Patents for B81B 7 - Micro-structural systems (8,983)
05/2014
05/08/2014US20140125202 Bulk acoustic wave (baw) resonator structure having an electrode with a cantilevered portion and a piezoelectric layer with multiple dopants
05/08/2014US20140125201 Variable capacitor and switch structures in single crystal piezoelectric mems devices using bimorphs
05/08/2014US20140124879 Component and method for producing same
05/08/2014DE102013206531A1 Device for displacing micromirror in optical module of illumination system, has compensating unit compensating linear displacement of micromirror or predetermined pivot axis during pivoting of micromirror
05/08/2014DE102012220323A1 Bauteil und Verfahren zu dessen Herstellung Component and process for its preparation
05/08/2014DE102012220006A1 Bauelement mit einer mikromechanischen Mikrofonstruktur Component having a micromechanical microphone structure
05/07/2014EP2726838A1 A system and method for detecting one or more analytes in a fluid
05/07/2014EP2726401A1 Out-of-plane travel restriction structures
05/07/2014EP2726400A1 Calibration of mems sensor
05/07/2014CN203582457U 微机电系统晶圆级封装结构 MEMS wafer level package structure
05/07/2014CN203582456U 微机电设备和电子系统 MEMS devices and electronic systems
05/07/2014CN103780138A 一种密闭环境中液体振动能采集装置 Liquid in a closed environment vibrational energy collection device
05/07/2014CN103779642A 三维集成的多层堆叠结构微屏蔽mems滤波器组 Three-dimensional structure of the multilayer stack integrated micro shield mems filter bank
05/07/2014CN103777066A 一种微电子机械双通道微波功率检测系统及其制备方法 A microelectronic mechanical dual-channel microwave power detection system and its preparation method
05/07/2014CN103776437A 微机械结构 Micromechanical structure
05/07/2014CN103771335A 一种仿壁虎脚微纳分级结构及其制造工艺 One kind of gecko feet micro-nano hierarchical structure and its manufacturing process
05/07/2014CN103771334A 混合集成部件 Hybrid integrated components
05/07/2014CN103771333A 用于制造用于mems构件的罩的方法和具有这样的罩的混合集成部件 A method for manufacturing a cover member and the mems hybrid integrated cover member having such
05/07/2014CN103771332A 电子装置及其制造方法 Electronic device and method of manufacturing
05/07/2014CN102667432B 具有柔性衬底的热传感器及其使用 A thermal sensor having a flexible substrate, and their use
05/01/2014US20140117567 Microelectronic assembly with impedance controlled wirebond and reference wirebond
05/01/2014US20140117475 Hybrid integrated component
05/01/2014US20140117474 Pressure sensing device and manufacturing method of the same
05/01/2014US20140117470 Backside bulk silicon mems
04/2014
04/30/2014DE102012219769A1 Verfahren zum Herstellen einer elektrischen Durchkontaktierung in einem Substrat sowie Substrat mit einer elektrischen Durchkontaktierung A method of making an electrical plated-through hole in a substrate as well as substrate to an electrical through-contact
04/30/2014DE102012219660A1 Mechanisches Bauteil und Herstellungsverfahren für ein mechanisches Bauteil Mechanical component and manufacturing method for a mechanical component
04/30/2014DE102012219650A1 Mechanisches Bauteil, mechanisches System und Verfahren zum Betreiben eines mechanischen Bauteils Mechanical component, a mechanical system and method for operating a mechanical component
04/30/2014DE102012219616A1 Mikromechanisches Bauelement mit Bondverbindung Micromechanical component with bond
04/30/2014DE102012219605A1 Mikromechanisches Bauelement Micromechanical component
04/30/2014DE102012219591A1 Micromechanical component for use in e.g. sensor device for detecting mass of adjustable part, has actuator variable in shape such that restoring force is exerted on spring and/or adjustable part, and part is displaceable into movement
04/30/2014DE102012219582A1 Method for forming contact of electrode stack for micro-electromechanical component used in e.g. mobile telephone, involves etching functional layers at exposed portion of interfaces for exposing the surface portions of the electrodes
04/30/2014DE102012219550A1 Hybrid integriertes Bauteil Hybrid integrated component
04/30/2014DE102012219511A1 Mikromechanische Struktur Micromechanical structure
04/30/2014DE102012218906A1 Beschleunigungssensor und Verfahren zum Herstellen eines Beschleunigungssensors Acceleration sensor and method for producing an acceleration sensor
04/30/2014DE102012201713B4 Verfahren für die positionierung von mikrostrukturelementen A method for the positioning of microstructure elements
04/30/2014DE102012021413A1 Sensor mit Maskierung Sensor with masking
04/30/2014CN203568841U Single microminiature MEMS chip
04/30/2014CN103762201A MEMS sensor, semiconductor package device and method
04/30/2014CN103760667A Mixed type MEMS device
04/30/2014CN103759838A Infrared detector of microbridge structure and method for manufacturing same
04/30/2014CN103754818A Micro-electro-mechanical system dew-point sensor provided with vacuum chamber and manufacturing method of dew-point sensor
04/30/2014CN103754817A Three-dimensional vertical-interconnection silicon-based light and electricity simultaneous transmission device and manufacturing method thereof
04/30/2014CN102167279B Thermal sensor using a vibrating MEMS resonator of a chip interconnect layer
04/29/2014US8707553 Method and system for improving alignment precision of parts in MEMS
04/29/2014CA2490393C Microelectromechanical device with integrated conductive shield
04/24/2014WO2014062305A1 Packaged microphone system with integrated passive device die
04/24/2014WO2014062273A2 Substrate with multiple encapsulated devices
04/24/2014US20140110799 Electronic device and its manufacturing method
04/24/2014DE102012219465A1 Verfahren zum Herstellen einer Kappe für ein MEMS-Bauelement und hybrid integriertes Bauteil mit einer solchen Kappe A method of manufacturing a cap for a MEMS device and hybrid integrated component with such a cap
