Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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02/09/2006 | US20060029743 Wood preservatives and methods of wood preservation |
02/09/2006 | US20060027461 Tin-silver electrolyte |
02/09/2006 | DE102004047423B3 Außenstromlos aufgebrachte Nickellegierung und ihre Verwendung Electrolessly deposited nickel alloy and their use |
02/09/2006 | DE102004033979A1 Verfahren zur Verbesserung der Lötfähigkeit von Nickelüberzügen Process for improving the solderability of nickel coatings |
02/09/2006 | CA2570272A1 Method of plating mineral filled polyamide compositions and articles formed thereby |
02/08/2006 | EP1624468A1 Liquid composition for forming ferroelectric thin film and method for forming ferroelectric thin film |
02/08/2006 | EP1624088A1 Method of producing laminate body having thin metal layer |
02/08/2006 | EP1622761A2 Object |
02/08/2006 | EP1622729A1 Corrosion protection on metals |
02/08/2006 | CN1732549A Metallization of carbon nanotubes for field emission applications |
02/08/2006 | CN1732289A Method for forming thin silver mirror film, and method for forming coating film comprising thin silver mirror film |
02/08/2006 | CN1730724A Chemical bronze plating liquid of mixing type non-formaldehyde reducer |
02/08/2006 | CN1730723A Powder body material surface treatment method and device |
02/08/2006 | CN1240561C Processing method of creating rainbow color, method of manufacturing article which presents rainbow-colored reflective luster, and article which presents rainbow-colored reflective luster |
02/02/2006 | WO2006010914A1 Improved deposition process |
02/02/2006 | WO2006010639A2 Method of manufacturing an electronic circuit device through a direct write technique |
02/02/2006 | WO2005065208A3 Apparatus and method for treating used electroless plating solutions |
02/02/2006 | US20060024960 Method for producing thin semiconductor films by deposition from solution |
02/02/2006 | US20060024937 Methods for forming wiring and electrode |
02/02/2006 | US20060024514 Electroless plating with nanometer particles |
02/02/2006 | US20060024447 Electroless plating with nanometer particles |
02/02/2006 | US20060024430 Silver plating in electronics manufacture |
02/01/2006 | EP1622435A1 Method of manufacturing an electronic circuit assembly using direct write techniques |
02/01/2006 | EP1620580A1 Polytetrafluoroethylene dispersion for electroless nickel plating applications |
02/01/2006 | CN1729236A Surface treatment of polyacetal articles |
02/01/2006 | CN1239622C Polyimide resin precursor solution, laminates for electronic components made by using the solution and process for production of the laminates |
01/31/2006 | US6992018 Chemical fluid deposition for the formation of metal and metal alloy films on patterned and unpatterned substrates |
01/31/2006 | US6992016 Chemical processing method, and method of manufacturing semiconductor device |
01/31/2006 | US6992000 Method of plating nonconductor product |
01/31/2006 | US6991675 Electroless displacement gold plating solution and additive for use in preparing plating solution |
01/26/2006 | WO2005114707A3 Materials suitable for shallow trench isolation |
01/26/2006 | US20060016692 Reduction of surface oxidation during electroplating |
01/26/2006 | DE102004032659A1 Vorrichtung und Verfahren zum chemischen oder elektrolytischen Behandeln von Behandlungsgut sowie die Verwendung der Vorrichtung Apparatus and method for chemical or electrolytic treatment of material to be treated and to the use of the device |
01/26/2006 | CA2574173A1 Nickel coated copper powder and process for producing the same |
01/25/2006 | EP1618228A1 Use of an object as a decorative component |
01/25/2006 | EP1618080A2 Oxidation inhibition of carbon-carbon composites |
01/25/2006 | EP1532295B1 Device and method for regenerating an electroless metal plating bath |
01/25/2006 | CN1726431A Nanometer-scale engineered structures, methods and apparatus for fabrication thereof, and applications to mask repair, enhancement, and fabrications |
01/25/2006 | CN1726310A Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor |
01/25/2006 | CN1726309A Copper electrolytic solution and electrolytic copper foil produced therewith |
01/25/2006 | CN1726259A Thermoplastic polyimide resin film, multilayer body and method for manufacturing printed wiring board composed of same |
01/25/2006 | CN1238873C Ceramic electronic parts and its making method |
01/25/2006 | CN1238570C Coating method |
01/25/2006 | CN1238442C Resin material for decoration and swellant for deterging and eliminating the resin material |
01/25/2006 | CN1238145C Hollow metal particle with microbe cell template and its preparation process |
01/24/2006 | US6989329 Method of manufacturing a wiring substrate and an electroless copper plating solution for providing interlayer connections |
01/19/2006 | WO2006006688A1 Conductive microparticle, process for producing the same and anisotropic conductive material |
01/19/2006 | WO2006006687A1 Conductive microparticle, process for producing the same and anisotropic conductive material |
01/19/2006 | US20060014028 Mesostructured film, porous film and the method of preparing the same |
01/19/2006 | US20060013960 Apparatus and method for processing a substrate |
01/19/2006 | US20060011094 Wood preservative composition |
01/18/2006 | EP1617467A1 Process for producing dielectric insulating thin film, and dielectric insulating material |
