Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
06/2005
06/23/2005CA2547815A1 Silver coatings and methods of manufacture
06/22/2005CN1630735A Method for the deposition of materials from mesomorphous films
06/22/2005CN1630458A Method for forming plain conductor pattern by means of ink-jet
06/22/2005CN1629355A Process for chemically electroplating bronze resin handicraft articles
06/22/2005CN1629354A Method for pretreating non-magnetic substrate and magnetic recording medium
06/22/2005CN1207436C Method for mfg. Cu/Ti3SiC2 composite material by chemical copper plating
06/21/2005US6908512 Temperature-controlled substrate holder for processing in fluids
06/21/2005US6908504 Electroless plating bath composition and method of using
06/21/2005CA2205189C Method of manufacturing bi-layered ferroelectric thin film
06/16/2005WO2005054134A1 Method for producing composition for forming dielectric film, composition for forming dielectric film, dielectric film and method for producing same
06/16/2005WO2005033351A3 Protection of metallic surfaces against thermally-induced wrinkling (rumpling) in particular in gas turbines
06/16/2005US20050130415 Method and apparatus for material deposition
06/16/2005US20050130397 Formation of layers on substrates
06/16/2005US20050129927 Transparent thin film and method for production thereof
06/16/2005US20050129383 Laser processing for heat-sensitive mesoscale deposition
06/16/2005US20050128675 Heterolayered ferroelectric thin films and methods of forming same
06/16/2005US20050127332 Metal paste and film formation method using the same
06/16/2005US20050126932 Method and apparatus for semiconductor wafer planarization
06/16/2005US20050126477 Color code identification of powder filters
06/16/2005US20050126427 Reaction product of an amino-containing polymer, a phenol or quinone or derivatives, an aldehyde; water or another solvent for dissolving, dispersing, suspending or emulsifying the polymer; deposition of metal or alloys on the plastic surface; corrosion resistance
06/16/2005DE10351902A1 Wasserleitender Körper Executive body of water
06/15/2005EP1542239A1 Metal paste and film formation method using the same
06/15/2005EP1541714A1 Method for repairing components using environmental bond coatings and resultant repaired components
06/15/2005EP1541710A2 Method for coating tubes
06/15/2005EP1540990A1 Method for preparing highly loaded, highly dispersed platinum metal on a carbon substrate
06/15/2005EP1540046A1 Method and apparatus for real time monitoring of industrial electrolytes
06/15/2005EP1540044A2 Apparatus and method for treating a substrate electrochemically while reducing metal corrosion
06/15/2005EP1539410A1 Coated metallurgical particles
06/15/2005EP1539371A1 Apparatus and method for thermally controlled processing of microelectronic workpieces
06/15/2005CN1206064C Silver-plated copper powder and its prepn process
06/14/2005US6906114 Mixture of silver and silver chloride powder in acrylic ester polymer
06/14/2005US6905622 Electroless deposition method
06/14/2005US6905587 Method for enhancing the solderability of a surface
06/09/2005WO2005053368A1 Metal pattern forming method, metal pattern obtained by the same, printed wiring board, conductive film forming method, and conductive film obtained by the same
06/09/2005WO2005036615A3 Apparatus to improve wafer temperature uniformity for face-up wet processing
06/09/2005US20050124158 Silver under-layers for electroless cobalt alloys
06/09/2005US20050123621 Silver coatings and methods of manufacture
06/09/2005US20050121327 Electroless-plated deposit process for silicon based dielectric insulating material
06/09/2005US20050121317 Chambers, systems, and methods for electrochemically processing microfeature workpieces
06/09/2005US20050121114 Protective coating comprising a phenolic resin having triazine, urea and/or amine groups for metal or alloys having been deposition plastics surfaces; corrosion resistance; also including water or solvent, a surfactant, acids and metal compounds;printed circuits; used in pickling and passivation
06/09/2005US20050120550 Method for forming metal wires by microdispensing pattern
06/09/2005DE102004052411A1 Production of a film based on silicon dioxide used in the production of a semiconductor device comprises applying a coating solution on a substrate to form a film and drying, heat treating, etching, and further heat treating
06/08/2005EP1538237A1 Method for metal plating and pre-treating agent
06/08/2005CN1624207A Apparatus and method for plating a substrate, and method and apparatus for electrolytic treatment
06/08/2005CN1205354C Method and device for electrodialytic regeneration of electroless metal deposition bath
06/07/2005US6902765 Method for electroless metal plating
06/07/2005US6902605 Reducing ions of cobalt ion source with a reducing agent for initiating deposition of a first layer and another reducing agent for continuing deposition
06/07/2005US6901687 Domestic appliance and method of manufacturing thereof
06/02/2005WO2005049887A2 Methods for the deposition of silver oxide films and patterned films
06/02/2005WO2005033376A3 Plating method and apparatus
06/02/2005WO2004095603A3 Method of producing membrane electrode assemblies
