Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
07/2006
07/27/2006US20060165909 Producing solderable and bondable copper printed circuit boards by a two step displacement plating reaction: 1) depositing Ag on the substrate and 2) plating Ag on said substrate; Ag is deposited in the 1st step at a rate that is at most half the rate of plating of Ag in the 2nd step
07/27/2006US20060163075 Method and apparatus for downhole pipe or casing repair
07/27/2006DE102005003723A1 Thermopile e.g. for measuring temperature differences, has thin-film or thick-film conductor paths on substrate
07/26/2006EP1683571A1 Patterning method, substrate for biomolecule immobilization using the patterning method, and biochip employing the substrate
07/26/2006EP1683207A1 Oxide superconductiong film and method of preparing the same
07/26/2006EP1682695A2 Selective self-initiating electroless capping of copper with cobalt-containing alloys
07/26/2006EP1682694A1 Method for metallizing a component comprising parts of different non-metallic materials
07/26/2006CN1809654A Process for the preparation of metal oxide coated organic material by microwave deposition
07/26/2006CN1809609A Modified polyacetals for plating
07/26/2006CN1807686A Surface anti-rust treatment method for powder moulded permanent magnet
07/26/2006CN1807682A Electroless nickel-phosphorus plating process for Nd-Fe-Bo permanent magnet material
07/26/2006CN1266079C Ceramic material and its manufacture method
07/25/2006US7081304 Surface conductive resin, process for forming the same and wiring board
07/20/2006WO2006076248A1 Patterned wafer thickness detection system
07/20/2006WO2006075796A1 Metal film and formation method of metal film
07/20/2006WO2006075782A1 Method for producing plated resin formed article
07/20/2006WO2006074902A2 Method for depositing palladium layers and palladium bath therefor
07/20/2006US20060159859 Silane polymer and method for forming silicon film
07/20/2006US20060157860 Semiconductor constructions
07/19/2006EP1681372A1 Electroless copper plating solution and method for electroless copper plating
07/19/2006EP1681371A1 Plating solution for electroless copper plating
07/19/2006EP1681370A2 Process for producing photocatalytically active TiO2 particles and substrates with photocatalytic TiO2 layer
07/19/2006CN1806356A Method of producing membrane electrode assemblies
07/19/2006CN1805912A Method of preparing layers of oxides of metallic elements
07/19/2006CN1804141A Method for producing plated molded button of mobile phone
07/19/2006CN1804140A Method for producing mobile phone button
07/19/2006CN1804118A Method for chemical plating nickel-boron alloy on magnesium alloy surface
07/19/2006CN1265398C Method for forming pattern of transparent conductive membrane
07/19/2006CN1265028C Method for forming electroplated coating on surface of article
07/19/2006CN1265022C Preparation of coating solution for forming transparent conducting layer
07/18/2006US7078789 Method of forming a metal film, semiconductor device and wiring board
07/18/2006US7078340 Metal deposit process
07/18/2006US7077895 Coating compound for forming titanium oxide film, method for forming titanium oxide film and metal susbstrate coated with titanium oxide film
07/13/2006WO2006049776A3 Ink-jet printing of coupling agents for trace or circuit deposition templating
07/13/2006US20060154099 Multilayer body and method for producing same
07/13/2006US20060153983 Hydrothermal deposition of thin and adherent metal oxide coatings for high temperature corrosion protection
07/13/2006US20060153982 Electrode for electrochemical processes and method for producing the same
07/12/2006EP1679390A2 Method for forming a protective layer on a metallic turbine substrate
07/12/2006EP1678761A1 Electrical connection of components
07/12/2006EP1678351A1 Method and system for selectively coating metal surfaces
07/12/2006EP1622729B1 Corrosion protection on metals
07/12/2006CN1802452A Electroless gold plating solution
07/12/2006CN1802451A Electroless gold plating solution
07/11/2006US7075170 Semiconductor device and production method therefor
07/11/2006US7074640 Method of making barrier layers
07/11/2006US7074548 Using raw material fluid containing alcohol, supercritical fluid or liquid, and a condensation polymer containing an element of a target metal oxide compound, which may be prepared from a metal oxide.
