Patents for B81B 7 - Micro-structural systems (8,983)
07/2013
07/04/2013US20130168784 Semiconductor package and fabrication method thereof
07/04/2013US20130168675 Detection and Mitigation of Particle Contaminants in MEMS Devices
07/04/2013US20130168250 Droplet Actuator Systems, Devices and Methods
07/04/2013DE102012223979A1 Schaltbare Filter und Entwurfsstrukturen Switchable filter and design structures
07/04/2013DE102012223968A1 Strukturen mit mikroelektromechanischem System (MEMS) und Design-Strukturen Structures with micro-electro-mechanical system (MEMS) structures and design
07/03/2013CN203033761U Vacuum encapsulating device of optical readout non-refrigerating infrared focal plane array
07/03/2013CN203031601U Multi-finger micro-gripper
07/03/2013CN103184886A Measuring component of MEMS (Micro-electromechanical Systems) technology-based gas alarm and preparation method of measuring component
07/03/2013CN103183305A Comb electrode structure
07/03/2013CN102015522B Integrated carrier for microfluidic device
06/2013
06/27/2013WO2013096643A1 Methods and apparatuses for droplet mixing
06/27/2013WO2013091112A1 Connection method for mems navigation unit for computer-assisted surgery
06/27/2013US20130164508 Artificial microstructure and artificial electromagnetic material using the same
06/27/2013DE102011089897A1 Sensorsystem Sensor system
06/27/2013DE102011089813A1 Frequenzgeberanordnung Frequency transmitter arrangement
06/27/2013DE102011089752A1 Verfahren zur Herstellung von Silizium-Mikronadelarrays mit Löchern und Mikronadelarray Process for the preparation of silicon microneedle arrays with holes and microneedle array
06/27/2013DE102011057032A1 Mikro-Gyroskop und Verfahren zum Betreiben eines Mikro-Gyroskops Micro-gyroscope and method for operating a micro-gyroscope
06/27/2013DE102011056971A1 Mikromechanischer Coriolis-Drehratensensor Micromechanical Coriolis rotation rate sensor
06/26/2013CN203021289U Hermetic sealing assembly
06/26/2013CN103180689A Non-contact sensing system having mems-based light source
06/26/2013CN103175982A Micromechanical coriolis rate of rotation sensor
06/26/2013CN103172014A Packaging structure of thermo-electric pile detector and signal processing circuit
06/20/2013WO2013090887A1 Motion sensor integrated nano-probe n/mems apparatus, method and applications
06/20/2013DE102012223550A1 Mikromechanisches Halbleitererfassungsbauelement The micromechanical semiconductor detection device
06/20/2013DE102012223303A1 Abstimmen eines MEMS-Oszillators Tuning a MEMS oscillator
06/20/2013DE102012221818A1 Strukturen und entwurfsstrukturen mikroelektromechanischer systeme (mems) Structures and structures design of microelectromechanical systems (mems)
06/20/2013DE102012221815A1 Kondensatoreinheiten mit mikroelektromechanischer struktur (mems), kondensatortrimmung dieser und design-strukturen Capacitor units with micro-electro-mechanical structure (mems), this kondensatortrimmung and design structures
06/20/2013DE102007027652B4 Betriebsverfahren und Schaltungsanordnung für einen kapazitiven mikromechanischen Sensor mit analoger Rückstellung Operating Method and circuit arrangement for a capacitive micromechanical sensor with analogue provision
06/19/2013CN203011612U Machine oil MEMS pressure sensor based on adapter piece fixing structure
06/19/2013CN203006936U Packaging structure of sensor chip with exposed front
06/19/2013CN203006935U Packaging structure of sensor chip with downwards exposed front
06/19/2013CN203006934U Wafer level packaging structure of integrated micro-electromechanical system (MEMS) sensors
06/19/2013CN1775656B Interconnection of high-density nano structure
06/19/2013CN103159161A Two-dimension tilt angle sensor
06/18/2013CA2663392C Integrated mems packaging
06/18/2013CA2485153C Bi-directional actuator utilizing both attractive and repulsive electrostatic forces
06/13/2013WO2013086106A1 Mems chip scale package
