741A Hybrid integrated component and method for the manufacture thereof
01/22/2014CN103523740A Micromechanical assembly, method for manufacturing the micromechanical assembly and method for operating the micromechanical assembly
01/22/2014CN103523739A Packaging structure of three-dimensional flexible substrate of environment MEMS sensor and manufacturing method
01/22/2014CN103523738A Micro electro mechanical system sheet and manufacturing method thereof
01/22/2014CN101952193B Microfluidic device and methods of operation and making
01/21/2014US8633140 Functionalized polydiacetylene sensors
01/21/2014US8633064 Methods of manufacture of top port multipart surface mount silicon condenser microphone package
01/21/2014CA2679219C Mems actuators and switches
01/16/2014WO2014008819A1 Micro-electro-mechanical systems structure and sacrificial layer wet etching method thereof
01/16/2014WO2013132065A3 Micromechanical measuring element, and method for producing a micromechanical measuring element
01/16/2014US20140016171 Dielectric microstructure for use in microelectromechanical system (mems) devices and method of forming same
01/16/2014US20140015071 Encapsulated micro-electro-mechanical device, in particular a mems acoustic transducer
01/16/2014DE102008060796B4 Verfahren zum Ausbilden einer Mikro-Oberflächenstruktur sowie zum Herstellen eines mikroelektromechanischen Bauelements, Mikro-Oberflächenstruktur sowie mikroelektromechanisches Bauelement mit einer solchen Struktur A method of forming a micro-surface structure as well as for manufacturing a microelectromechanical device, micro-structure and surface micro-electromechanical device having such a structure
01/16/2014DE102007046031B4 Ultraschallsensor Ultrasonic sensor
01/15/2014CN103513059A Micro-electromechanical device performing signal routing through protective cap and method for controlling same
01/15/2014CN103508413A Method for manufacturing a component having an electrical through-connection
01/15/2014CN103508412A Encapsulating method of pressure sensor chip and pressure sensor
01/15/2014CN103508410A Method for manufacturing a component having an electrical through-connection
01/15/2014CN103508408A Hybrid integrated component and method for manufacturing the same
01/15/2014CN103508407A Package structure having micro-electro-mechanical element and method of fabricating the same
01/15/2014CN103508406A AZO thin film, preparing method and MEMS device comprising AZO thin film
01/15/2014CN102589762B Micro-voltage high-overload sensor chip of beam membrane single island structure
01/15/2014CN102496470B Asymmetric miniature ultracapacitor based on MEMS technology and manufacturing method thereof
01/14/2014US8629552 Top port multi-part surface mount silicon condenser microphone package
01/14/2014US8629551 Bottom port surface mount silicon condenser microphone package
01/11/2014CA2820181A1 Microfluidic structure, microfluidic device having the same and method of controlling the microfluidic device
01/09/2014WO2014008497A1 Sensor mems device cantilever packaging
01/09/2014WO2014005496A1 Mems chip and manufacturing method therefor
01/09/2014US20140008738 Mems die and methods with multiple-pressure sealing
01/09/2014US20140008223 Methods and apparatuses for mems based recovery of sequence verified dna
01/09/2014DE102013212915A1 Inertial sensor Inertial sensor
01/08/2014CN103500788A Integratable nanostructure infrared light source
01/08/2014CN103496665A Pressure, flow and temperature integrated chip and method for manufacturing same
01/08/2014CN102308131B 流体流动控制组件 Fluid flow control assembly
01/08/2014CN102169249B Mixed type micro-electromechanical device
01/08/2014CN101609063B Microelectrode array chip sensor for electrochemical immunological detection
01/07/2014US8624387 Top port multi-part surface mount silicon condenser microphone package
01/07/2014US8624386 Bottom port multi-part surface mount silicon condenser microphone package
01/07/2014US8624385 Top port surface mount silicon condenser microphone package
01/07/2014US8624384 Bottom port surface mount silicon condenser microphone package
01/03/2014WO2014004147A1 Microelectronic structure having a microelectronic device disposed between an interposer and a substrate
01/03/2014WO2014001635A1 Improved vibratory gyroscope
01/03/2014WO2014001634A1 An improved resonator
01/03/2014WO2014001010A1 Microphone arrangement comprising a stack of mems -microphone and interface - chip
01/03/2014WO2014000708A1 Aluminum-doped zinc oxide thin film, preparation method thereof, and micro electro mechanical system device comprising same
01/02/2014US20140003746 Nano/micro roller bearing having tolerance compensation function and method of manufacturing the same
01/02/2014US20140002948 Mems variable capacitor
01/02/2014US20140001580 Transducer with Enlarged Back Volume
01/02/2014DE102013211983A1 Trägheitssensor Inertial sensor
01/02/2014DE102010060906B4 Sensormodul mit Weckeinrichtung Sensor module with alarm
01/01/2014EP2679536A2 Anodically bonded strain isolator
01/01/2014EP2677955A1 Bone and tool tracking with mems in computer-assisted surgery
01/01/2014CN203377207U Vacuum-packaged CMOS and MEMS chip
01/01/2014CN203373144U Packaging structure for micro electro mechanical system chip
01/01/2014CN203373143U Ultra-thin MEMS chip packaged in vacuum mode
01/01/2014CN103487467A Manufacturing process of minitype gas-sensitive sensor of integrated heating element
01/01/2014CN103482562A Tiny gas sensor of laminated structure and preparation method of micro-gas sensor
12/2013
12/31/2013US8621661 Electrical-mechanical complex sensor for nanomaterials
12/31/2013CA2501012C Interlaced array of piano mems micromirrors
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