| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 03/23/2006 | US20060062927 Non-cyanide electroless gold plating solution and process for electroless gold plating |
| 03/23/2006 | US20060062909 Mesostructured thin film, mesoporous thin film, and process for production thereof |
| 03/23/2006 | DE10245928B4 Verfahren zur strukturierten, selektiven Matallisierung einer Oberfläche eines Substrats A process for the structured surface of a substrate a selective Matallisierung |
| 03/22/2006 | EP1636297A1 Modified polyacetals for plating |
| 03/22/2006 | CN1751382A Plating apparatus |
| 03/22/2006 | CN1750240A Method of forming an oxide film, an oxide film, a component and an electronic apparatus |
| 03/22/2006 | CN1749431A Method for chemical plating nickel on cast iron kitchenware |
| 03/22/2006 | CN1246496C Submarine surface anticorrosive process method |
| 03/22/2006 | CN1246495C Preparing method for chemical plating liquid for chemical coating of nickel-phosphorus alloy and its products |
| 03/22/2006 | CN1246494C Jet plating apparatus |
| 03/21/2006 | US7014979 Method of forming the metal alloy pattern using the same, wherein the metal alloy pattern having improved adhesive force to a substrate, heat resistance, and resistance to atmospheric corrosion can be readily formed using the |
| 03/21/2006 | US7014679 Removing oxygen from a copper plating solution using hollow hydrophobic fiber membranes; intrusion of solution into membrane pores is avoided |
| 03/16/2006 | WO2006028260A1 Method and apparatus for forming metal film |
| 03/16/2006 | WO2006027947A1 Electroless gold plating pretreatment agent and copper clad laminate for flexible board |
| 03/16/2006 | US20060057384 Methods for the fabrication of gold-covered magnetic nanoparticles |
| 03/16/2006 | US20060057317 Vessel for holding silicon and method of producing the same |
| 03/16/2006 | US20060057284 Method for improving metal surfaces to prevent thermal tarnishing and component with the metal surface |
| 03/15/2006 | EP1633805A1 Method for producing scratch-resistant coating systems devoid of condensation |
| 03/15/2006 | EP1345704A4 Method and apparatus for applying controlled succession of thermal spikes or shockwaves through a medium |
| 03/15/2006 | CN1748044A Copper activator solution and method for semiconductor seed layer enhancement |
| 03/15/2006 | CN1747798A Fiber and sheet equipment wear surfaces of extended resistance and methods for their manufacture |
| 03/15/2006 | CN1747797A Equipment abrasive surfaces of extended resistance and methods for their manufacture |
| 03/15/2006 | CN1747626A Method for non-electric plating on PCB using photo-catalyst |
| 03/15/2006 | CN1245856C Alloy plating liquid for modular printed circuit board surface treatment |
| 03/15/2006 | CN1245353C Method for preparing nanometer metal ceramic composite powder |
| 03/15/2006 | CN1245348C Method for preparing optically transparent titanium dioxide film and products thereby |
| 03/14/2006 | US7011862 Method for producing wiring substrate |
| 03/14/2006 | US7011738 Activation of a cathode |
| 03/14/2006 | US7011732 Sputtering an alloy in oxygen to form a spinel oxides of two different transition metals; stoichiometry; infrared transmission, electroconductivity, stability; optical coatings for light emitting diode, transistor, solar cells, flat panel displays |
| 03/14/2006 | US7011719 Treatment for improved magnesium surface corrosion-resistance |
| 03/14/2006 | US7011697 Electroless gold plating solution |
| 03/09/2006 | WO2006025242A1 Double-layered flexible board and method for manufacturing same |
| 03/09/2006 | US20060051601 Ceramic film and method of manufacturing the same, ferroelectric capacitor, semiconductor device, and other element |
| 03/08/2006 | EP1631698A1 Process for the preparation of metal oxide coated organic material by microwave deposition |
| 03/08/2006 | CN1745194A Method of forming a conductive metal region on a substrate |
| 03/08/2006 | CN1745193A 半导体装置 Semiconductor device |
| 03/08/2006 | CN1743502A Method for plating resin material |
| 03/08/2006 | CN1743129A Method for preparing YBaCu3O7-delta strip on cold-rolled polycrystalline silver-base band |
| 03/08/2006 | CN1244722C Apparatus for copper plating using electroless plating and electroplating |
| 03/07/2006 | US7008669 Ceramic and method of manufacturing the same, dielectric capacitor, semiconductor device, and element |
| 03/02/2006 | WO2006022334A1 Method for manufacturing semiconductor device |
| 03/02/2006 | WO2006022133A1 Electroless plating apparatus |
| 03/02/2006 | WO2006021445A1 Method for coating substrates containing antimony compounds with tin and tin alloys |
| 03/02/2006 | US20060046320 Liquid composition for forming ferroelectric thin film and process for producing ferroelectric thin film |
| 03/01/2006 | EP1630252A1 Process for coating antimony containing substrate with tin or tin alloys |
| 03/01/2006 | EP1630251A2 Process for coating apparatus and parts of apparatus used to make chemical plants |
| 03/01/2006 | EP1629902A1 Method of copper deposition from a supercritical fluid solution containing copper (1) complexes with a neutral ligand |
| 03/01/2006 | EP1629703A1 Method for the structured metal-coating of polymeric and ceramic support materials, and compound that can be activated and is used in said method |
| 03/01/2006 | EP1629549A2 Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells |
| 03/01/2006 | EP1629139A1 Process for painting metal parts |
| 03/01/2006 | EP1629137A1 Method for producing metal conductors on a substrate |
