Patents
Sitemap › B81 - Micro-structural technology › B81B - Micro-structural devices or systems, e.g. micro-mechanical devices › B81B 7 - Micro-structural systems
Patents for B81B 7 - Micro-structural systems (8,983)
06/2014
06/26/2014WO2014099123A1 Getter structure for wafer level vacuum packaged device
06/26/2014WO2014095115A1 Measuring system having a carrier element and a sensor
06/26/2014WO2014062273A3 Substrate with multiple encapsulated devices
06/26/2014US20140176248 Use of electronic attenuator for mems oscillator overdrive protection
06/26/2014US20140175573 Soi wafer, manufacturing method therefor, and mems device
06/26/2014DE102013113909A1 Sensormodul und Batterieelemente Sensor module and battery elements
06/26/2014DE102012222426A1 Herstellungsverfahren für ein mikromechanisches Bauelement und entsprechendes mikromechanisches Bauelement Manufacturing method for a micromechanical component and corresponding micromechanical component
06/25/2014EP2746737A1 Acoustic detection device and acoustic camera using a mems microphone array
06/25/2014CN203667994U 封装器件 Packaged devices
06/25/2014CN103879950A Mems器件真空封装结构 Mems device vacuum package
06/25/2014CN102556956B Mems器件的真空封装结构及其制作方法 Vacuum packaging structure and method of making Mems devices
06/25/2014CN102507050B 激励和拾振合一的电热激励-压阻拾振谐振梁压力传感器 Incentives and pick-up in one of the electric excitation - pick-up resonant beam piezoresistive pressure sensors
06/24/2014US8759149 Encapsulated micro-electro-mechanical device, in particular a MEMS acoustic transducer
06/19/2014WO2014093243A1 Micro pick up array with integrated pivot mount
06/19/2014WO2014092219A1 Method for manufacturing gas chromatography chip through multi-etching and method for manufacturing chip laminate
06/19/2014WO2014090438A1 Mems component and method for encapsluating mems components
06/19/2014US20140167295 Coatings for relatively movable surfaces
06/19/2014US20140167190 Monolithic Package for Housing Microelectromechanical Systems
06/18/2014EP2743955A1 Electronic component
06/18/2014DE102013111795A1 Micro-electromechanical structure i.e. out-of-plane-acceleration sensor, for use in e.g. vehicle parts, has compensation-stopper producing force and torque on testing mass for compensating force and torque produced by impact-stoppers
06/18/2014DE102013109240A9 Mikrofluidische mischervorrichtungen und verfahren zum mischen eines fluids A microfluidic mixer devices and methods for mixing fluids of a
06/18/2014DE102013105100A1 System und Verfahren eines integrierten Halbleiterbauteils für die Handhabung und Verarbeitung einer biologischen Einheit System and method of a semiconductor integrated component for handling and processing a biological unit
06/18/2014DE102012223605A1 MEMS-Bauelement zum Erzeugen von Druckpulsen MEMS device for generating pressure pulses
06/18/2014DE102012223016A1 Micromechanical inertial sensor has substrate with main extension plane, and two functional layers which are arranged above one another parallel to main extension plane, where seismic mass is formed in functional layers
06/18/2014CN203661289U Mems换能器和电子设备 Mems transducer and electronics
06/18/2014CN103864005A Reducing MEMS stiction by deposition of nanoclusters
06/18/2014CN102530832B Inertia MEMS (micro-electro-mechanical system) sensor and making method thereof
06/18/2014CN101920927B Microelectromechanical gyroscope with rotary driving motion and improved electrical properties
06/12/2014US20140157893 Mems element, electronic device, altimeter, electronic apparatus, and moving object
06/12/2014US20140157892 Mems element, electronic device, altimeter, electronic apparatus, and moving object
06/12/2014DE102012222988A1 Mikromechanische Resonatoranordnung Micromechanical resonator
06/12/2014DE102012222973A1 Mikromechanisches Elektrofeldmeter als Gewitterwarner The micromechanical electrostatic field meter as thunderstorms Warner
06/12/2014DE102012222491A1 Elektronisches Bauteil mit einem gespritzten Bauteilgehäuse Electronic component with a molded component housing
