| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 05/24/2005 | US6895992 A coating film plated with Ni P or a Ni P based material is formed on a fuel pump in an inter-cylinder direct fuel injection with a pump body made of aluminum or its alloy thus can suppress corrosion due to alcohol/other compounds in fuel |
| 05/19/2005 | WO2005045906A1 System and method for electroless surface conditioning |
| 05/19/2005 | WO2005045144A2 Water-conducting body comprising a coating of a glass-like composite matrix |
| 05/19/2005 | WO2005045095A2 The formation of layers on substrates |
| 05/19/2005 | WO2005044451A1 Electrical connection of components |
| 05/19/2005 | WO2004113253A3 Method of preparing layers of oxides of metallic elements |
| 05/19/2005 | US20050106370 Formation method of metal layer on resin layer, printed wiring board, and production method thereof |
| 05/19/2005 | US20050106315 Method for repairing components using environmental bond coatings and resultant repaired components |
| 05/19/2005 | US20050106212 Using electrochemical mixture of metal compound and bioactive material; contacting substrate |
| 05/19/2005 | CA2543661A1 Spray-on paint protection film and method of applying same |
| 05/18/2005 | EP1357989A4 Process for degassing an aqueous plating solution |
| 05/18/2005 | CN1618123A Lanthanide series layered superlattice materials for integrated circuit applications |
| 05/18/2005 | CN1617651A Formation method of metal layer on resin layer, printed wiring board, and production method thereof |
| 05/18/2005 | CN1617310A Spin-on glass composition and method of forming silicon oxide layer in semiconductor manufacturing process using the same |
| 05/18/2005 | CN1202697C Method for filling through hole |
| 05/17/2005 | US6893959 Method to form selective cap layers on metal features with narrow spaces |
| 05/17/2005 | US6893737 Low cost aluminide process for moderate temperature applications |
| 05/17/2005 | US6893681 Surface conductive resin, a coaxial cable, a wiring board, and process for manufacturing the same |
| 05/17/2005 | US6893548 Method of conditioning electrochemical baths in plating technology |
| 05/17/2005 | US6892667 Continuous plating method of filament bundle and apparatus therefor |
| 05/12/2005 | WO2004101854A3 Aqueous alkaline zincate solutions and methods |
| 05/12/2005 | WO2001096632A3 A method and apparatus for conditioning electrochemical baths in plating technology |
| 05/12/2005 | US20050101133 Method for making negative thermal expansion material zirconium tungstate |
| 05/12/2005 | US20050101130 Method and tool of chemical doping CoW alloys with Re for increasing barrier properties of electroless capping layers for IC Cu interconnects |
| 05/12/2005 | US20050100779 Three dimensional polymeric fuel cell components |
| 05/12/2005 | US20050100759 Ferroelectric thin film formation composition, ferroelectric thin film and method of fabricating ferroelectric thin film |
| 05/12/2005 | US20050098099 Patterning apparatus and film patterning method |
| 05/12/2005 | US20050098061 contains a deposition promoter selected from copper compound, thallium compound, and lead compound; pH of 3 to 7.5; complexing agent as stabilizer suppresses the precipitation of copper ions; deposit on semiconductor, high speed |
| 05/12/2005 | US20050097735 Process for forming metal layers |
| 05/12/2005 | DE10240350B4 Vorrichtung und Verfahren zum Regenerieren eines stromlosen Metallabscheidebades Apparatus and method for regenerating an electroless metal plating bath |
| 05/11/2005 | CN1614088A Chemical nickeling phosphorus alloy plating liquid and coating process thereof |
| 05/11/2005 | CN1614087A Chemical nickeling solution, method for preparing nickeling layer and aluminium alloy hub coating thereof |
| 05/10/2005 | US6890640 Patterned hydrophilic-oleophilic metal oxide coating and method of forming |
| 05/10/2005 | US6890605 Method of film formation, insulating film, and substrate for semiconductor |
| 05/06/2005 | WO2005040461A1 Method and system for selectively coating metal surfaces |
| 05/06/2005 | WO2005040447A2 Thin metal oxide film and method of making the same especially for fuel cells |
| 05/06/2005 | WO2005039814A2 Laser processing for heat-sensitive mesoscale deposition |
| 05/06/2005 | WO2005007929A3 Resin substrate having a resin-metal composite layer and method for manufacturing thereof |
| 05/05/2005 | US20050095866 Method for forming patterned conductive film, electrooptical device, and electronic appliance |
| 05/05/2005 | US20050095855 Compositions and methods for the electroless deposition of NiFe on a work piece |
| 05/05/2005 | US20050095830 Selective self-initiating electroless capping of copper with cobalt-containing alloys |
| 05/05/2005 | US20050095480 Oxidation of metal compound forming oxides for fuel cells |
| 05/05/2005 | US20050095361 Material for forming insulation film and film-forming method with the use of the material |
| 05/05/2005 | US20050092431 Chemical processing method, and method of manufacturing semiconductor device |
| 05/04/2005 | CN1611446A Process for preparing silica or silica-based thickvitreous films according to the sol-gel technique and thick films thereby obtained |
| 05/04/2005 | CN1200136C Electroplating method and the used liquid precursor |
| 05/04/2005 | CN1199749C Method of preparing foaming agent using oxide to cover titanium hydride |
| 05/03/2005 | US6887367 Chemical activation of the passivated surface using a solution containing surfactants and/or chemical activation by reduction with a reducing agent or direct current and/or physical activation; coating sol and formation of gel |
| 04/28/2005 | WO2005038891A1 Composition for forming silicon-cobalt film, silicon-cobalt film and method for forming same |
| 04/28/2005 | WO2005038094A2 Apparatus for electroless deposition |