06/13/2013US20130146994 Method for manufacturing a hermetically sealed structure
06/13/2013DE102011088331A1 Micromechanical structure, particularly micromechanical sensor structure, has substrate, movable mass and spring element, where substrate has main extension plane, and movable mass is fastened to substrate by spring element
06/12/2013EP2601131A1 Microscale or nanoscale magnetic tweezers and process for fabricating such tweezers
06/12/2013CN202988704U Micro-electro-mechanical system (MEMS) packaging structure capable of being measured optically and utilizing sealing cap electrode
06/12/2013CN202988703U Micro-electromechanical system device
06/12/2013CN103149684A Two-way twistable staggered-comb teeth electrostatic driving variable optical attenuator and manufacture method thereof
06/12/2013CN103149683A One-direction torsion and high-balance variable optical attenuator and preparation method thereof
06/12/2013CN103149176A Multichannel refractive index sensor with integration of chirp two-dimensional photonic crystal waveguide and micro-flow channel
06/12/2013CN103148947A Wafer-level packaging structure for improving response rate of thermopile infrared detector
06/12/2013CN103145088A MEMS (micro-electromechanical system) chip and wafer level encapsulation cover plate grounding method of MEMS chip
06/12/2013CN102297737B Pressure sensor cavity structure and manufacturing method thereof
06/12/2013CN101644605B Thermopile sensor and method of manufacturing same
06/12/2013CN101414701B Microelectron mechanical socle beam type microwave power coupler and preparation method thereof
06/06/2013WO2013081842A2 Encapsulated arrays of electromechanical systems devices
06/06/2013WO2013079131A1 Method for producing structured optical components
06/06/2013US20130140716 Microelectronic assembly with impedance controlled wirebond and reference wirebond
06/06/2013US20130140678 Insulator layer based mems devices
06/06/2013US20130140656 MEMS Microphone And Method For Producing The MEMS Microphone
06/06/2013DE102008037947B4 Verfahren zum Herstellen eines Element-Wafer und eines Elements A method of manufacturing a wafer-element and an element
06/06/2013DE102007028288B4 Mit akustischen Wellen arbeitendes MEMS Bauelement und Verfahren zur Herstellung With acoustic waves working MEMS device and methods for preparing
06/05/2013EP2599333A1 Reduced footprint microphone system with spacer member having through-hole
06/05/2013CN202974174U Three-dimensional micro-contact-type measuring head based on capacitive sensor array
06/05/2013CN103130176A Micromechanical functional apparatus, particularly a loudspeaker apparatus, and appropriate method of manufacture
06/05/2013CN103130175A MEMS chip package and method for manufacturing an MEMS chip package
06/05/2013CN103130174A MEMS devices and methods for forming the same
06/05/2013CN103130173A Leadframe array, packaging structure and island-free leadframe for micro-electromechanical system (MEMS) chip packaging,
06/05/2013CN102101635B Mass body applicable to micro-electromechanical sensor and three-axis micro-electromechanical sensor using same
06/05/2013CN101282594B Encapsulation structure for Micro-electromechanical microphone with two-sided mounting-pasted electrode
06/04/2013USRE44255 Support for microelectronic, microoptoelectronic or micromechanical devices
06/04/2013US8454811 Microfluidic system
05/2013
05/30/2013WO2013075870A1 Chip with a micro-electromechanical structure and covering element, and a method for the production of same
05/30/2013US20130134604 Method for creating and packaging three dimensional stacks of biochips containing microelectro-mechanical systems
05/29/2013DE102012022829A1 Verfahren zum Herstellen von isolierten Halbleiterstrukturen A method for producing isolated semiconductor structures
05/29/2013DE102011120660A1 Micro-mirror arrangement for wafer arrangement for e.g. laser projection, has static deflecting mirror for optical coupling of micro-mirrors, where deflecting mirror is bent regarding plane given by surface of substrate wafer