07/11/2006US7074315 For depositing copper coating onto surface of a printed circuit board
07/11/2006CA2217843C Plating turbine engine components
07/06/2006US20060147699 Protective ceramic coating
07/06/2006US20060145351 Adhesion of a metal layer to a substrate and related structures
07/06/2006US20060144714 Substrate plating method and apparatus
07/06/2006US20060144293 Coating solutions for use in forming bismuth-based ferroelectric thin films and a method of forming bismuth-based ferroelectric thin films using the coating solutions
07/05/2006EP1676937A1 UV curable catalyst compositions
07/05/2006EP1676295A2 Apparatus to improve wafer temperature uniformity for face-up wet processing
07/05/2006EP1499452A4 Process for preparing palladium alloy composite membranes for use in hydrogen separation, palladium alloy composite membranes and products incorporating or made from the membranes
07/05/2006CN2793102Y Chemical nickel-coater on internal cavity surface of aluminium alloy radiator
07/05/2006CN1799293A Method for the structured metal-coating of polymeric and ceramic support materials, and compound that can be activated and is used in said method
07/05/2006CN1798869A Method for producing metal conductors on a substrate
07/05/2006CN1798868A Electroless deposition method
07/05/2006CN1798797A Method for producing scratch-resistant coating systems devoid of condensation
07/05/2006CN1798481A Method for producing inorganic pattern on polyimide resin
07/05/2006CN1796611A Method for preparing plating seeds layer on electronic component
07/05/2006CN1796600A Method for preparing Nano composite thin film of generic diamond by pyrolyzing precursor of polymer
07/05/2006CN1262688C Bronze plating additive, method for making same and use in bronze plating on tread band steel wire
07/05/2006CN1262687C Liquid cement gold-plating mirror formulation and technical method thereof
07/05/2006CN1262686C Submicron non metallic microsphere with nano metal film and its preparation method
07/05/2006CN1262685C Submicron non metallic microsphere with metal and electrolyle double layer nano film and its preparation method
07/04/2006US7071084 Methods for forming wiring and electrode
07/04/2006US7071013 Fixture and method for uniform electroless metal deposition on integrated circuit bond pads
07/04/2006US7070757 Catalysts produced by electroless deposition of at least one platinum metal on a nonporous nonmetallic support can be used for the synthesis of hydrogen peroxide from the elements and for the hydrogenation of organic compounds.
07/04/2006US7070689 Acid dip for zinc-manganese alloy electrodeposition
07/04/2006US7070687 Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing
06/2006
06/29/2006WO2006041657A9 Maskless direct write of copper using an annular aerosol jet
06/29/2006US20060141142 Multilayered optical structures
06/29/2006DE69635227T2 Kontakträger zum bestücken von substraten mit federkontakten Contact carrier of fitting substrates with spring contacts
06/28/2006EP1675161A1 Ferroelectric material, manufacturing method and ferroelectric memory
06/28/2006EP1675132A1 R-T-B permanent magnet and plating film
06/28/2006EP1674598A1 Solution for the selective removal of metal from aluminium substrates
06/28/2006CN1795291A Method for the formation of a coating of metal oxides on an electrically-conducting substrate, resultant activated cathode and use thereof for the electrolysis of aqueous solutions of alkaline metal c
06/28/2006CN1794441A Manufacturable cowp metal cap process for copper interconnects
06/28/2006CN1793426A Process for copper coating on surface of magnesium and magnesium alloy
06/28/2006CN1793425A Process for compound surface sheilding of metal magnesium and magnesium alloy
06/28/2006CN1793424A Process for silver caating on surface of magnesium and magnesium alloy
06/28/2006CN1793421A Process for preparing composite material of carbon nano tube/NiZn ferrite
06/28/2006CN1793408A Pantograph slip plate for electric locomotive and mfg. method thereof
06/28/2006CN1792434A Uv curable catalyst compositions
06/28/2006CN1261618C Pretreating agent for plating and method for metal plating using the same
06/27/2006US7067423 Electroless plating apparatus, semiconductor wafer having bumps, semiconductor chip having bumps, methods of manufacturing the semiconductor wafer and the semiconductor chip, semiconductor device, circuit board, and electronic equipment
06/27/2006US7067172 Component formation via plating technology
06/27/2006US7067069 A polysilane compound represented by the formula SinRm (n is an integer 3 or more, mis an integer of n to (2n+2)and m number of R's are each independently hydrogen, alkyl, phenyl or halogen; atleast one cyclic silane polymer
06/22/2006WO2006065819A2 Metal components with silicon-containing protective coatings and methods of forming such protective coatings
06/22/2006WO2006065321A1 Method for forming anti-reflective coating
06/22/2006WO2006065221A1 Stabilization amd performance of autocatalytic electroless processes.
06/22/2006WO2006041117A8 Plating material, polyamic acid solution using said plating material, polyimide resin solution, and printed wiring board using them
06/22/2006US20060135001 Method for low temperature growth of inorganic materials from solution using catalyzed growth and re-growth
06/22/2006US20060134442 Method for electroless plating
06/22/2006US20060134338 Method and apparatus for forming a metallic feature on a substrate
06/22/2006US20060134318 Method of forming a conductive metal region on a substrate
06/21/2006EP1670969A1 Method for treating ferrous alloy pieces by sulphidisation
06/21/2006EP1670610A2 Laser processing for heat-sensitive mesoscale deposition
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