Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
02/2006
02/09/2006US20060029743 Wood preservatives and methods of wood preservation
02/09/2006US20060027461 Tin-silver electrolyte
02/09/2006DE102004047423B3 Außenstromlos aufgebrachte Nickellegierung und ihre Verwendung Electrolessly deposited nickel alloy and their use
02/09/2006DE102004033979A1 Verfahren zur Verbesserung der Lötfähigkeit von Nickelüberzügen Process for improving the solderability of nickel coatings
02/09/2006CA2570272A1 Method of plating mineral filled polyamide compositions and articles formed thereby
02/08/2006EP1624468A1 Liquid composition for forming ferroelectric thin film and method for forming ferroelectric thin film
02/08/2006EP1624088A1 Method of producing laminate body having thin metal layer
02/08/2006EP1622761A2 Object
02/08/2006EP1622729A1 Corrosion protection on metals
02/08/2006CN1732549A Metallization of carbon nanotubes for field emission applications
02/08/2006CN1732289A Method for forming thin silver mirror film, and method for forming coating film comprising thin silver mirror film
02/08/2006CN1730724A Chemical bronze plating liquid of mixing type non-formaldehyde reducer
02/08/2006CN1730723A Powder body material surface treatment method and device
02/08/2006CN1240561C Processing method of creating rainbow color, method of manufacturing article which presents rainbow-colored reflective luster, and article which presents rainbow-colored reflective luster
02/02/2006WO2006010914A1 Improved deposition process
02/02/2006WO2006010639A2 Method of manufacturing an electronic circuit device through a direct write technique
02/02/2006WO2005065208A3 Apparatus and method for treating used electroless plating solutions
02/02/2006US20060024960 Method for producing thin semiconductor films by deposition from solution
02/02/2006US20060024937 Methods for forming wiring and electrode
02/02/2006US20060024514 Electroless plating with nanometer particles
02/02/2006US20060024447 Electroless plating with nanometer particles
02/02/2006US20060024430 Silver plating in electronics manufacture
02/01/2006EP1622435A1 Method of manufacturing an electronic circuit assembly using direct write techniques
02/01/2006EP1620580A1 Polytetrafluoroethylene dispersion for electroless nickel plating applications
02/01/2006CN1729236A Surface treatment of polyacetal articles
02/01/2006CN1239622C Polyimide resin precursor solution, laminates for electronic components made by using the solution and process for production of the laminates
01/2006
01/31/2006US6992018 Chemical fluid deposition for the formation of metal and metal alloy films on patterned and unpatterned substrates
01/31/2006US6992016 Chemical processing method, and method of manufacturing semiconductor device
01/31/2006US6992000 Method of plating nonconductor product
01/31/2006US6991675 Electroless displacement gold plating solution and additive for use in preparing plating solution
01/26/2006WO2005114707A3 Materials suitable for shallow trench isolation
01/26/2006US20060016692 Reduction of surface oxidation during electroplating
01/26/2006DE102004032659A1 Vorrichtung und Verfahren zum chemischen oder elektrolytischen Behandeln von Behandlungsgut sowie die Verwendung der Vorrichtung Apparatus and method for chemical or electrolytic treatment of material to be treated and to the use of the device
01/26/2006CA2574173A1 Nickel coated copper powder and process for producing the same
01/25/2006EP1618228A1 Use of an object as a decorative component
01/25/2006EP1618080A2 Oxidation inhibition of carbon-carbon composites
01/25/2006EP1532295B1 Device and method for regenerating an electroless metal plating bath
01/25/2006CN1726431A Nanometer-scale engineered structures, methods and apparatus for fabrication thereof, and applications to mask repair, enhancement, and fabrications
01/25/2006CN1726310A Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor
01/25/2006CN1726309A Copper electrolytic solution and electrolytic copper foil produced therewith
01/25/2006CN1726259A Thermoplastic polyimide resin film, multilayer body and method for manufacturing printed wiring board composed of same
01/25/2006CN1238873C Ceramic electronic parts and its making method
01/25/2006CN1238570C Coating method
01/25/2006CN1238442C Resin material for decoration and swellant for deterging and eliminating the resin material
01/25/2006CN1238145C Hollow metal particle with microbe cell template and its preparation process
01/24/2006US6989329 Method of manufacturing a wiring substrate and an electroless copper plating solution for providing interlayer connections
01/19/2006WO2006006688A1 Conductive microparticle, process for producing the same and anisotropic conductive material
01/19/2006WO2006006687A1 Conductive microparticle, process for producing the same and anisotropic conductive material
01/19/2006US20060014028 Mesostructured film, porous film and the method of preparing the same
01/19/2006US20060013960 Apparatus and method for processing a substrate
01/19/2006US20060011094 Wood preservative composition
01/18/2006EP1617467A1 Process for producing dielectric insulating thin film, and dielectric insulating material