04/23/2014CN103746161A Self-protecting microwave equilizer based on MEMS (Micro Electro Mechanical System) structure
04/23/2014CN103746157A Phase shifting unit and MEMS (micro-electromechanical system) terahertz phase shifter composed of same
04/23/2014CN103743783A Dew point detection device based on micro-electromechanical system (MEMS) chip
04/23/2014CN103743439A Micro mechanical sensor with two layers of base plates
04/23/2014CN101997187B Micro electro mechanical system plug and socket connectors, manufacturing method thereof and connector assembly
04/22/2014US8704360 Top port surface mount silicon condenser microphone package
04/22/2014US8702938 Droplet actuator with improved top substrate
04/17/2014WO2014058870A1 Backplate electrode sensor
04/17/2014US20140103467 Sensor device, motion sensor, and electronic device
04/17/2014US20140103463 Mems sensor package systems and methods
04/17/2014DE102013220411A1 Die-Bond-Design für einen für mittleren Druck ausgelegten Sensor für Fahrzeuganwendungen The design for a bond which is designed for medium-sized pressure sensor for automotive applications
04/17/2014DE102013111163A1 MEMS-Bauelement und Verfahren zum Fertigen eines MEMS-Bauelements MEMS device and method of fabricating a MEMS device
04/17/2014DE102012218845A1 Herstellungsverfahren für ein mikromechanisches Bauteil und mikromechanisches Bauteil Manufacturing method for a micromechanical component and micromechanical component
04/17/2014DE102012218725A1 Mikroelektromechanisches Bauelement und Verfahren zur Herstellung eines mikroelektromechanischen Bauelementes The micro-electro-mechanical device and method for manufacturing a micro-electro-mechanical component
04/17/2014DE102012218501A1 Bauelement mit einer mikromechanischen Mikrofonstruktur Component having a micromechanical microphone structure
04/17/2014DE102012217105A1 Elektrische Schaltung und Verfahren zum Herstellen einer elektrischen Schaltung Electrical circuit and method for establishing an electrical circuit
04/16/2014CN203545672U MEMS (micro-electromechanical system) package
04/16/2014CN103723674A MEMS transistors and method of fabricating MEMS transistors
04/16/2014CN103723673A Micro electro mechanical system and detection circuit
04/16/2014CN103723672A Device containing nano-pipet and fabrication method thereof
04/16/2014CN102721829B Capacitive micro acceleration sensor and uni-wafer manufacturing method thereof
04/16/2014CN102686508B A tri wavelength diffraction modulator and a method for modulation
04/16/2014CN102589760B Minitype capacitance-type mechanical sensor and preparation method thereof
04/16/2014CN102565142B Low-temperature drift piezoresistive humidity sensor and manufacturing method thereof
04/16/2014CN102543239B Three-dimensional heterojunction isotope battery based on carbon nanotube film and preparation method of three-dimensional heterojunction isotope battery
04/16/2014CN101970339B Device for measuring pressure, variation in acoustic pressure, a magnetic field, acceleration, vibration, or the composition of a gas
04/16/2014CN101565161B Large dimension micro-beam array for optical reading out heat type infrared radiation sensor
04/15/2014US8695640 Microfabricated elastomeric valve and pump systems
04/15/2014CA2472029C Method, apparatus and article for microfluidic control via electrowetting, for chemical, biochemical and biological assays and the like
04/10/2014WO2014053575A1 Measurement system including a network of nanoelectromechanical system resonators
04/10/2014DE102012224432A1 Electric circuit has contact structure provided with contact portion that is formed on front side of protective layer facing away from front side of solar cell
04/10/2014DE102012218414A1 Integrierte Diodenanordnung und entsprechendes Herstellungsverfahren Integrated diode array and method of manufacture
04/09/2014CN103712601A Liquid multilayer-capacitanc inclination microensor
04/09/2014CN103708412A Micro electro mechanical system packaging method
04/09/2014CN103708411A Nanowire arranging and positioning method based on ridge electrode structure
04/09/2014CN103708410A Novel micro heater and production method thereof
04/09/2014CN103708409A Pressure sensor and inertia sensor assembly and production method thereof
04/09/2014CN103708408A Micro-nano fluid driving device
04/09/2014CN103708407A Wafer-level packaging structure and method of integrated MEMS sensor
04/09/2014CN103708406A Resonant type infrared detector structure capable of isolating packaging stress and manufacturing method thereof
04/09/2014CN102602881B Method for forming multiple silicon trenches on MEMS (Micro Electro Mechanical Systems) sealing-cap silicon chip and etching mask structure thereof
04/09/2014CN101993031B Protection structure and semiconductor structure of contact pad
04/08/2014CA2678680C Mems actuators and switches
04/03/2014WO2014052162A2 Transparent multi-layer structure with transparent electrical routing
04/03/2014WO2014047737A1 Microfluidic chip for multi-analyte detection
04/03/2014US20140090979 Paired Laser and Electrokinetic Separation, Manipulation, and Analysis Device
04/03/2014DE102012217979A1 Hybrid integriertes Drucksensor-Bauteil Hybrid integrated pressure sensor component
04/03/2014DE102012217881A1 Sensoranordnung und Herstellungsverfahren Sensor assembly and manufacturing processes
04/02/2014EP2712841A2 Systems and methods for isolating MEMS against high frequencies
04/02/2014EP2712428A1 Mems anchor and spacer structure
04/02/2014CN203513269U Micro gas sensor of overlapped structure
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