| 04/28/2005 | WO2005038088A1 Electroless copper plating liquid and method for manufacturing wiring board using same |
| 04/28/2005 | WO2005038087A1 Electroless copper plating solution and method for electroless copper plating |
| 04/28/2005 | WO2005038086A1 Plating solution for electroless copper plating |
| 04/28/2005 | WO2005038085A2 Selective self-initiating electroless capping of copper with cobalt-containing alloys |
| 04/28/2005 | WO2005038084A2 Selective self-initiating electroless capping of copper with cobalt-containing alloys |
| 04/28/2005 | WO2005038083A1 Method for treating ferrous alloy pieces by sulphidisation |
| 04/28/2005 | WO2005038082A2 Method for obtaining a composite ferro-electric material |
| 04/28/2005 | WO2005037418A2 Processes for fabricating conductive patterns using nanolithography as a patterning tool |
| 04/28/2005 | WO2005003033A3 Aluminum phosphate coatings |
| 04/28/2005 | WO2004099466B1 Method for electroless deposition of phosphorus-containing metal films onto copper with palladium-free activation |
| 04/28/2005 | WO2004003663A3 Apparatus and method for treating a substrate electrochemically while reducing metal corrosion |
| 04/28/2005 | WO2002004704A3 Method and apparatus for patching electrochemically deposited layers using electroless deposited materials |
| 04/28/2005 | US20050089639 Filament bundle is rewound from a reel, and passes through liquids in processing vessels for plating; use of a fixed guide roller and a movable guide roller to stretch and slacken the bundle by turns so that liquid is easily exchanged between the inside and outside; end use as electromagnetic shield |
| 04/28/2005 | US20050088647 Apparatus and method of detecting the electroless deposition endpoint |
| 04/28/2005 | CA2540625A1 Method for treating ferrous alloy pieces by sulphidisation |
| 04/27/2005 | EP1525338A2 Substrates comprising a photocatalytic tio sb 2 /sb layer |
| 04/27/2005 | EP1525247A2 Complexing agent for treating metallic and plastic surfaces |
| 04/27/2005 | CN1610132A Electro-active device having metal-containing layer |
| 04/27/2005 | CN1610091A Semiconductor multi-layer wiring plate and forming method thereof |
| 04/27/2005 | CN1609271A Nickel phosphorus chemical plating method and chemical plating solution thereof |
| 04/27/2005 | CN1609044A Ferroelectric thin film formation composition, ferroelectric thin film, and method of fabricating thin film |
| 04/27/2005 | CN1198960C Non metallic disk substrate and method for plating the same substrate |
| 04/26/2005 | US6884587 Metallization of nucleic acids via metal nanoparticles produced ex-situ |
| 04/26/2005 | US6884465 Vapor depositing a dielectric film on a substrate by an atomic layer deposition comprising alternately providing a gaseous metal compound and an oxygen source other than water to the reaction chamber at a temperature <190 degrees C. |
| 04/21/2005 | WO2005036615A2 Apparatus to improve wafer temperature uniformity for face-up wet processing |
| 04/21/2005 | WO2005035827A1 Method for metallizing a component comprising parts of different non-metallic materials |
| 04/21/2005 | WO2005014881A3 Production method of substrate with black film and substrate with black film |
| 04/21/2005 | US20050085031 Heterogeneous activation layers formed by ionic and electroless reactions used for IC interconnect capping layers |
| 04/21/2005 | US20050084689 organometallic compounds containing a hydrazine compound complexed with metals, that can be thermally decomposed at low temperatures and converted into metals or metal oxides, on substrates; impressions having high durability and conductivity |
| 04/21/2005 | US20050084661 immersion of conductors in lead-free liquid containing metals, group 1B and acyclic oxy acid and salts, then precipitating the metals on the surfaces and coating in electroless plating solutions; supports for semiconductors, capacitors or resistors |
| 04/21/2005 | US20050084615 monitoring the characteristics of processing fluids using detectors and external controllers |
| 04/21/2005 | US20050084609 electroless deposition of metals on surfaces of automobile combustion chambers using solutions formed from nickel, phosphorus and boron |
| 04/21/2005 | US20050082678 Method to form selective cap layers on metal features with narrow spaces |
| 04/21/2005 | US20050081907 Electro-active device having metal-containing layer |
| 04/21/2005 | US20050081785 Apparatus for electroless deposition |
| 04/20/2005 | EP1524331A1 Method for metallizing a component comprising parts of different non-metallic materials |
| 04/20/2005 | CN1608143A Photolytic conversion process to form patterned amorphous film |
| 04/20/2005 | CN1197994C Chemical nickel plating solution of aluminium based chassis |
| 04/20/2005 | CN1197993C Mfg. method of electronic part and the electronic part, electroless coating method |
| 04/20/2005 | CN1197499C Slide fastener |
| 04/14/2005 | WO2005034597A1 Pad structure of wiring board and wiring board |
| 04/14/2005 | WO2005033376A2 Plating method and apparatus |
| 04/14/2005 | WO2005033351A2 Protection of metallic surfaces against thermally-induced wrinkling (rumpling) in particular in gas turbines |
| 04/14/2005 | US20050079280 Electroless copper plating solution, electroless copper plating process and production process of circuit board |
| 04/13/2005 | EP1522609A2 Conductive sheet having a metal layer on at least one portion of an insulating substrate, product using the same, and manufacturing method thereof |
| 04/13/2005 | EP1522526A1 Apparatus and method for electrolytically treating chemical plating waste liquor |
| 04/13/2005 | EP1521862A1 Immersion plating of silver |
| 04/13/2005 | EP1214739A4 Copper deposit process |
| 04/13/2005 | CN1606400A Conductive sheet, product using the same, and manufacturing method thereof |
| 04/13/2005 | CN1197443C Assembly of an electronic component with spring packaging |