01/18/2006 | EP1616044A2 Use of an object as an electronic component |
01/18/2006 | EP1615767A1 Rapid prototyping process |
01/18/2006 | EP1615766A2 Use of an object as shaping tool |
01/18/2006 | CN1722374A Substrate proximity processing structures and methods for using and making the same |
01/18/2006 | CN1722372A Proximity head heating method and apparatus |
01/18/2006 | CN1237206C Method for preparing corrosion-resisting wearing-resisting coat used for magnesium and alloy thereof |
01/18/2006 | CN1237205C Solution for forming strong dielectric film and process for forming strong dielectric film |
01/12/2006 | WO2006002969A2 Device and method for chemically and electrolytically treating work pieces |
01/12/2006 | US20060008629 Molded article, injection molding method and apparatus |
01/12/2006 | DE102004030104A1 Wässerig/organische Metalloxid-Dispersion und mit damit hergestellte beschichtete Substrate und Formkörper Aqueous / organic metal oxide dispersion and coated substrates and shaped articles made therefrom with |
01/11/2006 | EP1614772A1 Surface-treated titanium material excellent in oxidation resistance, production method thereof, and engine exhaust system |
01/11/2006 | EP1614771A1 Tin-coated printed circuit boards with a low tendency to the whisker formation |
01/11/2006 | EP1613440A2 Improved coating for silver plated circuits |
01/11/2006 | CN1720355A Metal plating structure and method for production thereof |
01/11/2006 | CN1720354A Methods for forming interconnect structures by co-plating of noble metals and structures formed thereby |
01/11/2006 | CN1718855A Environmental protection type metal surface alloy catalytic liquid |
01/10/2006 | US6984584 Contamination suppression in chemical fluid deposition |
01/10/2006 | US6984446 Process for producing a metal layer on a substrate body, and substrate body having a metal layer |
01/10/2006 | US6984414 mesostructured thin film having an oriented rod-like pore structure is formed on a surface of a polyimide compound containing a sequence of two or more adjacent methylene groups in the repeating unit of the molecule |
01/05/2006 | WO2005066388A3 Metallic substrates comprising a deformable glass-type coating |
01/05/2006 | US20060003107 Coating with both primer and base coating function, method of producing inmold decoration products and inmold decoration product |
01/05/2006 | US20060001726 Printable conductive features and processes for making same |
01/05/2006 | US20060000720 Method for pretreating a surface of a non-conducting material to be plated |
01/04/2006 | EP1612295A1 Coated metal substrate and process for its preparing |
01/04/2006 | EP1612040A1 Stainless-steel foils with inorganic/organic hybrid film coating |
01/04/2006 | CN1716391A Method of treating a substrate for electroless plating and magnetic recording medium and magnetic recording device thereof |
01/04/2006 | CN1715444A Method for metallizing plastic surfaces |
01/04/2006 | CN1715443A Surface-treated titanium material excellent in oxidation resistance, production method thereof, and engine exhaust system |
01/04/2006 | CN1715270A Uv decomposable molecules and a photopatternable monomolecular film formed therefrom |
01/03/2006 | US6982863 Component formation via plating technology |
01/03/2006 | US6982030 Reduction of surface oxidation during electroplating |
01/03/2006 | CA2175909C Ammonia-free deposition of copper by disproportionation |
12/29/2005 | WO2005125291A1 Elimination of copper for producing strip conductors |
12/29/2005 | WO2005123987A1 Tin-based plating film and method for forming the same |
12/29/2005 | WO2005123980A2 Aqueous/organic metal oxide dispersion and coated substrates and mouldings produced therewith |
12/29/2005 | WO2005123308A1 Copper-containing tin powder and method for producing the copper-containing tin powder, and electroconductive paste using the copper-containing tin powder |
12/29/2005 | WO2005039814A3 Laser processing for heat-sensitive mesoscale deposition |
12/29/2005 | US20050287691 Method for doping quantum dots |
12/29/2005 | US20050287305 Methods of forming conductive interconnects, and methods of depositing nickel |
12/29/2005 | US20050287304 Method of treating a substrate for electroless plating and method of increasing adhesion therebetween, and magnetic recording medium and magnetic recording device thereof |
12/29/2005 | US20050284544 Surface-treated titanium material excellent in oxidation resistance, production method thereof, and engine exhaust system |
12/29/2005 | DE102004052135A1 Coated metal substrate especially a hard metal with a wear protection layer consisting of high purity Al2O3 nanocrystals and containing residual pressure stresses useful in tool production |
12/29/2005 | DE102004001107B4 Strukturierung auf Oberflächen mittels Folie Structuring of surfaces by film |
12/29/2005 | DE10052449B4 Verfahren zur Metallisierung von Polymeroberflächen A method for metallizing polymer surfaces |
12/29/2005 | CA2571135A1 Copper-containing tin powder and method for producing the copper-containing tin powder, and electroconductive paste using the copper-containing tin powder |
12/28/2005 | EP1610597A1 Precipitation of copper for producing conductive tracks |
12/28/2005 | EP1610375A2 Contact carriers for populating substrates with spring contacts |
12/28/2005 | EP1610132A2 Fabricating interconnects using sacrificial substrates |