05/29/2013DE102011119610A1 Verfahren zur Herstellung strukturierter optischer Komponenten A process for the production of structured optical components
05/29/2013DE102004010907B4 Optische Vorrichtung mit Mikrolinsen-Anordnung, sowie Verfahren zu ihrer Herstellung An optical device with micro lens array, and to processes for their preparation
05/29/2013CN101903752B MEMS structure for flow sensor
05/28/2013USRE44246 Method for containing a device and a corresponding device
05/23/2013WO2013074540A1 Glass-encapsulated pressure sensor
05/23/2013DE102012215235A1 Sensor component has micro-electro mechanical system (MEMS) component that is integrated with pressure sensor, temperature sensor, humidity sensor and evaluation circuit
05/23/2013DE102011086856A1 Mikrofluidische Membranventilvorrichtung und entsprechendes Herstellungsverfahren Microfluidic diaphragm valve device and corresponding manufacturing method
05/23/2013DE102011086765A1 Chip mit mikro-elektromechanischer Struktur und Verfahren zum Herstellen eines Chips mit mikro-elektromechanischer Struktur Chip with micro-electro-mechanical structure and method of manufacturing a chip with micro-electro-mechanical structure
05/23/2013DE102011086764A1 MEMS-Chippackage und Verfahren zum Herstellen eines MEMS-Chippackages MEMS chip package and method for manufacturing a MEMS chip packages
05/23/2013DE102011086722A1 Mikromechanische Funktionsvorrichtung, insbesondere Lautsprechervorrichtung, und entsprechendes Herstellungsverfahren Micromechanical device function, particularly the speaker apparatus, and corresponding method of production
05/23/2013DE102011055562A1 Microsystem component e.g. pressure sensor component has electrical terminal surface that is arranged in specific region of indentation portion so as to electrically connect with functional element covered by covering portion
05/22/2013CN103116071A Micro-electromechanical microwave frequency and power detecting system and detecting method thereof
05/22/2013CN103112817A Tower-type pier of uncooled infrared detector and manufacture method thereof
05/22/2013CN102180439B Carbon microstructure with graphene integrated on surface and preparation method thereof
05/22/2013CN101920928B Composite micromechanical part and method for manufacturing same
05/16/2013WO2013070283A1 Apparatus and method for measuring phase behavior
05/16/2013WO2013070013A1 Mems sensor packaging and method thereof
05/16/2013US20130119492 Miniaturized Electrical Component Comprising an MEMS and an ASIC and Production Method
05/16/2013DE102011086345A1 Spiegel Mirror
05/16/2013DE102008062499B4 MEMS-Bauelemente und Verfahren zur Herstellung derselben MEMS devices and methods for manufacturing the same
05/16/2013CA2854758A1 Apparatus and method for measuring phase behavior
05/15/2013CN103107165A Semiconductor packaging structure provided with seal ring and micro electro mechanical system device
05/15/2013CN103105531A Micro electro-mechanical online microwave frequency detector and detecting method thereof
05/15/2013CN103101875A Semiconductor package and method of fabricating the same
05/15/2013CN102175305B Single chip integrated trivector vibration sensor
05/10/2013WO2013064978A1 Micro -electro -mechanical device with buried conductive regions, and manufacturing process thereof
05/10/2013WO2013064634A2 Micromechanical element, component having a micromechanical element, and method for producing a component
05/10/2013WO2013029177A8 Monolithic package for housing microelectromechanical systems
05/08/2013DE102011085727A1 Mikromechanisches Element, Bauelement mit einem mikromechanischen Element und Verfahren zum Herstellen eines Bauelements Micromechanical element, component with a micro-mechanical element and method for manufacturing a device
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