01/18/2006EP1616044A2 Use of an object as an electronic component
01/18/2006EP1615767A1 Rapid prototyping process
01/18/2006EP1615766A2 Use of an object as shaping tool
01/18/2006CN1722374A Substrate proximity processing structures and methods for using and making the same
01/18/2006CN1722372A Proximity head heating method and apparatus
01/18/2006CN1237206C Method for preparing corrosion-resisting wearing-resisting coat used for magnesium and alloy thereof
01/18/2006CN1237205C Solution for forming strong dielectric film and process for forming strong dielectric film
01/12/2006WO2006002969A2 Device and method for chemically and electrolytically treating work pieces
01/12/2006US20060008629 Molded article, injection molding method and apparatus
01/12/2006DE102004030104A1 Wässerig/organische Metalloxid-Dispersion und mit damit hergestellte beschichtete Substrate und Formkörper Aqueous / organic metal oxide dispersion and coated substrates and shaped articles made therefrom with
01/11/2006EP1614772A1 Surface-treated titanium material excellent in oxidation resistance, production method thereof, and engine exhaust system
01/11/2006EP1614771A1 Tin-coated printed circuit boards with a low tendency to the whisker formation
01/11/2006EP1613440A2 Improved coating for silver plated circuits
01/11/2006CN1720355A Metal plating structure and method for production thereof
01/11/2006CN1720354A Methods for forming interconnect structures by co-plating of noble metals and structures formed thereby
01/11/2006CN1718855A Environmental protection type metal surface alloy catalytic liquid
01/10/2006US6984584 Contamination suppression in chemical fluid deposition
01/10/2006US6984446 Process for producing a metal layer on a substrate body, and substrate body having a metal layer
01/10/2006US6984414 mesostructured thin film having an oriented rod-like pore structure is formed on a surface of a polyimide compound containing a sequence of two or more adjacent methylene groups in the repeating unit of the molecule
01/05/2006WO2005066388A3 Metallic substrates comprising a deformable glass-type coating
01/05/2006US20060003107 Coating with both primer and base coating function, method of producing inmold decoration products and inmold decoration product
01/05/2006US20060001726 Printable conductive features and processes for making same
01/05/2006US20060000720 Method for pretreating a surface of a non-conducting material to be plated
01/04/2006EP1612295A1 Coated metal substrate and process for its preparing
01/04/2006EP1612040A1 Stainless-steel foils with inorganic/organic hybrid film coating
01/04/2006CN1716391A Method of treating a substrate for electroless plating and magnetic recording medium and magnetic recording device thereof
01/04/2006CN1715444A Method for metallizing plastic surfaces
01/04/2006CN1715443A Surface-treated titanium material excellent in oxidation resistance, production method thereof, and engine exhaust system
01/04/2006CN1715270A Uv decomposable molecules and a photopatternable monomolecular film formed therefrom
01/03/2006US6982863 Component formation via plating technology
01/03/2006US6982030 Reduction of surface oxidation during electroplating
01/03/2006CA2175909C Ammonia-free deposition of copper by disproportionation
12/2005
12/29/2005WO2005125291A1 Elimination of copper for producing strip conductors
12/29/2005WO2005123987A1 Tin-based plating film and method for forming the same
12/29/2005WO2005123980A2 Aqueous/organic metal oxide dispersion and coated substrates and mouldings produced therewith
12/29/2005WO2005123308A1 Copper-containing tin powder and method for producing the copper-containing tin powder, and electroconductive paste using the copper-containing tin powder
12/29/2005WO2005039814A3 Laser processing for heat-sensitive mesoscale deposition
12/29/2005US20050287691 Method for doping quantum dots
12/29/2005US20050287305 Methods of forming conductive interconnects, and methods of depositing nickel
12/29/2005US20050287304 Method of treating a substrate for electroless plating and method of increasing adhesion therebetween, and magnetic recording medium and magnetic recording device thereof
12/29/2005US20050284544 Surface-treated titanium material excellent in oxidation resistance, production method thereof, and engine exhaust system
12/29/2005DE102004052135A1 Coated metal substrate especially a hard metal with a wear protection layer consisting of high purity Al2O3 nanocrystals and containing residual pressure stresses useful in tool production
12/29/2005DE102004001107B4 Strukturierung auf Oberflächen mittels Folie Structuring of surfaces by film
12/29/2005DE10052449B4 Verfahren zur Metallisierung von Polymeroberflächen A method for metallizing polymer surfaces
12/29/2005CA2571135A1 Copper-containing tin powder and method for producing the copper-containing tin powder, and electroconductive paste using the copper-containing tin powder
12/28/2005EP1610597A1 Precipitation of copper for producing conductive tracks
12/28/2005EP1610375A2 Contact carriers for populating substrates with spring contacts
12/28/2005EP1610132A2 Fabricating interconnects using sacrificial substrates
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