06/12/2014DE102012112058A1 MEMS-Bauelement und Verfahren zur Verkapselung von MEMS-Bauelementen MEMS device and method of encapsulating MEMS devices
06/12/2014DE102012110549A1 Silicon substrate, has reactive multilayer comprising two-dimensional nanosheets made of different materials, and insulating layer arranged between upper cap substrate and reactive multilayer and connected with lower substrate
06/12/2014DE102012110542A1 Semiconductor substrate e.g. silicon substrate of subsystem, is connected with another semiconductor substrate, so as to encapsulate passive or active device between two substrates in cavity hermetically
06/11/2014CN103852598A Microelectromechanical structure having low sensitivity on thermodynamic stress
06/11/2014CN103848391A Embedded chip package, chip package, and method for manufacturing the embedded chip package
06/11/2014CN103848390A MEMS structure with adaptable inter-substrate bond
06/05/2014WO2014085675A1 Chip level sensor with multiple degrees of freedom
06/05/2014US20140151869 Integrated heater on mems cap for wafer scale packaged mems sensors
06/05/2014US20140151855 Wafer with Recessed Plug
06/05/2014DE102013112962A1 Mikrofluidisches System Microfluidic system
06/05/2014DE102013111787A1 Microelectromechanical structure for out-of-plane acceleration sensor, has substrate, testing mass suspended over substrate and armature fastened on substrate, where testing mass reacts to acceleration
06/04/2014EP2737047A1 Methods and devices for electrical sample preparation
06/04/2014EP2736836A1 Housing for semiconductor chip and semiconductor chip with a housing
06/04/2014CN203631322U 一种电容器及包括该电容器的电容式传感器 A capacitor comprising the capacitor and the capacitive sensor
06/04/2014CN103837979A Focal length setting device based on MEMS and preparation method thereof
06/04/2014CN103832963A Micro-bubble generator and manufacturing method thereof
06/04/2014CN103064060B Quaternary array micro-electromechanical system (MEMS) vector hydrophone microstructure
06/04/2014CN102190285B Manufacturing method of MEMS device, and substrate used therefor
06/04/2014CN101456530B Method and system for mems switches fabricated in an integrated circuit package
06/03/2014US8742872 MEMS element, and manufacturing method of MEMS element
05/2014
05/30/2014WO2014079560A2 Wafer level package with getter
05/28/2014EP2736071A1 Wafer level package with getter
05/28/2014DE102012221509A1 Integrated device of microphone device, has function layer which is patterned from micro-mechanical functional element, so that function elements are arranged one above other and spaced from each other
05/28/2014DE102012220407A1 Ventilanordnung in einem Mikrofluidiksystem Valve arrangement in a microfluidic
05/28/2014DE102012202035B4 Mikromechanisches Bauelement mit einer Membran Micromechanical component with a membrane
05/28/2014DE102011084020B4 Sensorelement Sensor element
05/28/2014DE102008007682B4 Modul mit einem Mikro-Elektromechanischen Mikrofon Module with a micro-electro-mechanical microphone
05/28/2014DE102007051823B4 Sensor für eine physikalische Grösse und Verfahren zur Fertigung des Sensors A physical quantity sensor and method for manufacturing the sensor
05/28/2014CN103818874A Mems结构与处理电路集成系统的新型封装方法 The new packaging method Mems structure and processing circuitry integrated system
05/28/2014CN103818872A Mems器件和制造mems器件的方法 Mems mems device and a method of manufacturing the device
05/28/2014CN103818871A 物联网射频收发组件中的热和电磁能自供电微传感器 Things RF transceiver components in thermal and electromagnetic energy self-powered micro-sensor
05/28/2014CN103818870A 物联网射频收发组件悬臂鱼刺梁振动电磁自供电微传感器 Things RF transceiver components Fishbone cantilever beam of electromagnetic self-powered micro-vibration sensor
05/28/2014CN103818869A 物联网射频收发组件固支鱼刺梁振动电磁自供电微传感器 Things Fishbone RF transceiver components clamped beam of electromagnetic self-powered micro-vibration sensor
05/28/2014CN103818868A 双压力mems芯片圆片级封装方法及其双压力mems芯片 Dual pressure mems chip wafer level packaging method and dual-pressure mems chip
05/28/2014CN102566285B 制造微结构的方法及该微结构 The method of manufacturing a micro structure, and the microstructure
