| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 10/05/2005 | EP1583135A1 Proximity head heating method and apparatus |
| 10/05/2005 | CN1679154A Wafer level electroless copper metallization and bumping process, and plating solutions for semiconductor wafer and microchip |
| 10/05/2005 | CN1677704A Method for preparing chalkogenide thermoelectric film using liquid-phase chemical method |
| 10/05/2005 | CN1222042C Metal inter-connector and active matrix bottom therewith |
| 10/04/2005 | US6951765 Method and apparatus for introduction of solid precursors and reactants into a supercritical fluid reactor |
| 10/04/2005 | US6951604 Production method for flexible printed board |
| 10/01/2005 | CA2503320A1 Methods for the fabrication of gold-covered magnetic nanoparticles |
| 09/29/2005 | WO2005090454A1 Method for forming surface graft, method for forming conductive film, method for forming metal pattern, method for forming multilayer wiring board, surface graft material, and conductive material |
| 09/29/2005 | US20050215721 Pattern forming method, arranged fine particle pattern forming method, conductive pattern forming method, and conductive pattern material |
| 09/29/2005 | US20050214693 Pattern forming method, graft pattern material, conductive pattern forming method and conductive pattern material |
| 09/29/2005 | US20050214550 Method of forming a pattern, conductive patterned material, and method of forming a conductive pattern |
| 09/29/2005 | US20050214449 Solvent swell for texturing resinous material and desmearing and removing resinous material |
| 09/29/2005 | US20050214448 Compositions containing heterocyclic nitrogen compounds and glycols for texturing resinous material and desmearing and removing resinous meterial |
| 09/29/2005 | US20050211135 Methods of forming LaNiO3 conductive layers, ferro-electric devices with LaNiO3 layers, and precursor formation solutions |
| 09/29/2005 | US20050211105 Coated metal cookware |
| 09/28/2005 | EP1581031A1 Method of forming a pattern, conductive patterned material, and method of forming a conductive pattern |
| 09/28/2005 | EP1580770A2 Soft magnetic powder and a method of manufacturing a soft magnetic powder compact |
| 09/28/2005 | EP1580595A2 Pattern forming method, graft pattern material, conductive pattern forming method and conductive pattern material |
| 09/28/2005 | EP1580164A1 Dispersoid having metal-oxygen bond, metal oxide film, and monomolecular film |
| 09/28/2005 | EP1579490A1 Method for low temperature growth of inorganic materials from solution using catalyzed growth and re-growth |
| 09/28/2005 | EP1579467A2 Metallization of carbon nanotubes for field emission applications |
| 09/28/2005 | EP1579029A2 Method and apparatus for electroless deposition with temperature-controlled chuck |
| 09/28/2005 | EP1579028A2 Method for coating a substrate with calcium phosphate |
| 09/28/2005 | EP0886894B1 Contact carriers for populating substrates with spring contacts |
| 09/28/2005 | CN1675408A Device and method for regenerating an electroless metal plating bath |
| 09/28/2005 | CN1675407A Metallisation |
| 09/28/2005 | CN1220790C Coating compositions containing nickel and boron |
| 09/22/2005 | WO2005087980A2 Semiconductor device, method for manufacturing the same and a wiring substrate |
| 09/22/2005 | WO2005087979A2 A method and a device for deposition of a metal layer on a non-conducting surface of a substrate |
| 09/22/2005 | WO2005066392A3 Surface structuring by means of a film |
| 09/22/2005 | US20050209117 (Electro)chemical deposition of copper, nickel, zinc or gold; electrolytic cleaning of soft steels; solution of carboxymethylated polyethyleneimine sodium salt, dispersants, inorganic transition metal compound, inorganic acid or base, and metal oxide or salt; improved corrosion resistance; nontoxic |
| 09/22/2005 | US20050208774 Wet processing method and processing apparatus of substrate |
| 09/22/2005 | US20050208428 Surface graft material, conductive pattern material, and production method thereof |
| 09/22/2005 | US20050208208 Coating sol made of an organic metal compound and forming dielectric precursor film, drying, degreasing, then baking; piezoelectricity |
| 09/22/2005 | US20050205848 Soft magnetic powder material and a method of manufacturing a soft magnetic powder compact |
| 09/22/2005 | US20050205165 Coating composition for forming titanium oxide film, process for forming titanium oxide film and metal substrate coated with titanium oxide film |
| 09/21/2005 | EP1577936A1 Semiconductor sensor and plating method for semiconductor device |
| 09/21/2005 | EP1577421A1 Substrate processing apparatus and method for processing substrate |
| 09/21/2005 | EP1576205A1 Plating of multi-layer structures |
| 09/21/2005 | EP1576203A2 Reduction of surface oxidation during electroplating |
| 09/21/2005 | EP1575715A1 Arrangement for treating the inner surface of a metal tube |
| 09/21/2005 | CN1670259A Additive for plating bath |
| 09/21/2005 | CN1670246A Method for keeping metallized fused bath |
| 09/20/2005 | US6946386 Process for producing ultrathin homogenous metal layers |
| 09/20/2005 | US6946161 Method for forming porous silica film |
| 09/15/2005 | WO2005085496A2 Ferroelectric thin film composites with improved top contact adhesion and devices containing the same |
| 09/15/2005 | US20050202599 Method of forming metal pattern having low resistivity |
| 09/15/2005 | US20050199679 Sn-ag based lead-free solder |
| 09/15/2005 | US20050199587 Ething with solution of permanganate salt and mineral acid, activating with palladium salt and amine complexor (2-amino pyridine), contacting with reducing agent (sodium borohydride in caustic solution), the electroless plating |