| 03/01/2006 | EP1629136A1 Composition for coating metals to protect against corrosion |
| 03/01/2006 | EP1425111A4 Process for plating particulate matter |
| 03/01/2006 | CN1742120A Vessel for holding silicon and method of producing the same |
| 03/01/2006 | CN1740826A Antiglaring thin film and producing method thereof, producing method for die used thereof and display device thereof |
| 03/01/2006 | CN1740391A Chemical nickel-plating process for cooker |
| 03/01/2006 | CN1740390A Chemical plating activating process and metal depositing process therewith |
| 03/01/2006 | CN1740389A Hydrothermal Sm2O3 film preparing process |
| 03/01/2006 | CN1740388A Method of manufacturing a disk substrate for a magnetic recording medium |
| 02/28/2006 | US7005378 Processes for fabricating conductive patterns using nanolithography as a patterning tool |
| 02/28/2006 | US7005192 water repelling agent contains a hydrophobic group selected from alkyl, phenyl, vinyl and a perfluoro group, and a functional group enhancing the absorptivity containing silanetriol, trimercaptosilane and triaminosilane group; protective coating |
| 02/23/2006 | WO2006020188A1 Nanostructured coatings and related methods |
| 02/23/2006 | WO2006019442A2 Wood preservative composition |
| 02/23/2006 | WO2006018995A1 Conductive fine particle, method for producing conductive fine particle and electroless silver plating liquid |
| 02/23/2006 | WO2006018173A1 Device and method for removing foreign matter from process solutions |
| 02/23/2006 | WO2006018013A1 Method for application of a zinc sulphide buffer layer to a semiconductor substrate by means of chemical bath deposition in particular on the absorber layer of a chalcopyrite thin-film solar cell |
| 02/23/2006 | WO2005092043A3 Process for fabrication of printed circuit boards |
| 02/23/2006 | US20060040487 Semiconductor device, method for manufacturing the same, and plating solution |
| 02/23/2006 | US20060037858 Electroless plating apparatus and electroless plating method |
| 02/23/2006 | DE102004038693A1 Vorrichtung und Verfahren zur Entfernung von Fremdstoffen aus Prozesslösungen Apparatus and method for removing foreign substances from process solutions |
| 02/23/2006 | DE102004030930A1 Zinnbeschichtete Leiterplatten mit geringer Neigung zur Whiskerbildung Tin plated circuit boards with little tendency to whisker |
| 02/23/2006 | CA2575862A1 Silver-releasing articles and methods of manufacture |
| 02/22/2006 | EP1627098A1 Compositions for the currentless deposition of ternary materials for use in the semiconductor industry |
| 02/22/2006 | CN2760211Y Composite plating screw drill |
| 02/22/2006 | CN1738924A Improved silver plating method and articles made therefrom |
| 02/22/2006 | CN1737196A Technique for compositely coating Ni-B-nanometer TiO2 chemically |
| 02/22/2006 | CN1243464C Method for generating electromagnetic wave interference shielding membrane |
| 02/22/2006 | CN1243129C Process for making copper-plated and nickel-plated wire |
| 02/22/2006 | CN1243124C Preparing method for medium hole noble metal hollow microscapsule |
| 02/22/2006 | CN1243123C Process for preparing tin oxide nanocrystalline thin films |
| 02/21/2006 | US7001666 A sol gel coating mixture comprising alkoxyzirconium, organosilane coupling agent and an organic acid catalyze, bonding to metal substrate; forming a protective film, resist to heat and corrosion, desired color, gloss, reflectivity |
| 02/16/2006 | WO2006015819A1 Method for producing highly textured, strip-shaped high-temperature superconductors |
| 02/16/2006 | WO2005094394A3 Non-chrome plating on plastic |
| 02/16/2006 | US20060035105 A printed circuit board having nonconductive base layer, a layer of copper and/or a copper alloy and a protective overcoating of a tin alloy to safeguard the solderability of the copper; tin alloys containing a gradient of silver, platinum, gold, nickel, bismuth, and/or copper; crystal growth inhibitors |
| 02/16/2006 | US20060035103 Method for the inner coating of a component with a cavity and component with an inner coating |
| 02/16/2006 | US20060035018 Method for forming a thin film silver mirror and method for forming coated film comprising thin silver mirror film |
| 02/16/2006 | US20060033517 Probe for semiconductor devices |
| 02/16/2006 | CA2575471A1 Electroless plating with nanometer particles |
| 02/15/2006 | CN1735712A Photosensitive dispersion with adjustable viscosity for metal deposition on an insulating substrate and use of same |
| 02/15/2006 | CN1242659C Process for depositing conducting layer on substrate |
| 02/15/2006 | CN1242099C Activation of cathode |
| 02/15/2006 | CN1242096C Method for preparing corrosion-proof wear-resistant nickel plating coat on the surface of magnesium and its alloy parts |
| 02/15/2006 | CN1242095C Regeneration process of non-electrolysis plating liquid |
| 02/14/2006 | US6998346 Method for the patterned, selective metallization of a surface of a substrate |
| 02/14/2006 | US6998342 Electronic device manufacturing method |
| 02/14/2006 | US6998151 Electrodeposition of alloy; gas turbine engine |
| 02/14/2006 | US6998036 an alkylsulfonic acid surfactant; water soluble tin (II) and silver (I) salts; linear, organic thioether compounds as complexing agents; electrodeposition; oxidation resistance; solder is suitable for high and low current densities; nontoxic |
| 02/09/2006 | WO2006013950A1 Solution, material for plating, insulating sheet, laminate and printed wiring board |
| 02/09/2006 | WO2005080633A3 Method for zinc coating aluminum |
| 02/09/2006 | WO2005048275A3 COMPOSITIONS AND METHODS FOR THE ELECTROLESS DEPOSITION OF NiFe ON A WORK PIECE |