05/22/2014WO2014075402A1 Micromechanical magnetic field sensor and application thereof
05/22/2014WO2014052162A3 Transparent multi-layer structure with transparent electrical routing
05/22/2014DE102013221786A1 Piezoresistiver wandler mit geringem thermischen rauschen Rushing piezoresistive transducers with low thermal
05/21/2014CN203606385U 一种基于电容效应和隧道效应的复合式加速度计 Based on capacitive effects and tunneling composite accelerometer
05/21/2014CN103812468A 微机械固支梁式π型连续可重构微波带通滤波器 Micromechanical clamped beam π-type continuous reconfigurable microwave bandpass filter
05/21/2014CN103812467A 微机械悬臂梁式十六状态可重构微波带通滤波器 Micromechanical cantilever sixteen state reconfigurable microwave bandpass filter
05/21/2014CN103812466A 微机械悬臂梁式四状态可重构微波带通滤波器及制备方法 Micromechanical cantilever four-state reconfigurable microwave bandpass filter and preparation methods
05/21/2014CN103812465A 微机械固支梁式十六状态可重构微波带通滤波器 Micromechanical clamped beam sixteen state reconfigurable microwave bandpass filter
05/21/2014CN103803481A 一种感测器 One kind of sensor
05/21/2014CN103803480A 电子设备封装的盖件和用于制造其的方法 The cover member and the electronic device package manufacturing method thereof for
05/21/2014CN103803479A 集成电微流控探针卡、系统及其使用方法 Integrated circuits microfluidic probe card, the system and method of use
05/21/2014CN103803478A 金属弹性构件、微机械装置、微机械装置的制造方法、摆动控制装置以及摆动控制方法 A metal elastic member, the micro-mechanical device, a method of manufacturing a micromechanical device, the swing control device and a control method swing
05/21/2014CN101445215B 红外探测器及其制造方法 Infrared detector and method of manufacturing
05/20/2014US8729973 MEMS resonator
05/15/2014US20140134950 Vertical System Integration
05/15/2014US20140131850 Microchip with blocking apparatus and method of fabricating microchip
05/15/2014DE102013112202A1 Sensoreinrichtung, Verfahren und Sensor zur Bestimmung einer relativen Konzentration einer ersten Art von Ionen in Relation zu einer zweiten Art von Ionen, die in einem Flüssigkeitstropfen gelöst sind Sensor means, method and sensor for determining a relative concentration of a first type of ions in relation to a second kind of ions which are dissolved in a liquid drop
05/15/2014DE102012109325A1 Drucksensor mit Deckschicht Pressure sensor with topcoat
05/15/2014DE102010055935B4 Verfahren zum Verbinden mehrerer ungehäuster Substrate A method for connecting a plurality of bare substrates
05/15/2014DE102009042319B9 Verfahren zur Herstellung eines Sensorknoten-Moduls A method for producing a sensor node module
05/14/2014CN103795365A 微机械固支梁式四状态可重构微波带通滤波器及制备方法 Micromechanical clamped beam four state reconfigurable microwave bandpass filter and preparation methods
05/14/2014CN103792036A 气压与加速度传感器相集成的mems芯片及其制作方法 Mems pressure and acceleration sensor chip integrates its production methods
05/14/2014CN103787268A 一种高速宽带硅光转接板的制造方法及硅基光互连器件 A method for manufacturing high-speed broadband silicon and silicon-based optical adapter plate optical interconnection devices
05/14/2014CN103787266A 机械部件、机械系统和用于运行机械部件的方法 Mechanical parts, mechanical systems and methods for operating a mechanical component
05/14/2014CN103787265A 机械部件和用于机械部件的制造方法 The mechanical components and mechanical parts for the manufacturing method
05/14/2014CN103787264A 一种应用于高速宽带光互连的硅通孔器件的制造方法及其器件 Applied to high-speed broadband optical interconnect silicon vias device manufacturing method and device
05/14/2014CN103787263A 基于两级调控的静电驱动大变形微机械驱动器 Large deformation micromechanical drive control based on two-stage electrostatic drive
05/14/2014CN103787262A Tsv-mems组合 Tsv-mems portfolio
05/14/2014CN103787258A 具有键合连接的微机械器件 A micro-mechanical devices connected to the bonding
05/14/2014CN102955046B 一种单片集成cmos mems多层金属三轴电容式加速度传感器及制备方法 A monolithic integrated cmos mems multilayer metal triaxial capacitive accelerometer and preparation methods
05/13/2014CA2496860C Microelectromechanical devices
05/08/2014US20140125431 Tunable and switchable resonator and filter structures in single crystal piezoelectric mems devices using bimorphs
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