06/02/2005US20050118436 Method for electroless deposition of a metal layer on selected portions of a substrate
06/02/2005US20050118342 Growth of nanotubes for integrated circuits from redox systems by vapor deposition
06/02/2005DE3913966B4 Klebstoffdispersion zum stromlosen Plattieren, sowie Verwendung zur Herstellung einer gedruckten Schaltung Dispersion adhesive for electroless plating, as well as use for the preparation of a printed circuit
06/02/2005DE202004020372U1 Gegenstand Subject
06/02/2005DE10345379B3 Vorratstank für Prozessflüssigkeiten mit einer reduzierten Menge an Blasen und Verfahren zum Betreiben desselben Of the same storage tank for process liquids with a reduced amount of bubbles and method for operating
06/01/2005EP1536665A1 Member for electric equipment, member for electroacoustic transducer and method for manufacture thereof
06/01/2005EP1536036A2 Thin film forming apparatus
06/01/2005EP0927776B1 Sliding member, method of treating surface of the sliding member and rotary compressor vane
06/01/2005CN1623011A Gate bush producing method by electroforming
06/01/2005CN1623009A Method of electroless plating and semiconductor wafer having metal plating layer formed thereon
06/01/2005CN1622283A Method for preparing composite oxide semiconductor nano material
06/01/2005CN1622225A Material for forming insulation film and film-forming method with the use of the material
06/01/2005CN1621562A Process for preparing corrosion resistant coating of oil pipe composite materials
06/01/2005CN1621561A Preparation process for coating gold by the aid of microwave
06/01/2005CN1621560A Process for preparing high temperature superconducting thin film by deposition of metal organic
06/01/2005CN1204291C Microporous copper film and electroless copper plating solution for obtaining the same
06/01/2005CN1204290C Bath for coating bright and high anticorrosion alloy layer on metal surface
05/2005
05/31/2005US6900394 Electroless copper plating machine, and multi-layer printed wiring board
05/31/2005US6899920 Abrasive particles embedded in metal matrix
05/31/2005US6899816 Electroless deposition method
05/31/2005US6899802 Method for recycling of plating solutions
05/26/2005WO2005048275A2 COMPOSITIONS AND METHODS FOR THE ELECTROLESS DEPOSITION OF NiFe ON A WORK PIECE
05/26/2005WO2005047213A2 Oxidation inhibition of carbon-carbon composites
05/26/2005WO2004081261A3 Plating apparatus
05/26/2005US20050112810 Method for manufacturing conductive pattern forming body
05/26/2005US20050112432 Method of plating metal leafs and metal membranes
05/26/2005US20050112413 Titanium oxide coated polypropylene film layer; solution of aqueous peroxo titanic acid, ammonia, epoxy resins, applied, dried
05/26/2005US20050112399 Erosion resistant coatings and methods thereof
05/26/2005US20050110149 Semiconductor multilayer wiring board and method of forming the same
05/26/2005US20050109609 Filling support with palladium by electroless plating
05/26/2005US20050108878 Method of manufacturing bearing device, bearing device, motor and recording disk driving apparatus
05/25/2005EP1533855A1 Thin film transistor, method for its manufacture, and circuit or electronic device/apparatus comprising it
05/25/2005EP1533397A2 Process of depositing mat metallic layers free of nickel and chromium(VI)
05/25/2005EP1532668A1 Substrate processing apparatus and substrate processing method
05/25/2005EP1532295A1 Device and method for regenerating an electroless metal plating bath
05/25/2005EP1532294A2 Method for producing a foam metallic structure, metallic foam, and arrangement consisting of a carrier substrate and metallic foam
05/25/2005EP1532293A1 Method to improve adhesion of primers to substrates
05/25/2005DE10348734A1 Verfahren und System zum selektiven Beschichten von Metalloberflächen Method and system for selective coating of metal surfaces
05/25/2005DE10324910B4 Metallisches Halbzeug mit elektrisch isolierender Beschichtung sowie Verfahren zur Herstellung einer elektrisch isolierenden Beschichtung Metallic semi-finished product with an electrically insulating coating and processes for producing an electrically insulating coating
05/25/2005CN1620523A Polymer derivatives for treating metals
05/25/2005CN1620485A Polymer derivatives for the treatment of metals
05/25/2005CN1619856A Thin film transistor, method for its manufacture, and circuit or electronic device/apparatus comprising it
05/25/2005CN1619174A Method of manufacturing bearing device, bearing device, motor and recording disk driving apparatus
05/25/2005CN1619012A Process of depositing mat metallic layers free of nickel and chromium(VI)
05/25/2005CN1618594A Forming article, forming method, forming device and surface treating method for formed article
05/25/2005CN1203535C Spin coating glass composition and method for forming silica layer in production of semiconductor
05/25/2005CN1203211C Bright nickel plating process for ferrite audio frequency magnetic head
05/24/2005US6897152 Copper bath composition for electroless and/or electrolytic filling of vias and trenches for integrated circuit fabrication
05/24/2005US6897151 Methods of filling a feature on a substrate with copper nanocrystals
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