| 09/15/2005 | US20050199489 Electroless deposition apparatus |
| 09/14/2005 | EP1574600A1 Cup type plating equipment |
| 09/14/2005 | EP1574599A1 Copper electrolytic solution and electrolytic copper foil produced therewith |
| 09/14/2005 | EP1573091A1 Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor |
| 09/14/2005 | EP1573087A1 Copper activator solution and method for semiconductor seed layer enhancement |
| 09/14/2005 | EP1572788A2 Surface treatment of polyacetal articles |
| 09/14/2005 | CN1669163A Composite current collector |
| 09/14/2005 | CN1668784A Metal strip for the manufacture of components for electrical connectors |
| 09/14/2005 | CN1668783A Electromagnetic wave shield material and process for producing the same |
| 09/14/2005 | CN1668778A Substrates comprising a photocatalytic TiO2 layer |
| 09/14/2005 | CN1668777A Process for metallising support media made from plastic material |
| 09/14/2005 | CN1668545A Article having nano-scaled structures and a process for making such article |
| 09/14/2005 | CN1667158A Chemically plated conductive powder and manufacturing method thereof |
| 09/14/2005 | CN1667157A Chemically plated conductive powder and manufacturing method thereof |
| 09/14/2005 | CN1219110C Method for preventing magnesium and its alloy parts from corrosion and wearing |
| 09/13/2005 | US6942351 a flat glass substrate in the form of a glass sheet covered by a tin alloy activation layer, then silver coating and at least one lead-free paint layer covering the silver coating; free of protective coating; corrosion resistance |
| 09/09/2005 | WO2005049887A3 Methods for the deposition of silver oxide films and patterned films |
| 09/08/2005 | US20050196523 Uniform copper wiring formation in recesses; heat accelerated solution deposition |
| 09/08/2005 | US20050194259 conductive particles applied to substrate in such a manner that they are in mechanical and therefore also electrical contact with one another over the entire surface of the substrate. Consequently, it is possible to generate a homogenous i.e. completely continuous, metal layer |
| 09/08/2005 | US20050194256 Maintenance of metallization baths |
| 09/07/2005 | EP1571235A2 Tinning method for copper tubular pieces |
| 09/07/2005 | EP1570117A1 Vessel for holding silicon and method of producing the same |
| 09/07/2005 | CN1666583A Metallised parts made from plastic material |
| 09/01/2005 | WO2005080634A1 Method for forming plating film, electromagnetic shielding material and casing |
| 09/01/2005 | WO2005080633A2 Method for zinc coating aluminum |
| 09/01/2005 | WO2005080485A1 Plated resin formed body |
| 09/01/2005 | WO2005080075A1 Plated resin formed article |
| 09/01/2005 | WO2005038084A3 Selective self-initiating electroless capping of copper with cobalt-containing alloys |
| 09/01/2005 | US20050191786 Integrated circuit packaging using electrochemically fabricated structures |
| 09/01/2005 | US20050191586 UV curable silver chloride compositions for producing silver coatings |
| 09/01/2005 | US20050191505 and a matrix material, such that the titanium oxide exhibits a concentration gradient in the matrix material and is enriched at the surface; sterile coatings used in medical equipment; hygiene |
| 09/01/2005 | US20050189628 Resin composition, process for producing the same and electrophotographic fixing member |
| 09/01/2005 | US20050189213 Method and apparatus for copper plating using electroless plating and electroplating |
| 08/31/2005 | EP1568744A1 Composition for porous film formation, porous film, process for producing the same, interlayer insulation film and semiconductor device |
| 08/31/2005 | EP1567695A1 Methods for forming copper interconnect structures by co-plating of noble metals and structures formed thereby |
| 08/31/2005 | CN1663035A Temperature control sequence of electroless plating baths |
| 08/31/2005 | CN1661131A Plating liquid for nickel-titanium alloy to coat nickel, cobalt and tungsten through chemical technology and technique method |
| 08/31/2005 | CN1217030C Method for plating polymer molding material, circuit forming component and method for producing circuit forming component |
| 08/31/2005 | CN1217029C Electroosmosis regeneration system for chemical sedimentation groove electrolyte |
| 08/30/2005 | US6936564 From deposition solution which comprises homogeneously dissolved platinum group metal compound, a reducing agent, control agent selected from isopolyacids and heteropolyacids of niobium, tantalum, molybdenum, vanadium, tungsten |
| 08/30/2005 | US6936302 Electroless Ni-B plating liquid, electronic device and method for manufacturing the same |
| 08/30/2005 | US6936100 Method of producing a crystalline ITO dispersed solution |
| 08/30/2005 | US6935008 Method for making metallic cord |
| 08/25/2005 | WO2005079126A2 Metal deposition |
| 08/25/2005 | WO2005078162A1 Diamond tool |
| 08/25/2005 | WO2005076977A2 Plating apparatus and method |
| 08/25/2005 | WO2005038094A3 Apparatus for electroless deposition |
| 08/25/2005 | WO2005031035B1 Method for producing thin semiconductor films by deposition from solution |
| 08/25/2005 | US20050186332 Forming an electroless nickel plating layer having an even thickness in a reliable manner; chromium and copper thin films are formed next sequentially on the surface of the supporting board exposed from the insulating base layer and on the entire surface of the insulating base layer |
| 08/25/2005 | US20050186250 Metallic structures incorporating bioactive materials and methods for creating the same |
| 08/25/2005 | US20050183958 Method and apparatus for real time monitoring of industrial electrolytes |