| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
|---|
| 12/28/2005 | EP1608795A2 Method for the formation of a coating of metal oxides on an electrically-conducting substrate, resultant activated cathode and use thereof for the electrolysis of aqueous solutions of alkaline metal chlorides |
| 12/28/2005 | EP1608791A2 Aluminum phosphate coatings |
| 12/28/2005 | CN1712564A Electroplating liquid of rare-earth-nickel-molybdenum-phosphorus-tungsten carbide alloy |
| 12/28/2005 | CN1712563A Fast chemical plating liquid of rare-earth-nickel-molybdenum-phosphorus alloy at low-temperature |
| 12/28/2005 | CN1712562A Non-electrolytic gold plating method on polycarbnate contained resin |
| 12/28/2005 | CN1233871C Method for preparing ferroelectric thin film / thick film |
| 12/27/2005 | US6979645 Method of producing a semiconductor device having copper wiring |
| 12/25/2005 | CA2510123A1 Tin-coated printed circuit boards with low tendency to whisker formation |
| 12/22/2005 | US20050282399 Electroformed metallization |
| 12/22/2005 | US20050282384 Method for forming protective film and electroless plating bath |
| 12/22/2005 | US20050281947 Substrate processing unit and substrate processing apparatus |
| 12/22/2005 | US20050280130 Printed wiring board and production method for printed wiring board |
| 12/22/2005 | DE102004025671A1 Anordnung zur Verabreichung eines atembaren Gases, insbesondere CPAP-Geräteanordnung Arrangement for administering a breathable gas, in particular CPAP device arrangement |
| 12/21/2005 | EP1607496A1 Electroformed metallization |
| 12/21/2005 | EP1607375A2 Titanium silicate films with high dielectric constant |
| 12/21/2005 | EP1606431A1 Solution for etching copper surfaces and method of depositing metal on copper surfaces |
| 12/21/2005 | EP1579467A4 Metallization of carbon nanotubes for field emission applications |
| 12/21/2005 | CN1711620A Enhanced field emission from carbon nanotubes mixed with particles |
| 12/21/2005 | CN1232677C Regeneration method for a plating solution |
| 12/20/2005 | US6977016 Surface modified stainless steel |
| 12/15/2005 | WO2005118690A1 A method for hardening at a surface a component, devices having one or more hardened surfaces and devices for retaining and presenting for use a plurality of components |
| 12/15/2005 | WO2005118158A1 Electroless plating of piezoelectric ceramic |
| 12/15/2005 | WO2005118121A2 Kinetic shear mixer and method |
| 12/15/2005 | US20050277304 Titanium silicate films with high dielectric constant |
| 12/15/2005 | US20050276992 Method for metallizing a non-metallic surface and the metallized surface structure thereof |
| 12/15/2005 | US20050276914 Method for manufacturing light guide plate mold cores |
| 12/15/2005 | US20050274605 Method and apparatus for applying a voltage to a substrate during plating |
| 12/14/2005 | EP1579029A3 Method and apparatus for electroless deposition with temperature-controlled chuck |
| 12/14/2005 | CN1707759A Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer |
| 12/14/2005 | CN1231527C Pre-treatment of plastic |
| 12/13/2005 | US6975063 Metallization of carbon nanotubes for field emission applications |
| 12/13/2005 | US6974776 Activation plate for electroless and immersion plating of integrated circuits |
| 12/13/2005 | US6974643 Servo pattern formation via transfer of sol-gel layer and magnetic media obtained thereby |
| 12/08/2005 | WO2005117168A1 Active material particle for nonaqueous electrolyte secondary battery |
| 12/08/2005 | WO2005117029A1 Nickel compound containing solution, method for production thereof, and method for forming thin nickel metal film using the same |
| 12/08/2005 | WO2005115639A1 Method for forming hydrophilic inorganic coating layer |
| 12/08/2005 | WO2005115486A1 System for administering a respirable gas, especially a cpap apparatus system |
| 12/08/2005 | WO2005115151A1 Functional sol-gel coating agents |
| 12/08/2005 | WO2005058789A3 Copper (i) formate complexes |
| 12/08/2005 | US20050271827 Solar cell based on CulnS2 absorber layer prepared by chemical spray pyrolysis |
| 12/08/2005 | US20050271826 Film forming method, spacer utilizing the same and producing method for thin flat panel display |
| 12/08/2005 | US20050271823 Mixing a sol-gel raw material including a hydrolysis-condensation product of a metal alkoxide (metals are Pb, Ta or Nb, and Zr, Ti, V, W, or Hf) and polycarboxylic acid or ester, and an organic solvent; and forming a salt from the sol-gel |
| 12/08/2005 | DE19726850B4 Verfahren zur Herstellung vonr Leiterplatten Process for the preparation ofR boards |
| 12/08/2005 | DE19713359B4 Spinnrotor für eine Offenend-Spinnmaschine und Verfahren zu seiner Beschichtung Spinning rotor for an open-end spinning machine and method of coating |
| 12/08/2005 | DE10011455B4 Verfahren zum Aufbringen von metallischen Leiterbahnen als Elektroden auf eine Kanalplatte aus Glas für großflächige Flachbildschirme A method of applying metallic interconnects as electrodes on a channel plate glass for large flat panel displays |
| 12/07/2005 | EP1602750A1 SURFACE-TREATED Al SHEET EXCELLENT IN SOLDERABILITY, HEAT SINK USING THE SAME, AND METHOD FOR PRODUCING SURFACE-TREATED Al SHEET EXCELLENT IN SOLDERABILITY |
| 12/07/2005 | EP1602636A2 Precursor composition, method for manufacturing precursor composition, method for manufacturing ferroelectric film, piezoelectric element, semiconductor device, piezoelectric actuator, ink jet recording head, and ink jet printer |
| 12/07/2005 | EP1602128A2 Surface-coating method, production of microelectronic interconnections using said method and integrated circuits |
| 12/07/2005 | EP1602127A2 Plating apparatus |
| 12/07/2005 | EP1601924A2 Nodular nickel boron coating |
| 12/07/2005 | CN1704502A A method for preparing silver plated copper powder |
| 12/06/2005 | US6972256 Method and apparatus for forming thin film of metal |
| 12/01/2005 | WO2005114707A2 Materials suitable for shallow trench isolation |
| 12/01/2005 | WO2005113861A1 Anode for oxygen evolution |
| 12/01/2005 | WO2005113650A1 Particle with rough surface for plating or vapor deposition |
| 12/01/2005 | WO2005079126A3 Metal deposition |
| 12/01/2005 | US20050266686 Method of substrate surface treatment for RRAM thin film deposition |
| 12/01/2005 | US20050266673 Reduced electromigration and stressed induced migration of copper wires by surface coating |
| 12/01/2005 | US20050266352 Metallic pattern forming method and conductive pattern material |
| 12/01/2005 | US20050266265 Multiple stage electroless deposition of a metal layer |
| 12/01/2005 | US20050266255 Conductive film forming method and conductive material |
| 12/01/2005 | US20050263401 Method and apparatus for plating substrates |
| 12/01/2005 | US20050263066 Apparatus for electroless deposition of metals onto semiconductor substrates |
| 11/30/2005 | EP1601006A2 An apparatus and a method for processing a fluid meniscus |
| 11/30/2005 | EP1600529A2 Method and apparatus for applying a voltage to one or more substrates during plating |
| 11/30/2005 | EP1600528A2 Method for the metallisation of plastic surfaces |
| 11/30/2005 | CN1703541A Measurement of the concentration of a reducing agent in an electroless plating bath |
| 11/30/2005 | CN1703535A Aqueous alkaline zincate solutions and methods |
| 11/30/2005 | CN1703534A Pretreatment method for electroless plating material and method for producing member having plated coating |
| 11/30/2005 | CN1703286A Nanostructured and nanoporous film compositions, structures, and methods for making the same |
| 11/30/2005 | CN1702195A Method for compound chemical plating of nickel-phosphorus-carbon-oxygen alloy |
| 11/30/2005 | CN1702194A Preparation method for discoloration tolerant antibacterial material of silver-loaded titanium phosphate |
| 11/29/2005 | US6968755 Lightweight bearing and wave gear drive |
| 11/24/2005 | WO2005112090A2 Adhesion of a metal layer to a substrate and related structures |
| 11/24/2005 | WO2005111274A2 Selective catalytic activation of non-conductive substrates |
| 11/24/2005 | US20050260846 Substrate processing method, semiconductor device production method, and semiconductor device |
| 11/24/2005 | US20050260420 Low dielectric materials and methods for making same |
| 11/24/2005 | US20050260350 Forming a conductor circuit on a substrate |
| 11/24/2005 | US20050260345 Apparatus for electroless deposition of metals onto semiconductor substrates |
| 11/24/2005 | US20050260339 Multiple stage electroless deposition of a metal layer |
| 11/24/2005 | US20050259509 Kinetic shear mixer and method |
| 11/24/2005 | US20050258134 by using a silver colloidal catalyst solution produced through reduction by a metal ion in place of palladium as a catalyst for initiating copper electroless plating, a circuit can be formed at a low cost without use of complicated steps |
| 11/24/2005 | DE102004021260A1 System und Verfahren für eine erhöhte Badlebensdauer in einem Einzelbadplattierungsverfahren System and method for enhanced bath life in a Einzelbadplattierungsverfahren |
| 11/23/2005 | EP1597410A1 Fabrication method and apparatus |
| 11/23/2005 | CN1701135A Catalyst precursor composition for electroless plating, and preparation method of transparent electromagnetic interference shielding material using the same |
| 11/23/2005 | CN1228469C Coating material for forming titanium oxide film, method for forming titanium oxide film and use of said coating material |
| 11/23/2005 | CN1228467C Ni-P-base composite coating contg. silicon carbide and PTFE |
| 11/22/2005 | US6967163 Metal film and manufacturing method therefor, and laminated ceramic electronic component and manufacturing method therefor |
| 11/22/2005 | US6966133 Iron and sole plate for an iron |
| 11/17/2005 | US20050255636 Microtools for package substrate patterning |
| 11/17/2005 | US20050252684 Electroless copper plating machine thereof, and multi-layer printed wiring board |
| 11/17/2005 | DE102004021747A1 Strip conductor structure used in the production of circuit boards comprises a metal layer arranged on metal cores produced by breaking up electrically non-conducting metal compounds by electromagnetic radiation |
| 11/16/2005 | EP1596191A1 Solid electrolytic gas sensing element comprising active electrode |
| 11/16/2005 | EP1112392B1 Method for printing a catalyst on substrates for electroless deposition |
| 11/16/2005 | CN1697781A Silane polymer and method for forming silicon film |
| 11/16/2005 | CN1227387C Process for making nickel coated iron belt and dedicated nickel plating apparatus therefor |
| 11/16/2005 | CN1227386C Electroless copper plating of ferrous metal substrates |
| 11/15/2005 | US6965045 Organic metal precursor for use in forming metal containing patterned films |
| 11/15/2005 | CA2292370C Improved coating and method for minimizing consumption of base material during high temperature service |
| 11/10/2005 | WO2005106073A1 Method for electroless plating aluminum surface and catalyst for electroless plating |